未登录Inhibiting Intermetallic Compound Growth at the Cu/Sn Interface Through the Electrochemical Deposition of Multiwalled Carbon Nanotubes on Cu通过在Cu上电化学沉积多壁碳纳米管抑制Cu/Sn界面金属间化合物生长
Kim, Kanghun; Kim, Yonghwan; An, Won Young; Chang, Yujin; Hwang, Seon Jae; Park, Jonghyock; Kang, Minkyu; Cho, Sungho; Kim, Dasom; Piao, Yuanzhe .png)
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