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P

Pradeep Dixit

Indian Institute of Technology Bombay

28H指数
116论文数
2.4K被引数
收录论文 41
发表时间
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Adhesion-Promoting Surface Modification with Zinc-Oxide and Graphene-Oxide for Direct Electroless Metallization in Through-Glass Vias
errSurfaces and Interfaces
IF6.3
err2026-01-18
err0
PREAI
errKaran Pawar; Pradeep Dixit
err分享
err收藏
Synergistic enhancement of electroless film adhesion on glass via graphene-oxide functionalization and surface roughening通过氧化石墨烯功能化和表面粗糙化协同增强玻璃上化学镀膜层的附着力
errMaterials Letters
IF2.7
err2025-07-28
err0
PREAI
errKaran Pawar; Pradeep Dixit
err分享
err收藏
Geometrical shape analysis of through-hole formation in tungsten by Electrochemical jet drilling钨电化学射流钻通过孔形成的几何形状分析
errMaterials and Manufacturing Processes
IF4.7
err2025-06-27
err0
PREAI
errRonaldo Naorem; Pradeep Dixit
err分享
err收藏
Optimization of Process Parameters in Electropolishing of SS 316L Utilizing Taguchi Robust Design利用田口稳健设计优化SS 316L电化学抛光工艺参数
errJOURNAL OF MANUFACTURING AND MATERIALS PROCESSING
IF3.3
err2025-04-11
err0
errOAAI
errSyahputra, Muhammad Kemal; Nur'Anisa', Kartika; Rahmania, Rizky Astari; Yusof, Farazila; Dixit, Pradeep; Mahardika, Muslim; Prihandana, Gunawan Setia
err分享
err收藏
Achieving high machining speed and sustainability in micro-EDM using a two-phase three component dielectric
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2025-04-01
err0
PREAI
errSingh, Ramver; Dixit, Pradeep; Dvivedi, Akshay; Kumar, Pradeep
err分享
err收藏
Fabrication of through alumina vias (TAV) by ultrasonic micromachining for advanced packaging applications
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-01-01
err1
PREAI
errPandey, Harsh; Pawar, Karan; Dixit, Pradeep
err分享
err收藏
Localized surface roughening to improve adhesion of electroless seed layer in through-glass vias
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2024-11-01
err1
PREAI
errPandey, Harsh; Pawar, Karan; Dixit, Pradeep
err分享
err收藏
Synergistic roles of steady dwell tool feeding and ultrasonic vibrations in electrochemical discharge machining of alumina
errMATERIALS AND MANUFACTURING PROCESSES
IF4.7
err2024-09-25
err3
PREAI
errShanu, Anurag; Singh, Ramver; Dixit, Pradeep
err分享
err收藏
Modelling of powder catchment efficiency in micro-plasma transferred arc metal additive manufacturing process
errPROGRESS IN ADDITIVE MANUFACTURING
IF5.4
err2024-08-12
err0
PREAI
errKumar, Pravin; Jain, Neelesh Kumar; Dixit, Pradeep
err分享
err收藏
Investigations into velocity decay, initial tool-workpiece gap, and material removal behaviour in ultrasonic micromachining
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2024-08-01
err2
PREAI
errPandey, Harsh; Apurva, Abhinav; Dixit, Pradeep
err分享
err收藏
Enhancing the borosilicate glass micromachining by using mixed alkaline electrolytes in the ECDM process通过在ECDM工艺中使用混合碱性电解质来增强硼硅酸盐玻璃的微加工
errMATERIALS AND MANUFACTURING PROCESSES
IF4.7
err2024-02-05
err4
PREAI
errDoke, Akshay; Badadhe, Avinash M.; Dixit, Pradeep
err分享
err收藏
Micromachining of alumina ceramic for microsystems applications: a systematic review, challenges and future opportunities
errMATERIALS AND MANUFACTURING PROCESSES
IF4.7
err2023-12-05
err6
PREAI
errShanu, Anurag; Sharma, Priyaranjan; Dixit, Pradeep
err分享
err收藏
Investigation on tribo-characteristics of electrochemical jet machined part manufactured by laser powder bed fusion
errTRIBOLOGY INTERNATIONAL
IF6.9
err2023-10-01
err1
PREAI
errKumar, Pravin; Chaudhary, Bhavesh; Jain, N. K.; Patel, Mahesh; Dixit, Pradeep
err分享
err收藏
Gas bubbles entrapment mechanism in the electrochemical discharge machining involving multi-tip array electrodes
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2023-08-01
err13
PREAI
errArab, Julfekar; Dixit, Pradeep
err分享
err收藏
Surface finishing of an additively manufactured part using electrochemical jet machining
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2023-06-01
err9
PREAI
errKumar, Pravin; Dixit, Pradeep; Chaudhary, Bhavesh; Jain, N. K.
err分享
err收藏
Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining
errMATERIALS AND MANUFACTURING PROCESSES
IF4.7
err2022-11-13
err3
PREAI
errMishra, Dileep Kumar; Dixit, Pradeep
err分享
err收藏
Formation of high aspect ratio through-glass vias by the combination of Ultrasonic micromachining and copper electroplating
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2022-10-01
err15
PREAI
errPandey, Harsh; Singh, Tarlochan; Dixit, Pradeep
err分享
err收藏
Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging用于微系统封装的cu-sn-cu瞬态液相键合研究
errMATERIALS AND MANUFACTURING PROCESSES
IF4.7
err2022-07-28
err10
PREAI
errPawar, Karan; Harsha, S.; Dixit, Pradeep
err分享
err收藏
Formation of macro-sized through-holes in glass using notch-shaped tubular electrodes in electrochemical discharge machining
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2022-06-01
err17
PREAI
errArab, Julfekar; Dixit, Pradeep
err分享
err收藏
Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications
errAPPLIED SURFACE SCIENCE
IF6.9
err2022-05-01
err25
errOAAI
errBajpai, Vishnu Kant; Mishra, Dileep Kumar; Dixit, Pradeep
err分享
err收藏

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