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Chih Chen

national yang ming chiao tung university

50H指数
401论文数
8.2K被引数
收录论文 148
发表时间
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High-Strength Nanotwinned Copper Combined with Silicon/Silicon Nitride/Graphite Anode for High-Performance Lithium-Ion Battery高强度纳米孪晶铜结合硅/氮化硅/石墨阳极，用于高性能锂离子电池
errMaterials
IF3.2
err2026-06-10
err0
errOAAI
errFu-Chian Chen; Rahmandhika Firdauzha Hary Hernandha; Dinh-Phuc Tran; Jeng-Kuei Chang; Chih Chen
err分享
err收藏
Ultra-high mechanical strength and high electrical conductivity nanotwinned CuPd foils超高的机械强度和高电导率纳米孪晶CuPd箔
errJournal of Materials Research and Technology
IF6.6
err2026-05-26
err0
errOAAI
errFu-Chian Chen; Dinh-Phuc Tran; Chih Chen
err分享
err收藏
errmaterials science and engineering: a
IF0
err2026-05-22
err0
PREAI
errPo-Jui Su; Kang-Ping Lee; Mai-Phuong La; Chen-Ning Li; Chih Chen
err分享
err收藏
Recent Advances in Nanostructured Copper: From Fabrication to Applications纳米结构铜的最新进展：从制备到应用
errCrystal Growth & Design
IF0
err2026-05-18
err0
errOAAI
errDinh-Phuc Tran; Kang-Ping Lee; Huai-En Lin; Yu-Wen Hung; Mai-Phuong La; Chih Chen
err分享
err收藏
Mechanisms of room-temperature SiCN pre-bonding and low-temperature post-annealing of SiCN/nanocrystalline-nanotwinned Cu hybrid joints室温SiCN预键合和低温后退火SiCN/纳米晶-纳米孪晶Cu混合接头的机理
errApplied Surface Science
IF6.9
err2026-04-02
err0
PREAI
errPin-Syuan He; Hung-Ying Chen; Yun-Wei Chiang; Cheng-Chieh Kao; Bo-Cheng Huang; Guanyu Song; Pengyi Zhang; Wei-Lan Chiu; Mu-Ping Hsu; Kuan-Neng Chen; Chang-Chun Lee; Yu-Lan Liu; Kuang-Yu Chen; Chih Chen
err分享
err收藏
Effects of plasma surface treatment and surface roughness on Cu–Cu bonding strength等离子体表面处理和表面粗糙度对Cu–Cu键合强度的影响
errJournal of Materials Research and Technology
IF6.6
err2026-02-18
err0
errOAAI
errPin-Syuan He; Chih-Hsin Tu; Mai-Phuong La; Chih Chen
err分享
err收藏
Equ-Axed Fine-Grained and Nanotwinned Cu with Ultrahigh Tensile Strength具有超高拉伸强度的Equ轴细晶粒和纳米孪晶Cu
errCrystal Growth and Design
IF3.4
err2026-01-26
err0
errOAAI
errChun-Ting Ke; Kang-Ping Lee; Dinh-Phuc Tran; Wen-Jun Chen; Da-Jeng Yao; Chih Chen
err分享
err收藏
Optimizing Cu-Cu bonding quality in nanotwinned Cu films through plasma-induced surface roughening通过等离子体诱导的表面粗糙化优化纳米孪晶Cu膜中的cu-cu键合质量
errResults in Engineering
IF7.9
err2026-01-26
err0
errOAAI
errMing-Chieh Chen; Jian-Yuan Huang; Chi-Chih Tsai; Shih-Chi Yang; Chih Chen
err分享
err收藏
Mechanistic insights into direction-modulated electromigration failures and intermetallic formation in symmetric/asymmetric SnAg solder microbumps对称/不对称SnAg焊料微凸点中方向调制电迁移失效及金属间化合物形成的机理研究
errIntermetallics
IF4.8
err2026-01-10
err0
PREAI
errDinh-Phuc Tran; Tzu-Chieh Pan; Shi-Chi Yang; Mai-Phuong La; Chih Chen
err分享
err收藏
Nanocrystalline copper for thermally efficient Cu-Cu bonding纳米晶铜用于高效热Cu-Cu键合
errJournal of the Taiwan Institute of Chemical Engineers
IF6.3
err2025-12-27
err0
PREAI
errAnkush Kumar; Chih Chen; Nilesh Badwe
err分享
err收藏
Enhanced strength and thermal stability of nanotwinned Cu-Ni-Fe foils via grain boundary and twin boundary engineering通过晶界和孪晶界工程增强纳米孪晶Cu-Ni-Fe箔的强度和热稳定性
errJournal of Alloys and Compounds
IF6.3
err2025-12-23
err0
PREAI
errKang-Ping Lee; Pin-Chia Chen; Evan Hsieh; Ming-Han Lu; Mai-Phuong La; Chun-Ting Ke; Po-Jui Su; Chih Chen
err分享
err收藏
Structure–Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures超薄铜箔的结构-性能关系：从纳米孪晶到细晶微观结构
errMaterials 2026, Vol. 19, Page 36
IF3.2
err2025-12-22
err0
errOAAI
errFu-Chian Chen; Dinh-Phuc Tran; Chih Chen
err分享
err收藏
Optimizing mechanical and electrical properties of nanotwinned copper-carbon nanotube composite foils优化纳米孪晶铜-碳纳米管复合箔的机械和电气性能
errJournal of Alloys and Compounds
IF6.3
err2025-12-15
err0
PREAI
errCiao-Yun Luo; Kang-Ping Lee; Mai-Phuong La; Chih-Chi Tsai; Wen-Wei Wu; Chih Chen
err分享
err收藏
Fabrication and characterization of (111)-oriented nanocrystalline copper for low-temperature Cu-to-Cu bonding(111)-取向纳米晶铜的制备与表征，用于低温铜-铜键合
errMaterials Characterization
IF5.5
err2025-11-26
err0
PREAI
errChen-Ning Li; Dinh-Phuc Tran; Kang-Ping Lee; Yu-Tao Yang; Chih Chen
err分享
err收藏
Impact of microstructure engineering on electromigration resistance of copper redistribution lines微观结构工程对铜再分布线电迁移电阻的影响
errJournal of Materials Research and Technology
IF6.6
err2025-10-06
err0
errOAAI
errYi-Quan Lin; Yu-Wen Hung; Dinh-Phuc Tran; Chih Chen
err分享
err收藏
Elucidating electromigration-induced void failures in Ni/SnAg/Ni solder microbumps using 3D X-ray laminographic inspections利用3D X射线层析扫描技术揭示Ni/SnAg/Ni焊料微凸点中电迁移诱发的空洞失效
errMaterials Characterization
IF5.5
err2025-09-24
err0
PREAI
errShih-Chi Yang; Chi-Hau Wu; Kai-Cheng Shie; King-Ning Tu; Chih Chen
err分享
err收藏
Design strategy and thermal stability characterization of high-strength nanotwinned Cu-Ni foils高强纳米孪晶Cu-Ni箔的设计策略与热稳定性表征
errResults in Engineering
IF7.9
err2025-08-16
err0
errOAAI
errKang-Ping Lee; Ming-Han Lu; Dinh-Phuc Tran; Chun-Ting Ke; Pin-Chia Chen; Po-Jui Su; Chih Chen
err分享
err收藏
Regulating intermetallic compound growth and bridging in SnAg solder under electromigration stress through Ni addition and sn crystallographic orientation-grain size通过Ni添加和Sn晶体学取向-晶粒尺寸调控电迁移应力下SnAg焊料中金属间化合物的生长与桥接
errJournal of Advanced Joining Processes
IF4
err2025-06-01
err0
errOAAI
errDinh-Phuc Tran; Ya-Ting Xiao; Mai-Phuong La; Shi-Chi Yang; Chih Chen
err分享
err收藏
Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging通过脱合金法制备纳米多孔-纳米孪晶Cu及其在高功率器件封装中的应用
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-04-01
err0
PREAI
errLu, Wan-Hsin; Tran, Dinh-Phuc; Lin, Huai-En; Shen, Guan-You; Chen, Bo-Yan; Lee, Kang-Ping; Tsai, Chih-Chi; Lin, Yi-Quan; Tu, K. N.; Chen, Chih
err分享
err收藏
Revealing challenges of downscaling effects on Cu thermal expansion in advanced hybrid bonding using in-situ AFM使用原位AFM揭示高级混合键合中Cu热膨胀的缩小效应的挑战
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-04-01
err0
PREAI
errLin, Huai-En; Chiu, Wei-Lan; Chang, Hsiang-Hung; Yang, Yu-Tao; Chen, Chih
err分享
err收藏

研究方向

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合作学者
合作期刊
Y
Yu Huang
H 指数: 138 · 论文数: 519
E
Emily A. Carter
H 指数: 102 · 论文数: 718
Q
Qing Zhao
H 指数: 84 · 论文数: 396
K
K. N. Tu
H 指数: 81 · 论文数: 651
M
Ming Dao
H 指数: 75 · 论文数: 269
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