logo
科言猫学术研究的AI总结
language
手机端手机端
  • Phone Feature微信小程序
简体中文简体中文
notice消息通知
博客博客
arrow
返回
D

Dongjin Kim

Korea Institute of Industrial Technology

24H指数
232论文数
1.9K被引数
收录论文 45
发表时间
logo
Glucose-derived vapor-phase reduction of Cu surface oxides during Cu–Cu direct bonding葡萄糖衍生的气相还原在Cu-Cu直接键合过程中对Cu表面氧化物的还原
errApplied Surface Science
IF6.9
err2026-09-28
err0
errOAAI
errJeehoo Na; Nahye Kim; Myung Jun Kim; Dongjin Kim; Tae-Ik Lee
err分享
err收藏
Thermomechanical integrity of heat-affected-zone-free vertical shunt resistors for double-sided-cooled power modules: Experimental and numerical investigations无热影响区垂直分流电阻的热机械完整性研究：实验与数值分析
errMaterials Characterization
IF5.5
err2026-07-01
err0
PREAI
errKim, YehRi; Kim, Byeongchan; Park, Junwoo; Han, Kue Jin; Han, Taeseong; Kim, Dongjin
err分享
err收藏
Enhanced thermal stability of direct cooling heatsink bonding for power electronics using instantaneous laser soldering: Experimental, FEM, and CFD investigation采用瞬时激光焊的直接冷却散热器键合技术对功率电子器件热稳定性的提升：实验、有限元和计算流体动力学研究
errMaterials Science in Semiconductor Processing
IF4.6
err2026-06-08
err0
PREAI
errHa-Young Yu; Byeongchan Kim; YehRi Kim; Junwoo Park; Shin-Il Kim; Tae-Ik Lee; Myoung-Gyu Lee; Dongjin Kim
err分享
err收藏
Capillary-driven solder climbing on Au-finished SMT components with vertical micro-grooved surface during reflow毛细力驱动的焊料在垂直微沟槽表面的Au镀层SMT元器件上的再流焊爬升
errJournal of Materials Research and Technology
IF6.6
err2026-02-23
err0
errOAAI
errJeehoo Na; YehRi Kim; Jongbeom Im; Byeongkil Kang; Doo Chan Jung; Dongjin Kim; Tae-Ik Lee
err分享
err收藏
Contrasting effects of silver hillocks and copper diffusion on Ag sinter bonding in direct-cooled SiC power semiconductor modules银丘和铜扩散对直接冷却SiC功率半导体模块中Ag烧结连接的对比效应
errMaterials Science in Semiconductor Processing
IF4.6
err2026-02-10
err0
PREAI
errYehRi Kim; Tae-Ik Lee; Dongjin Kim
err分享
err收藏
Improved thermal management and manufacturing flexibility in power module heatsinks through rapid large-area laser soldering and maximized convective heat transfer通过快速大面积激光焊接和最大化对流换热，提高功率模块散热器的热管理性能和制造灵活性
errCase Studies in Thermal Engineering
IF6.4
err2025-12-26
err0
errOAAI
errByeongchan Kim; Ha-Young Yu; Junwoo Park; Byeong Kwon Ju; Yong-Ho Ko; Sehoon Yoo; Tae-Ik Lee; Dongjin Kim
err分享
err收藏
Unveiling the Microstructural and Electrochemical Properties of Polymeric Separators for Batteries Through Generating Stochastic 3D Microstructures From 2D Images通过从2D图像生成随机3D微观结构，揭示电池聚合物隔膜的微观结构和电化学性能
errADVANCED ENERGY MATERIALS
IF26
err2025-11-01
err0
PREAI
errShin, Youyeong; Kim, Suhwan; Hong, Rakhwi; Choi, Seungyeop; Lee, Seungyeop; Choi, Joonhyeong; Kim, Dongjin; Kim, Wan-Keun; Lee, Yong Min
err分享
err收藏
Lowest sinterable temperature Ag nanoporous sheet bonding at 145–175 °C on Ag-plated Cu and interfacial microstructural degradation under 250 °C aging: Correlation with strength and fracture energy最低烧结温度下Ag纳米多孔片在145～175 °C时与镀Ag的Cu的键合，以及在250 °C时效处理下的界面微观结构退化：与强度和断裂能的相关性
errJournal of Materials Research and Technology
IF6.6
err2025-09-11
err0
errOAAI
errYehRi Kim; Seungjun Noh; Byeong Kwon Ju; Dongjin Kim
err分享
err收藏
Novel solid-state bonding for direct cooling of power inverter parts based on partially phase transition and diffusion intermetallic controlling: Experimental, FEM and CFD, material thermodynamic calculation investigation基于部分相变和扩散金属间化合物控制的功率逆变器部件直接冷却新型固态连接：实验、FEM和CFD、材料热力学计算研究
errInternational Communications in Heat and Mass Transfer
IF6.4
err2025-07-09
err0
PREAI
errEunjin Jo; YehRi Kim; Dongjin Kim
err分享
err收藏
Oxidation-free cold copper sinter joining in air using corrosion blocking process
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-04-01
err0
PREAI
errKim, Yehri; Yu, Ha-Young; Kim, Dongjin
err分享
err收藏
Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability180 °C下采用Ag烧结膏制备的低温Al/AlN接头：界面形成与接头可靠性
errCERAMICS INTERNATIONAL
IF5.6
err2025-01-01
err0
errOAAI
errChen, Chuantong; Liu, Li; Huo, Fupeng; Kim, Dongjin; Lee, Sangmin; Li, Wanli; Suganuma, Katsuaki
err分享
err收藏
Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2024-11-01
err0
PREAI
errLee, Sangmin; Baek, Seungyeop; Lee, Seung-Joon; Chen, Chuantong; Nishijima, Masahiko; Suganuma, Katsuaki; Utsunomiya, Hiroshi; Ma, Ninshu; Yu, Ha-Young; Kim, Dongjin
err分享
err收藏
Driving force for enhancing the cold silver sinter joining using time domain-dependent Ag-Au epitaxy and interfacial stress
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2024-09-01
err0
PREAI
errKim, Seoah; Mhin, Sungwook; Kim, Dongjin
err分享
err收藏
Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability通过在管芯和散热器上进行微米尺寸的Ag膏烧结连接来开发SiC功率模块结构，以实现低热阻和出色的功率循环可靠性
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2024-09-01
err4
errOAAI
errChen, Chuantong; Suetake, Aiji; Huo, Fupeng; Kim, Dongjin; Zhang, Zheng; Hsieh, Ming-Chun; Li, Wanli; Wakasugi, Naoki; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki
err分享
err收藏
Temperature and thickness-dependent silver hillock generation mechanism and surface morphology nature of direct plated silver layers onto copper substrates铜基板上直接镀银层的温度和厚度相关的银丘产生机理和表面形态性质
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2024-08-01
err1
PREAI
errKim, YehRi; Kim, Seoah; Zhang, Zheng; Chen, Chuantong; Suganuma, Katsuaki; Ju, Byeong Kwon; Kim, Dongjin
err分享
err收藏
Double-Layer Three-Phase Resonator for High-Power Wireless Power Transfer用于大功率无线电能传输的双层三相谐振器
errproceedings of the
IF0
err2024-05-08
err0
PREAI
errKim, Dong-Hoon; Kim, Dong-Jin; Bang, Jinkyu; Yi, Sang-Hwa; Byun, Gi-Young; Ahn, Chi-Hyung
err分享
err收藏
Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-05-01
err0
errOAAI
errKim, Seoah; Kim, YehRi; Jo, Eunjin; Lee, Hyeon-Sung; Mhin, Sungwook; Lee, Tae-Young; Yoo, Sehoon; Ko, Yong-Ho; Kim, Dongjin
err分享
err收藏
Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
IF2.8
err2024-02-07
err1
PREAI
errJeong, Jong-Min; Kim, Dongjin; Kim, Jungsoo; Bang, Junghwan; Jung, Seung-Boo; Kim, Min-Su
err分享
err收藏
Toward defect-less and minimized work-hardening loss implementation of Al alloy/high-purity Cu dissimilar lap joints by refill friction stir spot welding for battery tab-to-busbar applications
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2024-02-01
err5
errOAAI
errKim, Dongjin; Baek, Seungyeop; Nishijima, Masahiko; Lee, Hyun-chul; Geng, Peihao; Ma, Ninshu; Zhang, Zheng; Park, Hyunsu; Chen, Chuantong; Lee, Seung-Joon; Suganuma, Katsuaki
err分享
err收藏
Al heat affected zone-less resistance element welded lap joints of Al alloy and 1 GPa class steel: Transition of microstructure and fracture with heat transfer
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-01-01
err1
errOAAI
errBaek, Seungyeop; Kim, Junyeong; Kwak, Taeyang; Lee, Taejin; Lee, Hyun-chul; Chen, Chuantong; Geng, Peihao; Ma, Ninshu; Lee, Seung-Joon; Kim, Dongjin
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
S
Simon J. L. Billinge
H 指数: 83 · 论文数: 648
K
Katsuaki Suganuma
H 指数: 73 · 论文数: 910
I
Ian Robinson
H 指数: 70 · 论文数: 707
张
张正 (Zheng Zhang)
H 指数: 69 · 论文数: 805
Yong Min Lee 封面图
Yong Min Lee (Yong Min Lee)
H 指数: 60 · 论文数: 410
查看更多