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K

Katsuaki Suganuma

The University of Osaka
H指数:73
被引数:2.2万

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Post-molding interfacial design of sintered silver and copper joints for enhanced fracture resistance and polymer adhesion: Experimental and numerical investigations

烧结银和铜接头后成型界面设计以提高断裂韧性和聚合物粘附性：实验与数值研究

Journal of Materials Research and Technology-JMR&T
IF6.6
2026-06-290
OA
Byeongchan Kim; YehRi Kim; Jeong-Min Lee; DongEung Kim; Sangmin Lee; Ming-chun Hsieh; Byeong Kwon Ju; Chuantong Chen; Katsuaki Suganuma; Dongjin Kim
Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability

通过在管芯和散热器上进行微米尺寸的Ag膏烧结连接来开发SiC功率模块结构，以实现低热阻和出色的功率循环可靠性

IEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
2024-09-014
OA
Chen, Chuantong; Suetake, Aiji; Huo, Fupeng; Kim, Dongjin; Zhang, Zheng; Hsieh, Ming-Chun; Li, Wanli; Wakasugi, Naoki; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki

研究方向

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C
Chuantong Chen
H 指数:39论文数:355被引数:4,506
J
Jinting Jiu
H 指数:48论文数:175被引数:9,109
S
Shijo Nagao
H 指数:46论文数:256被引数:6,147
T
Tohru Sugahara
H 指数:41论文数:181被引数:5,605
M
Masaya Nogi
H 指数:0论文数:2被引数:29
C
Chuantong Chen
H 指数:0论文数:9被引数:24
W
Wanli Li
H 指数:34论文数:216被引数:3,695
D
Dongjin Kim
H 指数:24论文数:232被引数:1,874
李财富 封面图
李财富
H 指数:32论文数:110被引数:3,235
H
Hirotaka Koga
H 指数:0论文数:4被引数:9