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W

Wolfgang Eberhardt

hahn-schickard

18H指数
127论文数
1.4K被引数
收录论文 24
发表时间
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Influence of Laser Parameters on the Activation of Cr2O3-Doped ZTA Ceramics for Selective Electroless Copper Plating in the Manufacture of 3D Ceramic Circuit Carriers激光参数对Cr2O3掺杂ZTA陶瓷选择性化学镀铜制备3D陶瓷电路载体活性的影响
errJournal of Manufacturing and Materials Processing
IF3.3
err2026-09-08
err0
errOAAI
errAlexander Schilling; Andrea Knöller; Philipp Ninz; Wolfgang Eberhardt; Frank Kern; André Zimmermann
err分享
err收藏
Suitability of Different Anodic Aluminum Oxide Layer Morphologies and Metallization Processes for the Assembly of Surface Mount Devices by Reflow Soldering on Aluminum-Based Substrates不同阳极氧化铝层形貌和金属化工艺在铝基基板上通过回流焊组装表面贴装器件的适用性
errJournal of Manufacturing and Materials Processing
IF3.3
err2026-08-30
err0
errOAAI
errSimon Petillon; Dominik Koch; Andrea Knöller; Kai Werum; Wolfgang Eberhardt; André Zimmermann
err分享
err收藏
Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications3D塑料电路载体组装与互连技术：技术、材料与应用概述
errMicromachines 2025, Vol. 16, Page 980
IF3
err2025-08-28
err0
errOAAI
errKai Werum; Wolfgang Eberhardt; Dieter Reenaers; Thomas Mager; Mika Endl; André Zimmermann; Wim Deferme
err分享
err收藏
Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications
errMICROMACHINES
IF3
err2024-06-18
err0
errOAAI
errScherzer, Tim; Wolf, Marius; Werum, Kai; Ruckdaeschel, Holger; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Injection Compression Molding of LDS-MID for Millimeter Wave Applications
errJOURNAL OF MANUFACTURING AND MATERIALS PROCESSING
IF3.3
err2023-10-13
err1
errOAAI
errWolf, Marius; Werum, Kai; Eberhardt, Wolfgang; Guenther, Thomas; Zimmermann, Andre
err分享
err收藏
Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications
errJOURNAL OF MANUFACTURING AND MATERIALS PROCESSING
IF3.3
err2023-08-03
err1
errOAAI
errWolf, Marius; Werum, Kai; Guenther, Thomas; Schleeh, Lisa; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Injection Molding of Encapsulated Diffractive Optical Elements
errMICROMACHINES
IF3
err2023-06-09
err3
errOAAI
errWagner, Stefan; Treptow, Kevin; Weser, Sascha; Drexler, Marc; Sahakalkan, Serhat; Eberhardt, Wolfgang; Guenther, Thomas; Pruss, Christof; Herkommer, Alois; Zimmermann, Andre
err分享
err收藏
Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates增材制造基板上的气溶胶喷射打印和互连技术
errJOURNAL OF MANUFACTURING AND MATERIALS PROCESSING
IF3.3
err2022-10-09
err8
errOAAI
errWerum, Kai; Mueller, Ernst; Keck, Juergen; Jaeger, Jonas; Horter, Tim; Glaeser, Kerstin; Buschkamp, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization
errMICROMACHINES
IF3
err2022-08-01
err5
errOAAI
errSaleh, Rafat; Schuett, Sophie; Barth, Maximilian; Lang, Thassilo; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder通过ICA和焊料接触喷墨印刷的银结构和SMD
errIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
IF3
err2022-07-01
err7
PREAI
errJaeger, Jonas; Buschkamp, Sascha; Werum, Kai; Glaeser, Kerstin; Groezinger, Tobias; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Flexural Fatigue Test-A Proposed Method to Characterize the Lifetime of Conductor Tracks on Polymeric Substrates
errJOURNAL OF MANUFACTURING AND MATERIALS PROCESSING
IF3.3
err2022-04-01
err1
errOAAI
errPetillon, Simon; Knoller, Andrea; Brauer, Philipp; Helm, David; Grozinger, Tobias; Weser, Sascha; Eberhardt, Wolfgang; Franke, Jorg; Zimmermann, Andre
err分享
err收藏
Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist
errMICROMACHINES
IF3
err2021-07-21
err4
errOAAI
errJanek, Florian; Eichhorn, Nadine; Weser, Sascha; Glaeser, Kerstin; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Soft Tooling-Friendly Inductive Mold Heating-A Novel Concept
errMICROMACHINES
IF3
err2021-04-17
err0
errOAAI
errVieten, Tobias; Zanin, Davide; Knoeller, Andrea; Litwin, Thomas; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Bending Setups for Reliability Investigation of Flexible Electronics
errMICROMACHINES
IF3
err2021-01-13
err50
errOAAI
errSaleh, Rafat; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Selective laser induced autocatalytic metallization of NiO and Cr2O3 doped alumina zirconia ceramic substrates
errJOURNAL OF THE EUROPEAN CERAMIC SOCIETY
IF6.2
err2020-09-01
err5
PREAI
errNinz, Philipp; Kern, Frank; Petillon, Simon; Eberhardt, Wolfgang; Zimmermann, Andre; Gadow, Rainer
err分享
err收藏
Feasibility Study of an Automated Assembly Process for Ultrathin Chips
errMICROMACHINES
IF3
err2020-06-30
err3
errOAAI
errJanek, Florian; Saller, Ebru; Mueller, Ernst; Meissner, Thomas; Weser, Sascha; Barth, Maximilian; Eberhardt, Wolfgang; Zimmermann, Andre
err分享
err收藏
Adhesion of PVD layers on liquid crystal polymer pretreated by oxygen-containing plasma (vol 79, pg 124, 2005)
errVACUUM
IF3.9
err2007-02-01
err0
PREAI
errWang, B.; Eberhardt, W.; Kueck, H.
err分享
err收藏
Plasma pre-treatment of liquid crystal polymer and subsequent metallization by PVD
errVACUUM
IF3.9
err2006-10-01
err15
PREAI
errWang, B.; Eberhardt, W.; Kueck, H.
err分享
err收藏
Adhesion of PVD layers on liquid crystal polymer pretreated by oxygen-containing plasma
errVACUUM
IF3.9
err2005-08-01
err11
PREAI
errWang, B; Eberhardt, W; Kück, H
err分享
err收藏
Adhesion of PVD layers on liquid crystal polymer pretreated by oxygen-containing plasma
errVACUUM
IF3.9
err2005-08-01
err18
PREAI
errWang, B; Eberhardt, W; Kück, H
err分享
err收藏

研究方向

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