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王

王凤江 (Fengjiang Wang)

Jiangsu University of Science and Technology

25H指数
147论文数
2.3K被引数
收录论文 45
发表时间
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Microstructure, Resistivity, and Strength of Pressureless Sintered Silver Joints: Effect of Powder Formulation无压烧结银接头的微观结构、电阻率和强度：粉末配方的影响
errAdvanced Engineering Materials
IF3.3
err2026-09-09
err0
PREAI
errZhenyi Ren; Xiaojie Zhang; Fengjiang Wang
err分享
err收藏
CALPHAD-type model aided elastic properties screening across the full compositional space of BCC Mo-Nb-ta-Ti alloysCALPHAD型模型辅助体心立方Mo-Nb-Ta-Ti合金全成分空间的弹性性能筛选
errINTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS
IF4.6
err2026-09-08
err0
PREAI
errMingqing Liao; Haoxin Jiang; Nan Qu; Fengjiang Wang
err分享
err收藏
Review: reliability trends in Sn–Ag–Cu/Sn–Pb and Sn–Ag–Cu/Sn-Bi mixed solder joints for electronic products综述：电子产品中Sn–Ag–Cu/Sn–Pb和Sn–Ag–Cu/Sn-Bi混合焊点可靠性趋势
errJournal of Materials Science
IF3.9
err2026-07-07
err0
PREAI
errChangxun Li; Mingqing Liao; Kai Qi; Fengjiang Wang
err分享
err收藏
Influence of Bi addition on microstructure, mechanical properties and aging resistance of Sn-4Ag based lead-free soldersBi添加对Sn-4Ag基无铅焊料微观结构、力学性能和抗老化性能的影响
errMaterials Science in Semiconductor Processing
IF4.6
err2026-07-01
err0
PREAI
errZhang, Yuhang; Wang, Felix Z.; Yan, Han; Wahab, Fazal; Wang, Fengjiang
err分享
err收藏
Investigation on low-temperature modification of Sn-40Pb coated PV ribbons by Bi addition低温下通过添加铋对Sn-40Pb涂层PV带材的改性研究
errSolar Energy Materials and Solar Cells
IF6.3
err2026-07-01
err0
PREAI
errDing, Yu; Cao, Jiangdong; Pu, Sheng; Xu, Pengpeng; Yin, Haipeng; Jiang, Xiulin; Wang, Fengjiang; Cheng, Guanggui; Ding, Jianning
err分享
err收藏
Effect of Bi, Ni and Sb for comprehensive improvement on Sn-Ag-Cu solder alloys: A reviewBi、Ni和Sb对Sn-Ag-Cu焊料合金综合性能提升的影响：一项综述
errMaterials Science in Semiconductor Processing
IF4.6
err2026-04-25
err0
PREAI
errZezheng Li; Fengjiang Wang
err分享
err收藏
Microstructural Evolution in Cu/Sn–35Bi/Cu and Ni/Sn–35Bi/Cu Solder Joints Under ThermomigrationCu/Sn–35Bi/Cu和Ni/Sn–35Bi/Cu焊点在热迁移下的微观结构演化
errAdvanced Engineering Materials
IF3.3
err2026-04-18
err0
PREAI
errKexin Lin; Han Yan; Kaipeng Wang; Mingqing Liao; Kai Qi; Fengjiang Wang
err分享
err收藏
AM-C33: An Altermagnetic CarbonAM-C33：一种反铁磁碳
errChem. Sci.
IF7.4
err2025-10-27
err0
errOAAI
errMingqing Liao; Yuehua Wang; Penghua Ye; Chenggang Wu; Haoxin Jiang; Fei Zhou; Jintong Guan; Fengjiang Wang
err分享
err收藏
Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications理解力学和热学性能更优的纳米孪晶铜：制备工艺、机理模型及技术应用
errAdvances in Colloid and Interface Science
IF19.3
err2025-08-25
err0
PREAI
errZhijie Zhang; Yulong Hu; Xiangyu Li; Fengjiang Wang; Yi Li; Anil Kunwar
err分享
err收藏
Current status on optimizing solder wettability from substrate surface treatment, alloying solder, flux, and process environments当前优化焊料润湿性的现状，包括基板表面处理、焊料合金化、助焊剂以及工艺环境。
errMaterials Science in Semiconductor Processing
IF4.6
err2025-08-18
err0
PREAI
errQi Li; Zezheng Li; Han Yan; Zhenyi Ren; Changxun Li; Aidong Liu; Wenxuan Pang; Guanheng Ren; Mingqing Liao; Rongmei Zhang; Fengjiang Wang
err分享
err收藏
Tuning stability, mechanical, and electronic properties of orthorhombic Ag3Sn via X doping (X = Au, Co, Cu, Ni, Sb, Zn): A first-principles investigation通过X掺杂（X = Au, Co, Cu, Ni, Sb, Zn）调控正交相Ag3Sn的调谐稳定性、力学及电子性质：一项第一性原理研究
errphysica b condensed matter
IF0
err2025-08-12
err0
PREAI
errYinhong Wang; Mingqing Liao; Nan Qu; Chenggang Wu; Yuehua Wang; Fengjiang Wang
err分享
err收藏
Quasi-in-situ observation of microstructure evolution and growth kinetics analysis of Sn58Bi solder under different aging conditions准原位观察不同时效条件下Sn58Bi焊料的微观结构演变及生长动力学分析
errMaterials Characterization
IF5.5
err2025-07-04
err0
PREAI
errJunjie Zhao; Hongshun Gong; Hao Wang; Mingqing Liao; Fengjiang Wang
err分享
err收藏
Machine learning assisted phase prediction of refractory multi-component alloys based on data from low-, medium-, and high-entropy alloys基于低、中、高熵合金数据的机器学习辅助难熔多组分合金相预测
errinternational journal of refractory metals hard materials
IF0
err2025-05-30
err0
PREAI
errYuehua Wang; Mingqing Liao; Nan Qu; Xizhen Li; Danni Yang; Zhonghong Lai; Yong Liu; Fengjiang Wang; Jingchuan Zhu
err分享
err收藏
HM-C21: A three-dimensional carbon with abundant p-electron-induced magnetic states for spintronics
errAPPLIED PHYSICS LETTERS
IF3.6
err2025-04-21
err0
PREAI
errZhao, Junjie; Liao, Mingqing; Zhang, Jiayu; Wang, Yuehua; Wu, Chenggang; Jiang, Haoxin; Zhou, Fei; Guan, Jintong; Yang, Danni; Qu, Nan; Wang, Fengjiang
err分享
err收藏
Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-03-01
err0
errOAAI
errLi, Sijin; Wang, Xiaowei; Liao, Mingqing; Li, Zezheng; Li, Qi; Yan, Han; Liu, Aidong; Wang, Fengjiang
err分享
err收藏
Microstructure and reliability of Sn15Bi-xAg solder joints on Ni and Cu substrates during thermal cycling
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2025-03-01
err0
PREAI
errYan, Han; Yin, Guoqing; Ji, Tongtong; Liao, Mingqing; Wang, Fengjiang
err分享
err收藏
Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-01-01
err0
errOAAI
errZhao, Junjie; Wu, Jun; Zhang, Jiayu; Liao, Mingqin; Wang, Fengjiang
err分享
err收藏
Structural and mechanical properties of Mg-RE intermetallic compounds: High-throughput first-principles calculationsMg-RE金属间化合物的结构与力学性能：高通量第一性原理计算
errJournal of Rare Earths
IF7.2
err2024-12-11
err0
PREAI
errMingqing Liao; Xiaojie Zhang; Yuesheng Wu; Fei Zhou; Danni Yang; Xiaohong Yuan; Fengjiang Wang; Chao Xu
err分享
err收藏
An improved energy saving clustering method for IWSN based on Gaussian mutation adaptive artificial fish swarm algorithm
errSCIENTIFIC REPORTS
IF3.9
err2024-11-07
err0
errOAAI
errLan, Yeshen; Rao, Chuchu; Cao, Qike; Cao, Bingyu; Zhou, Mingan; Jin, Bo; Wang, Fengjiang; Chen, Wei
err分享
err收藏
Structural, mechanical and thermodynamic properties of Mg24RE5: 24 RE 5: A first-principles investigation
errVACUUM
IF3.9
err2024-10-01
err1
PREAI
errLiao, Mingqing; Wu, Yuesheng; Zhou, Fei; Liu, Bin; Wang, Fengjiang; Xu, Chao
err分享
err收藏

研究方向

电子封装材料及其可靠性微纳连接技术电弧增材制造技术
合作学者
合作期刊
Zi-Kui Liu 封面图
Zi-Kui Liu (Zi‐Kui Liu)
H 指数: 94 · 论文数: 1.1K
Q
Qi Li
H 指数: 82 · 论文数: 769
刘宾 封面图
刘宾 (Bin Liu)
H 指数: 76 · 论文数: 1.2K
邵留 封面图
邵留 (Liming Shao)
H 指数: 71 · 论文数: 604
颜超 封面图
颜超 (Chao Yan)
H 指数: 66 · 论文数: 441
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