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Cheng‐Yi Liu

national central university

30H指数
182论文数
3.3K被引数
收录论文 42
发表时间
Determination and characteristics of β-Sn twin boundaries in Sn–Ag–Cu micro-solder jointsβ-Sn孪晶界的测定及其在Sn–Ag–Cu微焊点中的特性
err2026-01-08
err0
PREAI
errChieh-Pu Tsai; Zhong-Yen Yu; Liu-Hsin-Chen Yang; Chih-En Hsu; Kai-Chi Lin; Chih-Wen Chiu; Chung-Yu Chiu; Jui-Shen Chang; Chen-Nan Chiu; David T. Chu; Yao-Chun Chuang; Cheng-Yi Liu
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EM-Induced Voiding Mechanism in Trapped Sn Phase Inside Massive Cu-Sn Compound电磁感应诱发的空位机制:被困Sn相在块状Cu-Sn化合物内部
err2025-12-01
err0
PREAI
errChen, Po-Yu; Tsai, Chieh-Pu; Yang, Liu-Hsin-Chen; Lin, Kai-Chi; Chiu, Chih-Wen; Hsu, Chih-En; Chiu, Chung-Yu; Chang, Jui-Shen; Chiu, Chen-Nan; Chu, David T.; Chuang, Yao-Chun; Liu, Cheng-Yi
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Abrasion Tests on Nanotwinned and Graphene-Doped Ag Films Prepared by Cyanide-Free Ag Electroplating无氰镀银制备的纳米孪晶和石墨烯掺杂Ag薄膜的磨损试验
err2025-09-01
err0
PREAI
errFu, Kuan-Lin; Yang, Liu-Hsin-Chen; Lo, Mei-Hsin; Cheng, Ting-Yi; Huang, Yu-Chen; Yu, Zhong-Yen; Hsu, Chih-En; Lin, Kai-Chi; Chiu, Chin-Wen; Wu, Albert T.; Liu, Cheng-Yi
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Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating从焊料掩膜中浸出化学物质的分析及其对无电解Ni(P)电镀的影响
err2025-01-03
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PREAI
errYu, Zhong-Yen; Wu, Chen-Yu; Fu, Kuan-Lin; Chang, Jui-Sheng; Yen, Tzu-Hsuan; Tsai, Chieh-Pu; Hsu, Ya-Hui; Lee, Yun-Fong; Liu, Cheng-Yi
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Stacking Fault and Plastic Deformation Mechanism in Nano-twinned Cu Pillar under Ultrahigh Stress
err2024-07-10
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PREAI
errFu, Kuan-Lin; Lee, Yun-Fong; Chang, Jui-Sheng; Lee, Chia-Hung; Chen, Po-Yu; Huang, Wei-Chieh; Lo, Mei-Hsin; Huang, Yu-Chen; Liu, Cheng-Yi
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Mechanism and quantum efficiency of yellow emission at the organic-inorganic F8T2/p-GaN interface
err2022-04-01
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PREAI
errChou, Chia-Yueh; Lin, Chia-Hua; Liao, Ching-Han; Wu, Yen-Ju; Chen, Wei-Hao; Li, Bao-Jhen; Liu, Cheng-Yi
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Controlling the Electron Concentration for Surface-Enhanced Raman Spectroscopy表面增强拉曼光谱中电子浓度的控制
err2021-07-27
err5
PREAI
errNguyen, Thi Anh Nguyet; Yu, Ying-Lung; Chang, Ya Chien; Wang, Yu-Han; Woon, Wei-Yen; Wu, Chien-Ting; Lin, Kun-Lin; Liu, Cheng-Yi; Chien, Fan-Ching; Lai, Kun-Yu
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Plastic deformation of ZnO thin films through edge and screw dislocation movements
err2021-07-16
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PREAI
errChen, Wei-Hao; Chou, Chia-Yueh; Li, Bao-Jhen; Cheng, Shao-Liang; Liu, Cheng-Yi
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Effect of De-Twinning on Tensile Strength of Nano-Twinned Cu Films
err2021-06-22
err4
errOAAI
errLee, Chia-Hung; Lin, Erh-Ju; Wang, Jyun-Yang; Lin, Yi-Xuan; Wu, Chen-Yu; Chiu, Chung-Yu; Yeh, Ching-Yu; Huang, Bo-Rong; Fu, Kuan-Lin; Liu, Cheng-Yi
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Flip-Chip Packaged Perovskite Solar Cells
err2021-04-14
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PREAI
errHuang, Chun-Kai; Chiu, Chung-Yu; Lai, Tse-Lin; Cheng, Cheng; Lai, Wei-Han; Chang, Pai-Jung; Wu, Jin-Long; Chiang, Chien-Hung; Wu, Chun-Guey; Liu, Cheng-Yi
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Effect of mixing glass frits on electrical property and microstructure of sintered Cu conductive thick film
err2020-12-16
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PREAI
errWang, Jyun Yang; Lin, Yi Xuan; Wu, Chen Yu; Chiu, Chung Yu; Lee, Chia Hung; Yeh, Ching Yu; Huang, Bo Rong; Liu, Cheng Yi
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High-power and single-mode VCSEL arrays with single-polarized outputs by using package-induced tensile strain
err2020-08-27
err18
PREAI
errShi, Jin-Wei; Khan, Zuhaib; Horng, Ray-Hua; Yeh, Hsiao-Yun; Huang, Chun-Kai; Liu, Cheng-Yi; Shih, Jie-Chen; Chang, Yung-Hao; Yen, Jia-Liang; Sheu, Jinn-Kong
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Formation Mechanism of Self-Formed Triangular Pyramidal Patterns on Sapphire Substrate
err2020-06-04
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PREAI
errLai, Wei-Han; Huang, Shih-Wei; Chen, Yen-Hao; Cheng, Cheng; Liu, Cheng-Yi
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Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys
err2019-08-01
err22
PREAI
errWang, J. Y.; Tang, Y. K.; Yeh, C. Y.; Chang, P. J.; Lin, Y. X.; Lin, E. J.; Wu, C. Y.; Zhuang, W. X.; Liu, C. Y.
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