R. Durairaj - Publications, H-index & Citations

R. Durairaj

universiti tunku abdul rahman (utar)

21H指数

99论文数

1.6K被引数

收录论文 9

发表时间

Influences of nano bio-filler on the fire-resistive and mechanical properties of water-based intumescent coatings

PROGRESS IN ORGANIC COATINGS

IF7.3

2018-11-01

PREAI

Yew, Ming Chian; Yew, Ming Kun; Saw, Lip Huat; Ng, Tan Ching; Durairaj, Rajkumar; Beh, Jing Han

Antibiofilm properties of chemically synthesized silver nanoparticles found against Pseudomonas aeruginosa 针对铜绿假单胞菌的化学合成银纳米颗粒的抗生物膜特性

JOURNAL OF NANOBIOTECHNOLOGY

IF12.6

2014-01-01

149

OAAI

Palanisamy, Navindra Kumari; Ferina, Nas; Amirulhusni, Athirah Nur; Mohd-Zain, Zaini; Hussaini, Jamal; Ping, Liew Jian; Durairaj, Rajkumar

Effect of ethylene carbonate in poly (methyl methacrylate)-lithium tetraborate based polymer electrolytes

JOURNAL OF NON-CRYSTALLINE SOLIDS

IF3.5

2011-03-01

PREAI

Ramesh, S.; Shanti, R.; Durairaj, R.

Effect of epoxy and filler concentrations on curing behaviour of isotropic conductive adhesives

JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY

IF3.1

2011-02-15

PREAI

Durairaj, R.; Man, Lam Wai

Effect of PVC on ionic conductivity, crystallographic structural, morphological and thermal characterizations in PMMA-PVC blend-based polymer electrolytes

THERMOCHIMICA ACTA

IF3.5

2010-11-01

101

PREAI

Ramesh, S.; Liew, Chiam-Wen; Morris, Ezra; Durairaj, R.

The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes

MATERIALS & DESIGN

IF7.9

2010-03-01

PREAI

Durairaj, R.; Man, Lam Wai; Ekere, N. N.; Mallik, S.

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

MATERIALS & DESIGN

IF7.9

2009-12-01

PREAI

Mallik, S.; Ekere, N. N.; Durairaj, R.; Marks, A. E.; Seman, A.

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

MATERIALS & DESIGN

IF7.9

2009-10-01

PREAI

Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly 用于倒装芯片组装的焊膏和各向同性导电胶的流变特性

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

IF7.5

2009-04-01

PREAI

Durairaj, R.; Mallik, S.; Seman, A.; Marks, A.; Ekere, N. N.

研究方向