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N

N.N. Ekere

University of Wolverhampton

31H指数
180论文数
3.5K被引数
收录论文 26
发表时间
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Wind Flow and Its Interaction with a Mobile Solar PV System Mounted on a Trailer
errSUSTAINABILITY
IF3.3
err2024-02-29
err0
errOAAI
errEslami Majd, Alireza; Adebayo, David S.; Tchuenbou-Magaia, Fideline; Willetts, James; Nwosu, Dave; Matthews, Zackery; Ekere, Nduka Nnamdi
err分享
err收藏
Multi-scale collision risk estimation for maritime traffic in complex port waters复杂港口水域海上交通多尺度碰撞风险估计
errRELIABILITY ENGINEERING & SYSTEM SAFETY
IF11
err2023-12-01
err24
errOAAI
errXin, Xuri; Liu, Kezhong; Loughney, Sean; Wang, Jin; Li, Huanhuan; Ekere, Nduka; Yang, Zaili
err分享
err收藏
Critical skills needs and challenges for STEM/STEAM graduates increased employability and entrepreneurship in the solar energy sector
errRENEWABLE & SUSTAINABLE ENERGY REVIEWS
IF16.3
err2023-11-01
err5
errOAAI
errAmalu, Emeka H.; Short, Michael; Chong, Perk Lin; Hughes, David J.; Adebayo, David S.; Tchuenbou-Magaia, Fideline; Lahde, Petri; Kukka, Marko; Polyzou, Olympia; Oikonomou, Theoni I.; Karytsas, Constantine; Gebremedhin, Alemayehu; Ossian, Charmant; Ekere, N. N.
err分享
err收藏
A Review on Cooling Systems for Portable Energy Storage Units便携式储能装置冷却系统综述
errENERGIES
IF3.2
err2023-09-11
err0
errOAAI
errMajd, Alireza Eslami; Tchuenbou-Magaia, Fideline; Meless, Agnero M.; Adebayo, David S.; Ekere, Nduka Nnamdi
err分享
err收藏
A novel health indicator for intelligent prediction of rolling bearing remaining useful life based on unsupervised learning model
errCOMPUTERS & INDUSTRIAL ENGINEERING
IF6.5
err2023-02-01
err44
errOAAI
errXu, Zifei; Bashir, Musa; Liu, Qinsong; Miao, Zifan; Wang, Xinyu; Wang, Jin; Ekere, Nduka
err分享
err收藏
Multisensory collaborative damage diagnosis of a 10 MW floating offshore wind turbine tendons using multi-scale convolutional neural network with attention mechanism
errRENEWABLE ENERGY
IF9.1
err2022-11-01
err13
errOAAI
errXu, Zifei; Bashir, Musa; Yang, Yang; Wang, Xinyu; Wang, Jin; Ekere, Nduka; Li, Chun
err分享
err收藏
Effect of sucrose replacement and resistant starch addition on textural properties of gluten-free doughs and biscuits蔗糖替代和抗性淀粉添加对无麸质面团和饼干质构特性的影响
errEUROPEAN FOOD RESEARCH AND TECHNOLOGY
IF3.2
err2021-01-30
err18
errOAAI
errDi Cairano, Maria; Caruso, Marisa Carmela; Galgano, Fernanda; Favati, Fabio; Ekere, Ndy; Tchuenbou-Magaia, Fideline
err分享
err收藏
Crack initiation and growth in PV module interconnection
errSOLAR ENERGY
IF6.6
err2020-08-01
err27
errOAAI
errMajd, Alireza Eslami; Ekere, Nduka Nnamdi
err分享
err收藏
Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules
errSOLAR ENERGY
IF6.6
err2019-12-01
err6
errOAAI
errMjad, Alireza Eslami; Ekere, Nduka Nnamdi
err分享
err收藏
Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates
errSOLAR ENERGY
IF6.6
err2018-08-01
err69
errOAAI
errOgbomo, Osarumen O.; Amalu, Emeka H.; Ekere, N. N.; Olagbegi, P. O.
err分享
err收藏
Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections
errROBOTICS AND COMPUTER-INTEGRATED MANUFACTURING
IF11.4
err2017-10-01
err58
errOAAI
errZarmai, Musa T.; Ekere, N. N.; Oduoza, C. F.; Amalu, Emeka H.
err分享
err收藏
Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies
errJOURNAL OF MANUFACTURING SYSTEMS
IF14.2
err2016-04-01
err53
PREAI
errAmalu, Emeka H.; Ekere, N. N.
err分享
err收藏
Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method
errFINITE ELEMENTS IN ANALYSIS AND DESIGN
IF3.5
err2015-12-01
err21
PREAI
errAmalu, Emeka H.; Ekere, N. N.; Zarmai, M. T.; Takyi, G.
err分享
err收藏
A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly改进的晶体硅太阳能电池光伏组件组件互连技术综述
errAPPLIED ENERGY
IF11
err2015-09-01
err129
errOAAI
errZarmai, Musa T.; Ekere, N. N.; Oduoza, C. F.; Amalu, Emeka H.
err分享
err收藏
Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bumping for Sub-100 μm size solder bumps
errMETALS AND MATERIALS INTERNATIONAL
IF4
err2013-09-10
err22
PREAI
errKumar, Santosh; Mallik, Sabuj; Ekere, Ndy; Jung, Jaepil
err分享
err收藏
Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling倒装芯片组件中无铅焊点的高温热循环损伤
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2012-12-01
err23
PREAI
errAmalu, Emeka H.; Ekere, N. N.
err分享
err收藏
High temperature reliability of lead-free solder joints in a flip chip assembly倒装芯片组件中无铅焊点的高温可靠性
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2012-02-01
err60
PREAI
errAmalu, Emeka H.; Ekere, Ndy N.
err分享
err收藏
Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process
errMATERIALS & DESIGN
IF7.9
err2011-06-01
err45
PREAI
errAmalu, E. H.; Ekere, N. N.; Mallik, S.
err分享
err收藏
Investigation of thermal management materials for automotive electronic control units
errAPPLIED THERMAL ENGINEERING
IF6.9
err2011-02-01
err201
errOAAI
errMallik, Sabuj; Ekere, Ndy; Best, Chris; Bhatti, Raj
err分享
err收藏
The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes
errMATERIALS & DESIGN
IF7.9
err2010-03-01
err28
PREAI
errDurairaj, R.; Man, Lam Wai; Ekere, N. N.; Mallik, S.
err分享
err收藏

研究方向

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