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Yongfu Li

shanghai jiao tong university

27H指数
299论文数
2.8K被引数
收录论文 85
发表时间
Survey of Chiplet Technology: SoC Architecture, Interconnect, EDA, and Advanced Packaging芯片级技术综述:SoC架构、互连、EDA及先进封装
err2025-11-24
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errOAAI
errHongwei Liu; Yuan Du; Bo Pu; Guojun Yuan; Yuhang Liu; Linji Zheng; Pengchao Wang; An Yang; Yu Li; Chengming Yu; Fei Guo; Xiaoteng Zhao; Xuqiang Zheng; He Sun; Yongfu Li; Shaolin Xiang; Qinfen Hao
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A Compact Cost-Effective NB-IoT System-in-Package With Integrated RF Front-End IPD and TX/RX Gain Self-Calibration
err2025-06-01
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PREAI
errDeng, Haopei; Jiang, Wentao; Tan, Yi; Ye, Jiayi; He, Fei; Liu, Zexue; Li, Danping; Song, Fei; Fu, Xiaoyu; Li, Yongfu; Ru, Jiayoon; Zhang, Jinghua; Xiao, Jianhong
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