C. Yi - Publications, H-index & Citations

C. Yi

Taiyuan University of Technology

9H指数

26论文数

723被引数

收录论文 8

发表时间

Low-velocity impact response of shear thickening fluid-filled honeycomb sandwich panel with thin face sheets 薄面板填充剪切增稠流体的蜂窝夹层板的低速冲击响应

Thin-Walled Structures

IF6.6

2025-10-27

PREAI

Changcheng Yi; Dangyong Shi; Shiqiang Li; Zhifang Liu; Jianyin Lei

Microstructural evolution and strengthening mechanism of U71Mn steel joints fabricated by friction-flash hybrid welding

MATERIALS & DESIGN

IF7.9

2024-11-01

OAAI

You, Jiaqing; Tan, Jinhong; Liu, Xingping; Du, Kai; Li, Jiarui; Yi, Chengyang; Zhao, Yunqiang

Design and Performance Analysis of THz Wireless Communication Systems for Chip-to-Chip and Personal Area Networks Applications 用于芯片到芯片和个人区域网络应用的THz无线通信系统的设计和性能分析

IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS

IF17.2

2021-06-01

PREAI

Yi, Changhwan; Kim, Dongkyo; Solanki, Sourabh; Kwon, Jae-Hong; Kim, Moonil; Jeon, Sanggeun; Ko, Young-Chai; Lee, Inkyu

A 280-GHz InP DHBT Receiver Detector Containing a Differential Preamplifier

IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY

IF4

2017-03-01

PREAI

Yi, Changhwan; Urteaga, Miguel; Choi, Seung Ho; Kim, Moonil

Effects of structural fibers on bonding mechanism changes in interface between GFRP bar and concrete

COMPOSITES PART B-ENGINEERING

IF14.2

2013-02-01

PREAI

Kim, B.; Doh, J. -H.; Yi, C. -K.; Lee, J. -Y.

Interfacial bond strength of glass fiber reinforced polymer bars in high-strength concrete

COMPOSITES PART B-ENGINEERING

IF14.2

2008-03-01

191

PREAI

Lee, J. -Y.; Kim, T. -Y.; Kim, T. J.; Yi, C. -K.; Park, J. -S.; You, Y. -C.; Park, Y. -H.

High-Threshold-Stability GeSe-Based Selector-Only Memory Enabled by Gallium Doping 高阈值稳定性GeSe基选择器唯存忆阻器通过镓掺杂实现

IEEE Electron Device Letters

IF4.5

PREAI

Yaru Zhang; Jinyu Wen; Chuanqi Yi; Lun Wang; Zixuan Liu; Ziqi Chen; Hao Tong; Xiangshui Miao

W-Band 0.5-W Waveguide Module Utilizing Spatial Power Combining of Linear Amplifier Array 利用线性放大器阵列空间功率合成的W波段0.5-W波导模块

IEEE Microwave and Wireless Technology Letters

IF3.4

PREAI

Y. Koh; C. Yi; M. Kim

研究方向