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C
Chun-Ming Lin
Department of Marine Engineering
22
H指数
61
论文数
2.9K
被引数
0
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29
发表时间
发表时间
IF
被引数
Hydrodynamic optimization of micro-scale Archimedes screw generators under additive manufacturing constraints
在增材制造约束下微尺度阿基米德螺杆发电机的流体动力学优化
International Journal of Advanced Manufacturing Technology
IF
3.1
2026-09-18
0
PRE
AI
Fang-Sung Cheng; Jhih-Siang Shih; Chun-Ming Lin
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Design and optimization of a pin-reinforced snap-fit fastener via additive manufacturing for high-load sanitary applications
通过增材制造设计和优化销钉增强型卡扣紧固件,用于高负载卫生应用
International Journal of Advanced Manufacturing Technology
IF
3.1
2026-07-14
0
PRE
AI
Fang-Sung Cheng; Hong-Yi Zhan; Chun-Ming Lin
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Microstructural Refinement and Interfacial Evolution of Ge addition Sn-Bi-Zn Medium-Entropy Solders
添加Ge的Sn-Bi-Zn中熵焊料的微观结构细化与界面演变
Journal of Electronic Materials
IF
2.5
2026-07-01
0
PRE
AI
Li, Su; Yue, Zhiyang; Huang, Jianeng; Dai, Pinqiang; Pan, Huiyuan; Tian, Jun; Lin, Chun-Ming
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Solidification and Liquation Cracking in Welds of High Entropy CoCrFeNiCux Alloys
MATERIALS
IF
3.2
2023-08-14
0
OA
AI
Yu, Ping; Kou, Sindo; Lin, Chun-Ming
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Strategy of complex carbides in microalloyed 4Mn steels processed by quenching and austenite reversion
MATERIALS & DESIGN
IF
7.9
2023-06-01
5
OA
AI
Lu, Shao-Lun; Yang, Shan-Chun; Zhu, Kangying; Chen, Yi-Sheng; Cairney, Julie M.; Lin, Chun-Ming; Yen, Hung-Wei
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Facilitating low-temperature diffusion bonding between oxygen-free Al2O3 ceramic and pure Cu through inclusion of 0.8 La (wt.%) to Ti pre-metallized interlayer: Microstructural evolution, metallurgical reactions, and mechanical properties
SURFACES AND INTERFACES
IF
6.3
2020-12-01
8
PRE
AI
Lin, Chun-Ming; Hsins, Tseng-Pei
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Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder3.0Ag-0.5Cu Solder (vol 51, 980, 2020)
SCIENTIFIC REPORTS
IF
3.9
2020-07-22
0
OA
AI
Shen, Yu-An; Lin, Chun-Ming; Li, Jiahui; He, Siliang; Nishikawa, Hiroshi
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Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging
SCIENTIFIC REPORTS
IF
3.9
2019-07-15
17
OA
AI
Shen, Yu-An; Lin, Chun-Ming; Li, Jiahui; Gao, Runhua; Nishikawa, Hiroshi
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Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
SCIENTIFIC REPORTS
IF
3.9
2019-03-06
27
OA
AI
Shen, Yu-An; Lin, Chun-Ming; Li, Jiahui; He, Siliang; Nishikawa, Hiroshi
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Microstructure and mechanical properties of Ti-6Al-4V alloy diffused with molybdenum and nickel by double glow plasma surface alloying technique
JOURNAL OF ALLOYS AND COMPOUNDS
IF
6.3
2017-09-01
18
PRE
AI
Lin, Chun-Ming; Kai, Wei-Yu; Su, Cherng-Yuh; Tsai, Chien-Nan; Chen, Yen-Chen
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Effects of water cooling on microstructural evolution, hardness and anti-corrosion properties of Inconel 52 fusion-cladded AISI 316L stainless steel
SURFACE & COATINGS TECHNOLOGY
IF
6.1
2017-08-01
6
PRE
AI
Lin, Chun-Ming; Li, Jia-Chi; Su, Cherng-Yuh; Chang, Yu-Hsien; Kai, Wei-Yu; Chen, Cheng-Shun
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Empirical alloys-by-design theory calculations to the microstructure evolution mechanical properties of Mo-doped laser cladding NiAl composite coatings on medium carbon steel substrates
JOURNAL OF ALLOYS AND COMPOUNDS
IF
6.3
2017-04-01
19
PRE
AI
Lin, Chun-Ming; Kai, Wei-Yu; Su, Cherng-Yuh; Key, Kun-Hui
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Measurement and optimization of atmospheric plasma sprayed CoMoCrSi coatings parameters on Ti-6Al-4V substrates affecting microstructural and properties using hybrid abductor induction mechanism
MEASUREMENT
IF
5.6
2016-12-01
19
PRE
AI
Lin, Chun-Ming; Yen, Shih-Hung; Su, Cherng-Yuh
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Effects of tempering temperature on microstructural evolution and mechanical properties of high-strength low-alloy D6AC plasma arc welds
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF
7
2016-10-01
20
PRE
AI
Lin, Chun-Ming; Lu, Chi-Hao
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Functional composite metal for WC-dispersed 304L stainless steel matrix composite with alloying by direct laser: Microstructure, hardness and fracture toughness
VACUUM
IF
3.9
2015-11-01
22
PRE
AI
Lin, Chun-Ming
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Enhanced mechanical properties of HfMoTaTiZr and HfMoNbTaTiZr refractory high-entropy alloys
INTERMETALLICS
IF
4.8
2015-07-01
496
PRE
AI
Juan, Chien-Chang; Tsai, Ming-Hung; Tsai, Che-Wei; Lin, Chun-Ming; Wang, Woei-Ren; Yang, Chih-Chao; Chen, Swe-Kai; Lin, Su-Jien; Yeh, Jien-Wei
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Parameter optimization of laser cladding process and resulting microstructure for the repair of tenon on steam turbine blade
VACUUM
IF
3.9
2015-05-01
53
PRE
AI
Lin, Chun-Ming
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Effect of Al addition on mechanical properties and microstructure of refractory AlxHfNbTaTiZr alloys
JOURNAL OF ALLOYS AND COMPOUNDS
IF
6.3
2015-03-01
258
PRE
AI
Lin, Chun-Ming; Juan, Chien-Chang; Chang, Chia-Hsiu; Tsai, Che-Wei; Yeh, Jien-Wei
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Relationships between microstructures and properties of buffer layer with Inconel 52M clad on AISI 316L stainless steel by GTAW processing
SURFACE & COATINGS TECHNOLOGY
IF
6.1
2013-08-01
31
PRE
AI
Lin, Chun-Ming
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Effect of V2O5 doping on microstructure and electrical properties of Bi2O3-TiO2 solid oxide electrolyte system
CERAMICS INTERNATIONAL
IF
5.6
2013-03-01
5
PRE
AI
Lin, Chun-Ming; Kuo, Yu-Lin; Chou, Chia-Hao
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研究方向
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合作学者
合作期刊
D
Daniel I. Sessler
H 指数: 147 · 论文数: 1.5K
J
Jien‐Wei Yeh
H 指数: 90 · 论文数: 280
J
Julie M. Cairney
H 指数: 66 · 论文数: 426
H
Hiroshi Nishikawa
H 指数: 55 · 论文数: 886
M
Ming‐Hung Tsai
H 指数: 51 · 论文数: 158
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