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Hiroshi Nishikawa

The University of Osaka

55H指数
886论文数
1.3W被引数
收录论文 128
发表时间
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Effects of CoSn3 thin films on the grain orientations and electromigration behavior of wire-type solder jointsCoSn3薄膜对线型焊点晶粒取向和电迁移行为的影响
errMaterials Science in Semiconductor Processing
IF4.6
err2026-09-21
err0
errOAAI
errXinjie Wang; Hiroaki Tatsumi; Chia-Lin Li; Jyh-Wei Lee; Hiroshi Nishikawa
err分享
err收藏
Low-temperature hybrid bonding using sequential ArH2 and ArH2N2 low-inductance antenna plasma-assisted activation低温混合键合采用顺序ArH2和ArH2N2低电感天线等离子体辅助激活
errJOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
IF1.2
err2026-05-01
err0
PREAI
errShimizu, Hideki; Nishikawa, Hiroshi; Hashimoto, Koji
err分享
err收藏
Effect of surface-modified nanoparticles on microstructure and hardness of low-temperature solder alloys表面改性纳米粒子对低温焊料合金微观结构和硬度的影响
errSurfaces and Interfaces
IF6.3
err2026-02-14
err0
errOAAI
errShunya Nitta; Hiroaki Tatsumi; Atsushi M Ito; Arimichi Takayama; Takeshi Wada; Hidemi Kato; Hiroshi Nishikawa
err分享
err收藏
Experimental and first-principles insights into Ti-mediated Cu–Si3N4 interfaces for high-reliability electronic substrates实验与第一性原理对Ti介导的Cu–Si3N4界面在可靠性电子基板中的应用研究
errActa Materialia
IF9.3
err2025-12-05
err0
errOAAI
errHiroaki Tatsumi; Shunya Nitta; Atsushi M. Ito; Arimichi Takayama; Makoto Takahashi; Seongjae Moon; Eiki Tsushima; Hiroshi Nishikawa
err分享
err收藏
Mechanism of void growth in electroless copper plating layer of microvias in high-density interconnect packaging substrates高密度互连封装基板中微孔电镀铜层中空隙生长的机理
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ENGINEERING
IF4.5
err2025-12-04
err1
PREAI
errHsieh, Ming-chun; Zhang, Zheng; Nishijima, Masahiko; Okumura, Rieko; Seto, Hiroki; Nishikawa, Hiroshi; Suganuma, Katsuaki
err分享
err收藏
Ion milling-enhanced preferential growth of CoSn3 for crystallographic orientation control of Sn on polycrystalline Co substrates离子铣削增强的CoSn3优先生长，用于多晶Co基板上Sn的晶体取向控制
errMATERIALS & DESIGN
IF7.9
err2025-12-01
err0
errOAAI
errWang, Xinjie; Tatsumi, Hiroaki; Li, Chia-Lin; Lee, Jyh-Wei; Nishikawa, Hiroshi
err分享
err收藏
Isolation and characterization of a novel halotolerant selenate-reducing bacterium, Citrobacter koseri Y2分离和鉴定一株新型的耐盐硫酸盐还原菌，Citrobacter koseri Y2
errJournal of Bioscience and Bioengineering
IF2.9
err2025-12-01
err0
PREAI
errOkahata, Shunsuke; Ueda, Yuya; Kikuchi, Yuki; Naoe, Takuya; Inoue, Daisuke; Dohra, Hideo; Nishikawa, Hiroshi; Ike, Michihiko
err分享
err收藏
Interfacial Strengthening of Epoxy Composites by Functionalized UiO-66 MOFs under Thermal Cycling热循环下功能化UiO-66 MOFs对环氧复合材料的界面增强
errJournal of Electronic Materials
IF2.5
err2025-12-01
err0
PREAI
errKe, Shuai; Luo, Cui; He, Siliang; Wang, Bo; Huang, Wei; Nishikawa, Hiroshi; Pan, Kailin
err分享
err收藏
Cu/Sn-58Bi/Microporous-Cu Composite Joint Formation via Capillary-Driven Transient Liquid-Phase Bonding Under Air AtmosphereCu/Sn-58Bi/Microporous-Cu复合连接的毛细作用瞬态液相键合形成（在空气气氛下）
errJournal of Electronic Materials
IF2.5
err2025-11-01
err0
PREAI
errXiong, Bifu; Luo, Cui; Li, Xingyu; Hu, Liangyin; Dong, Haobo; He, Siliang; Liang, Zhishen; Zhang, Ni; Qin, Hongbo; Nishikawa, Hiroshi
err分享
err收藏
Effect of copper on interfacial reaction and microstructure of soldering on aluminum substrate铜对铝基板上焊接界面反应和微观结构的影响
errJournal of Materials Research and Technology
IF6.6
err2025-07-08
err0
errOAAI
errJiahui Li; Yu-An Shen; Hiroaki Tatsumi; Hiren Kotadia; Runhua Gao; Hiroshi Nishikawa
err分享
err收藏
Lead whisker growth characteristics on satellites in Earth orbit地球轨道卫星上的锡须生长特性
errMaterialia
IF2.9
err2025-06-21
err0
PREAI
errShinichiro Ichimaru; Tsuyoshi Nakagawa; Norio Nemoto; Katsuaki Suganuma; Hiroaki Tatsumi; Hiroshi Nishikawa
err分享
err收藏
Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging等温老化过程中Bi2Te3/Ag界面的界面反应和IMC生长动力学
errINTERMETALLICS
IF4.8
err2025-04-01
err0
errOAAI
errPak, Seong-Woo; Tatsumi, Hiroaki; Wang, Jianhao; Wu, Albert T.; Nishikawa, Hiroshi
err分享
err收藏
Atomistic behavior of Cu-Cu solid-state bonding in polycrystalline Cu with high-density boundaries多晶Cu中Cu-Cu固态键合的原子行为及高密度边界
errMATERIALS & DESIGN
IF7.9
err2025-02-01
err1
errOAAI
errTatsumi, Hiroaki; Kao, C. R.; Nishikawa, Hiroshi
err分享
err收藏
Low-temperature soldering using Sn/Bi electrodeposited bilayer
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-02-01
err0
PREAI
errWang, Wei-Li; Cherng, Sheng-Jye; Huang, Yu-Ting; Gao, Runhua; Tatsumi, Hiroaki; Nishikawa, Hiroshi; Chen, Chih-Ming
err分享
err收藏
Properties of in-Sn-xCu alloys and their joints on a Cu substrate before and after isothermal aging等温时效前后Cu基板上的n-sn-xcu合金及其接头的性能
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2025-02-01
err0
PREAI
errHan, Le Duy; Bui, Van Hanh; Nguyen, Van Anh; Trinh, Quang Ngoc; Nishikawa, Hiroshi
err分享
err收藏
Mechanisms of multidrug resistance caused by an Ipi1 mutation in the fungal pathogen Candida glabrata伊普1突变引起的真菌病原体光滑念珠菌的多药耐药机制
errNATURE COMMUNICATIONS
IF15.7
err2025-01-25
err0
errOAAI
errMiyazaki, Taiga; Shimamura, Shintaro; Nagayoshi, Yohsuke; Nakayama, Hironobu; Morita, Akihiro; Tanaka, Yutaka; Matsumoto, Yasuhiko; Inamine, Tatsuo; Nishikawa, Hiroshi; Nakada, Nana; Sumiyoshi, Makoto; Hirayama, Tatsuro; Kohno, Shigeru; Mukae, Hiroshi
err分享
err收藏
Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal-organic decomposition
errJOURNAL OF MATERIALS SCIENCE
IF3.9
err2024-10-15
err0
errOAAI
errWang, Chuncheng; Tatsumi, Hiroaki; Nishikawa, Hiroshi
err分享
err收藏
Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition通过添加ag-si雾化颗粒调节热膨胀系数提高Ag膏烧结接头的休克可靠性
errMATERIALS & DESIGN
IF7.9
err2024-10-01
err0
errOAAI
errLi, Wangyun; Chen, Chuantong; Nishijima, Masahiko; Ueshima, Minoru; Nishikawa, Hiroshi; Suganuma, Katsuaki
err分享
err收藏
Substrate-Dependent Sintering Mechanism of Ag Nanostructures Derived from Ag-Based Complex由银基复合物衍生的银纳米结构的衬底依赖性烧结机理
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-09-27
err0
PREAI
errWang, Chuncheng; Tatsumi, Hiroaki; Kotadia, Hiren; Nishikawa, Hiroshi
err分享
err收藏
Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging
errVACUUM
IF3.9
err2024-09-01
err2
PREAI
errLi, Wangyun; Mo, Lanqing; Chen, Feng; Dai, Zongbei; Xu, Yiqin; He, Siliang; Nishikawa, Hiroshi
err分享
err收藏

研究方向

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合作学者
合作期刊
A
Akihisa Inoue
H 指数: 126 · 论文数: 2.5K
陈钟 封面图
陈钟 (Zhong Chen)
H 指数: 104 · 论文数: 1.2K
M
Michel P. Coleman
H 指数: 96 · 论文数: 477
孙
孙蓉 (Rong Sun)
H 指数: 89 · 论文数: 993
K
K. N. Tu
H 指数: 81 · 论文数: 651
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