未登录
分享
收藏
分享
收藏
分享
收藏
分享
收藏
分享
收藏On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Roshanghias, Ali; Dreissigacker, Marc; Scherf, Christina; Bretthauer, Christian; Rauter, Lukas; Zikulnig, Johanna; Braun, Tanja; Becker, Karl-F.; Rzepka, Sven; Schneider-Ramelow, Martin
分享
收藏
分享
收藏
分享
收藏