S.H. Mannan - Publications, H-index & Citations

S.H. Mannan

king's college london

25H指数

131论文数

2.8K被引数

收录论文 21

发表时间

Identification of microcrack initiation in pure Sn under coupled electro-vibration loading for electronic packaging applications 在电子封装应用中，纯锡在耦合电-振动载荷作用下的微裂纹萌生识别

Materialia

IF2.9

2026-06-23

PREAI

Fei Hu; Wangyun Li; Wu Yue; Samjid H. Mannan

Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations 通过实验结果和相场模拟识别锌在Sn–Cu焊料中的作用及界面金属间化合物的生长

Materials & Design

IF7.9

2025-11-29

OAAI

H.R. Kotadia; A. Rahnama; F. Tang; J.I. Ahuir-Torres; G. West; A. Das; S.H. Mannan

Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging

CORROSION SCIENCE

IF8.5

2022-12-01

PREAI

Zuo, Yang; Robador, Ana; Wickham, Martin; Mannan, Samjid H.

Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects

ACTA MATERIALIA

IF9.3

2022-09-01

PREAI

Zuo, Yang; Zhao, Cong; Robador, Ana; Wickham, Martin; Mannan, Samjid H.

Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods

SCIENTIFIC REPORTS

IF3.9

2021-04-21

OAAI

Jin, Zhi; Shen, Yu-An; Zuo, Yang; Chan, Y. C.; Mannan, S. H.; Nishikawa, Hiroshi

Conductive pattern, electrical and mechanical characterisation of gold nanorods inside porous alumina template

APPLIED SURFACE SCIENCE

IF6.9

2020-12-01

PREAI

Mansourian, A.; Saidpour, H.; Mannan, S. H.

Stereoscopic Nanoscale-Precision Growth of Free-Standing Silver Nanorods by Electron Beam Irradiation

JOURNAL OF PHYSICAL CHEMISTRY C

IF3.2

2016-09-06

OAAI

Mansourian, Ali; Paknejad, Seyed Amir; Zayats, Anatoly V.; Mannan, Samjid H.

Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects

MATERIALS

IF3.2

2016-05-31

OAAI

Chia, Pay Ying; Haseeb, A. S. M. A.; Mannan, Samjid Hassan

Tunable Ultra-high Aspect Ratio Nanorod Architectures grown on Porous Substrate via Electromigration

SCIENTIFIC REPORTS

IF3.9

2016-02-29

OAAI

Mansourian, Ali; Paknejad, Seyed Amir; Wen, Qiannan; Vizcay-Barrena, Gema; Fleck, Roland A.; Zayats, Anatoly V.; Mannan, Samjid H.

Thermally stable high temperature die attach solution

MATERIALS & DESIGN

IF7.9

2016-01-01

PREAI

Paknejad, Seyed Amir; Mansourian, Ali; Noh, Yohan; Khtatba, Khalid; Mannan, Samjid H.

Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2014-12-01

111

PREAI

Paknejad, S. A.; Dumas, G.; West, G.; Lewis, G.; Mannan, S. H.

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates 在Cu和ni-p衬底上添加Zn的SAC焊料中高温下金属间化合物的生长抑制

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2012-01-01

105

PREAI

Kotadia, H. R.; Mokhtari, O.; Clode, M. P.; Green, M. A.; Mannan, S. H.

The effect of ultrasound on the gold plating of silica nanoparticles for use in composite solders

ULTRASONICS SONOCHEMISTRY

IF9.7

2011-01-01

PREAI

Cobley, A. J.; Mason, T. J.; Alarjah, M.; Ashayer, R.; Mannan, S. H.

A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin

ACTA MATERIALIA

IF9.3

2008-11-01

OAAI

Chen, K.; Liu, C.; Whalley, D. C.; Hutt, D. A.; Li, J. F.; Mannan, S. H.

Dissolution and interfacial reaction of Nb in contact with the molten 521n-48Sn solder

ACTA MATERIALIA

IF9.3

2007-09-01

PREAI

Li, J. F.; Mannan, S. H.; Clode, M. P.; Johnston, C.; Crossley, A.

Comparison of interfacial reactions of Ni and Ni-P in extended contact with liquid Sn-Bi-based solders

ACTA MATERIALIA

IF9.3

2007-01-01

PREAI

Li, J. F.; Mannan, S. H.; Clode, M. P.; Chen, K.; Whalley, D. C.; Liu, C.; Hutt, D. A.

Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects

ACTA MATERIALIA

IF9.3

2006-06-01

212

PREAI

Li, J. F.; Mannan, S. H.; Clode, M. P.; Whalley, D. C.; Hutt, D. A.

Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies

SCRIPTA MATERIALIA

IF5.6

2006-05-01

PREAI

Li, JF; Mannan, SH; Clode, MP

Analysis of jamming networks in sheared suspensions

JOURNAL OF RHEOLOGY

IF3.2

2006-05-01

PREAI

Hillman, Simon R.; Mannan, Samjid H.

Edge effects in intermetallic compound crystal growth between Nb and molten 52In-48Sn solder

APPLIED PHYSICS LETTERS

IF3.6

2006-03-10

PREAI

Li, JF; Mannan, SH; Clode, MP

研究方向