logo
科言猫学术研究的AI总结
language
手机端手机端
  • Phone Feature微信小程序
简体中文简体中文
notice消息通知
博客博客
delete
arrow
返回
M

Myung Jun Kim

sungkyunkwan university

29H指数
161论文数
3.7K被引数
收录论文 87
发表时间
logo
Unidirectional Cu filling of TGVs using highly-concentrated Cu-MSA electrolytes使用高浓度Cu-MSA电解液对TGVs进行单向铜填充
errMATERIALS & DESIGN
IF7.9
err2026-10-07
err0
errOAAI
errChaebeen Yun; Seolim Yoon; Myung Jun Kim
err分享
err收藏
Single-additive Cu microvia filling by pulse-reverse electrodeposition using DPS采用DPS的脉冲反向电镀单添加剂铜微通孔填充
errElectrochimica Acta
IF5.6
err2026-09-24
err0
PREAI
errHuiju Seo; Jae Jeong Kim; Young Yoon; Myung Jun Kim
err分享
err收藏
Single-additive TSV filling achieved with a tris-ammonium-based suppressor使用基于三铵的抑制器实现单添加剂TSV填充
errMaterials & Design
IF7.9
err2026-01-24
err0
errOAAI
errHaejin Kwak; Youngran Seo; Hui Won Eom; Thomas P. Moffat; Dongwon Yoo; Myung Jun Kim
err分享
err收藏
Additive-directed electrodeposition of Ag nanoplates for electrochemical H2O2 detectionAg纳米片的加和物导向电沉积用于电化学H2O2检测
errSurfaces and Interfaces
IF6.3
err2025-12-06
err0
PREAI
errSeolim Yoon; Yujin Min; Myung Jun Kim
err分享
err收藏
Cysteine–halide ion synergy for suppressing side reactions on Zn anodes in AZIBs半胱氨酸–卤素离子协同作用抑制AZIBs中锌阳极的副反应
errElectrochimica Acta
IF5.6
err2025-11-20
err0
PREAI
errJiwoo Oh; Hana Lim; Myung Jun Kim
err分享
err收藏
Machine learning for voltammetric analysis of cu electroplating additives: electrochemically-guided design for dataset structure机器学习用于铜电镀添加剂的伏安分析：电化学引导的数据库结构设计
errJournal of Electroanalytical Chemistry
IF4.1
err2025-10-13
err0
PREAI
errWonyeong Jo; Young Yoon; Myung Jun Kim
err分享
err收藏
Water-attracting adsorbates for enhancing the cyclability of Zn anodes in aqueous Zn-ion batteries吸水吸附物可增强水性Zn离子电池中Zn阳极的循环能力
errJ. Mater. Chem. A
IF9.5
err2025-08-12
err0
PREAI
errHana Lim; Dongju Kim; Jiwoo Oh; Eunseo Yoo; Junyoung Mun; Minho Kim; Myung Jun Kim
err分享
err收藏
Formation of twin structures via Cu electrodeposition with SPS and Cl-通过SPS和Cl-辅助的Cu电沉积形成孪晶结构
errmaterials science materials in engineering
IF0
err2025-07-23
err0
PREAI
errJeongho Lee; Yoojin Hwang; Myung Jun Kim
err分享
err收藏
Pretreatments for photoresist-patterned wafer to improve Cu pillar electrodeposition
errJOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
IF6
err2025-05-01
err0
PREAI
errPark, Soo Woong; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Quantitative analyses of DPS and PEG-PPG in Cu electrolyte using machine learning with artificial neural network使用人工神经网络的机器学习定量分析Cu电解质中的DPS和peg-ppg
errELECTROCHIMICA ACTA
IF5.6
err2025-02-01
err0
PREAI
errKim, Jeong Wuk; Seo, Huiju; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Synergistic effect of CTA plus and Br- on defect-free TSV filling by Cu electrodepositionCTA plus和Br-对Cu电沉积无缺陷TSV填充的协同作用
errELECTROCHIMICA ACTA
IF5.6
err2024-11-01
err0
PREAI
errEom, Hui Won; Kwak, Haejin; Yang, Chung-Mo; Lee, Woon Young; Lee, Min Hyung; Kim, Myung Jun
err分享
err收藏
Enhancing Proton Exchange Membrane Water Electrolysis with a Checkered Carbon Matrix Containing Ir-Ru Nanoparticles用含有ir-ru纳米颗粒的方格碳基质增强质子交换膜水电解
errADVANCED ENERGY MATERIALS
IF26
err2024-08-29
err0
errOAAI
errHuynh, T. B. Ngoc; Song, Jihyeok; Bae, Hyo Eun; Sung, Yung-Eun; Kim, Myung Jun; Kwon, Oh Joong
err分享
err收藏
Cu microvia filling by pulse-reverse electrodeposition with a single accelerator使用单个加速器通过脉冲反向电沉积填充Cu微孔
errELECTROCHIMICA ACTA
IF5.6
err2024-06-01
err2
PREAI
errSeo, Huiju; Kim, Jounghee; Kang, Jungkyu; Park, Jong-Eun; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏
Therapeutic strategy using novel RET/YES1 dual-target inhibitor in lung cancer
errBIOMEDICINE & PHARMACOTHERAPY
IF7.5
err2024-02-01
err0
errOAAI
errChoi, Yong June; Choi, Munkyung; Park, Jaewoo; Park, Miso; Kim, Myung Jun; Lee, Jae-sun; Oh, Su-jin; Lee, Young Joo; Shim, Wan Seob; Kim, Ji Won; Kim, Myung Jin; Kim, Yong-Chul; Kang, Keon Wook
err分享
err收藏
Enhancement of heat dissipation in β-Ga2O3 Schottky diodes through Cu-filled thermal vias: experimental and simulation investigations
errJOURNAL OF MATERIALS CHEMISTRY C
IF5.1
err2024-01-01
err0
PREAI
errYou, Younghyun; Eom, Hui Won; Park, Jehwan; Kim, Myung Jun; Kim, Jihyun
err分享
err收藏
Behavior of a forest of NiFe nanowires in KOH and NaCl solution for water electrolysisNiFe纳米线在KOH和NaCl溶液中用于水电解的行为
errELECTROCHIMICA ACTA
IF5.6
err2023-11-01
err4
errOAAI
errCarbone, S.; Proietto, F.; Bonafede, F.; Oliveri, R. L.; Patella, B.; Ganci, F.; Aiello, G.; Mandin, P.; Kim, M.; Scopelliti, M.; Inguanta, R.
err分享
err收藏
Heat Treatment for Enhancing Ir-Based Catalysts Enclosed in a Carbon Layer for Electrochemical Oxygen Evolution Reaction热处理可增强封闭在碳层中的Ir基催化剂，以进行电化学析氧反应
errACS SUSTAINABLE CHEMISTRY & ENGINEERING
IF7.3
err2023-10-04
err4
PREAI
errHuynh, T. B. Ngoc; Choi, Yeongeun; Lee, Min Hyung; Oh, Sekwon; Kim, Myung Jun; Kwon, Oh Joong
err分享
err收藏
A cracked carbon matrix decorated with amorphous IrOx for boosting the oxygen evolution reaction in electrochemical water splitting用无定形IrOx装饰的裂化碳基质，用于促进电化学水分解中的析氧反应
errJOURNAL OF MATERIALS CHEMISTRY A
IF9.5
err2023-01-01
err11
PREAI
errHuynh, T. B. Ngoc; Lee, Dohyeon; Kim, Soo-Kil; Kim, Myung Jun; Kwon, Oh Joong
err分享
err收藏
Shape Control of Metal Nanostructures by Electrodeposition and their Applications in Electrocatalysis电沉积金属纳米结构的形状控制及其在电催化中的应用
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2022-11-17
err7
PREAI
errYeo, Kyeong-Rim; Eo, Jooyoung; Kim, Myung Jun; Kim, Soo-Kil
err分享
err收藏
Electrodeposition of Nano-Twinned Cu and their Applications in Electronics纳米孪晶Cu的电沉积及其在电子学中的应用
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2022-11-04
err11
PREAI
errPark, Soo Woong; Eom, Hui Won; Kim, Myung Jun; Kim, Jae Jeong
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
Y
Yung‐Eun Sung
H 指数: 100 · 论文数: 754
S
Soo Young Kim
H 指数: 86 · 论文数: 627
B
Benjamin J. Wiley
H 指数: 78 · 论文数: 219
K
Ken Gall
H 指数: 78 · 论文数: 445
M
Myeong‐Jin Kim
H 指数: 73 · 论文数: 914
查看更多