Jiefei Gu

jiangnan university

H指数:14

被引数:690

个人简介

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Advances in copper pillar bumps for high-density electronic packaging

高密度电子封装中铜柱凸点的进展

Materials Science in Semiconductor Processing

IF4.6

2026-04-270

PRE

Noise-robust compound fault diagnosis of rolling bearing using a sparse bayesian framework with interpretable prior knowledge

基于可解释先验知识的稀疏贝叶斯框架下的抗噪复合故障诊断方法研究

Engineering Research Express

IF1.6

2025-12-310

PRE

Flip-chip microbumps reliability Study: Enhancing defect features of vibration signals using dual-drive adaptive reweighted sparse framework

倒装芯片微凸点可靠性研究：利用双驱动自适应重加权稀疏框架增强振动信号缺陷特征

Mechanical Systems and Signal Processing

IF8.9

2025-10-090

PRE

A fault mechanism-guided interpretable causal disentanglement domain generalization detection method for typical faults of induction motor

一种基于故障机理引导的可解释因果解耦领域泛化检测方法，用于感应电机典型故障

Advanced Engineering Informatics

IF9.9

2025-09-080

PRE

Semi-supervised dual-constraint centroid contrastive prototypical network for flip chip defect detection under limited labeled data

半监督双约束中心对比原型网络在有限标注数据下的倒装芯片缺陷检测

ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE

IF8

2025-06-090

PRE

Loose particle Detection: The optimal detection condition and weak loose particle impulse extraction

MECHANICAL SYSTEMS AND SIGNAL PROCESSING

IF8.9

2025-02-010

PRE

Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection

寻找具有可视化振动信号架构功能的双收敛稀疏特征提取器，用于倒装芯片缺陷检测

IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS

IF9.9

2024-08-010

PRE

X-ray detection of ceramic packaging chip solder defects based on improved YOLOv5

NDT & E INTERNATIONAL

IF4.5

2024-04-019

PRE

Flip-chip solder bumps defect detection using a self-search lightweight framework

ADVANCED ENGINEERING INFORMATICS

IF9.9

2024-04-011

PRE

Category-level selective dual-adversarial network using significance-augmented unsupervised domain adaptation for surface defect detection

使用重要性增强无监督域自适应的类别级选择性对偶网络进行表面缺陷检测

EXPERT SYSTEMS WITH APPLICATIONS

IF7.5

2024-03-017

PRE

Intelligent defect inspection of flip chip based on vibration signals and improved gcForest

MEASUREMENT

IF5.6

2023-06-016

PRE

An improved orthogonal matching pursuit method for denoising high-frequency ultrasonic detection signals of flip chips

MECHANICAL SYSTEMS AND SIGNAL PROCESSING

IF8.9

2023-04-018

PRE

Experimental investigation on the buckling and post-buckling behavior of variable stiffness laminates

THIN-WALLED STRUCTURES

IF6.6

2023-03-0110

PRE

Rotating machinery fault detection and diagnosis based on deep domain adaptation: A survey

基于深度域自适应的旋转机械故障检测与诊断研究综述

CHINESE JOURNAL OF AERONAUTICS

IF5.7

2023-01-0172

OAAI

A Novel Three-Probability Spaces Logic Decoupling Distillation for Flip-Chip Defect Detection

用于倒装芯片缺陷检测的新型三概率空间逻辑解耦蒸馏

IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT

IF5.9

2023-01-012

PRE

A novel approach for flip chip inspection based on improved SDELM and vibration signals

SCIENCE CHINA-TECHNOLOGICAL SCIENCES

IF4.9

2022-02-246

PRE

Sparse Reconstruction for Microdefect Detection of Two-Dimensional Ultrasound Image Based on Blind Estimation

基于盲估计的二维超声图像微缺陷检测稀疏重构

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

IF7.2

2021-10-018

PREAI

Visual inspection of steel surface defects based on domain adaptation and adaptive convolutional neural network

MECHANICAL SYSTEMS AND SIGNAL PROCESSING

IF8.9

2021-05-0155

PREAI

A theoretical and experimental assessment of 3D macroscopic failure criteria for predicting pure inter-fiber fracture of transversely isotropic UD composites

用于预测横向各向同性UD复合材料的纯纤维间断裂的3D宏观破坏准则的理论和实验评估

COMPOSITE STRUCTURES

IF7.1

2021-03-0120

PREAI

Rationalized improvement of Tsai-Wu failure criterion considering different failure modes of composite materials

COMPOSITE STRUCTURES

IF7.1

2021-01-0144

PREAI

Jiefei Gu

个人简介

教育背景

工作经历

荣誉奖项

研究方向