Subramanian S. Iyer - Publications, H-index & Citations

Subramanian S. Iyer

University of California System

44H指数

351论文数

7.3K被引数

收录论文 13

发表时间

Secure artificial intelligence at the edge 在边缘保护人工智能

PHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES

IF3.7

2025-01-16

PREAI

Sehatbakhsh, Nader; Pamarti, Sudhakar; Roychowdhary, Vwani; Iyer, Subramanian

3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices 用于可穿戴设备的3D柔性扇出晶圆级封装

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC

IF0

2023-05-01

PREAI

Ouyang, Guangqi; Fukushima, Takafumi; Ren, Haoxiang; Iyer, Subramanian S.

Fabrication of Flexible Li-ion Battery Electrodes Using Battlets Approach with Ionic Liquid Electrolyte for Powering Wearable Devices 使用带有离子液体电解质的Battlets方法制造柔性锂离子电池电极，为可穿戴设备供电

ieee

IF0

2022-05-01

PREAI

Ouyang, Guangqi; Whang, Grace; MacInnis, Emily; Ren, Haoxiang; Sun, Henry; Irwin, Randall; Dunn, Bruce; Iyer, Subramanian S.

A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils

ieee

IF0

2021-06-01

PREAI

Ouyang, Guangqi; Ezhilarasu, Goutham; Sun, Henry; Ren, Haoxiang; Yang, Yu-Tao; Iyer, Subramanian S.

Fabrication of Flexible Ionic-Liquid Thin Film Battery Matrix on FlexTrate™ for Powering Wearable Devices 柔性离子液体薄膜电池基体的制备™用于为可穿戴设备供电

ieee

IF0

2021-06-01

PREAI

Ouyang, Guangqi; Whang, Grace; MacInnis, Emily; Iyer, Subramanian S.

Nb-based superconducting silicon interconnect fabric for cryogenic electronics 用于低温电子的基于Nb的超导硅互连结构

QUANTUM SCIENCE AND TECHNOLOGY

IF5

2021-02-24

PREAI

Yang, Yu-Tao; Hu, Chaowei; Zhang, Peng; Shakoorzadeh, Niloofar; Ni, Ni; Wang, Kang L.; Iyer, Subramanian S.

Heterogenous Integration of MEMS Gas Sensor using FOWLP : Personal Environment Monitors

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)

IF0

2020-06-01

PREAI

Benedict, Samatha; Nagarajan, Ashvin; Thejas, K.; Alam, Arsalan; Illango, Murugaiya Sridar; Ezhilarasu, Goutham; Prajapati, Chandra Shekhar; Bhat, Navakanta; Iyer, Subramanian

Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias

IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS

IF3.8

2016-09-01

PREAI

Kirihata, Toshiaki; Golz, John; Wordeman, Matthew; Batra, Pooja; Maier, Gary W.; Robson, Norman; Graves-abe, Troy L.; Berger, Daniel; Iyer, Subramanian S.

Three-dimensional integration: An industry perspective

MRS BULLETIN

IF4.9

2015-03-10

PREAI

Iyer, Subramanian S.

Technical Perspective Silicon Stress

COMMUNICATIONS OF THE ACM

IF12.2

2014-01-01

PREAI

Iyer, Subramanian S.