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S

Sandeep Goel

national yang ming chiao tung university

25H指数
212论文数
2.1K被引数
收录论文 9
发表时间
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Guest Editorial: 2.5-D/3-D Chiplet Circuits and Systems, EDA, Advanced Packaging, and TestPart II
errIEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
IF3.8
err2025-12-01
err0
PREAI
errHao, Qin-Fen; Chen, Kuan-Neng; Goel, Sandeep Kumar; Li, Hai; Marinissen, Erik Jan
err分享
err收藏
The insidious hyperreality in financial markets: An integrative review with evidence from the Indian financial market金融市场中阴险的超现实: 来自印度金融市场的证据的综合回顾
errINTERNATIONAL REVIEW OF FINANCIAL ANALYSIS
IF9.8
err2023-11-01
err4
PREAI
errDhasmana, Samriddhi; Goel, Sandeep
err分享
err收藏
Corporate governance practices in the mining industry of India: an application of CG index
errMINERAL ECONOMICS
IF3.5
err2023-01-30
err0
PREAI
errPramani, Rahul Govind; Goel, Sandeep; Ray, Rupamanjari Sinha; Babu, A. Sarath
err分享
err收藏
Board Characteristics, Firm Profitability and Earnings Management: Evidence from India
erraccounting review
IF3.3
err2016-12-17
err37
PREAI
errKapoor, Nimisha; Goel, Sandeep
err分享
err收藏
Abort-on-Fail Test Scheduling for Modular SOCs without and with Preemption
errIEEE TRANSACTIONS ON COMPUTERS
IF3.8
err2015-12-01
err5
PREAI
errIngelsson, Urban; Goel, Sandeep Kumar; Larsson, Erik; Marinissen, Erik Jan
err分享
err收藏
Testing of SoCs with Hierarchical Cores: Common Fallacies, Test Access Optimization, and Test Scheduling具有分层核心的soc测试: 常见谬误，测试访问优化和测试调度
errIEEE TRANSACTIONS ON COMPUTERS
IF3.8
err2009-03-01
err41
errOAAI
errGoel, Sandeep Kumar; Marinissen, Erik Jan; Sehgal, Anuja; Chakrabarty, Krishnendu
err分享
err收藏
A theoretical study of electromagnetic transients in a large plate due to voltage impact excitation
errPROGRESS IN ELECTROMAGNETICS RESEARCH-PIER
IF9.3
err2008-01-01
err3
errOAAI
errMukerji, S. K.; Singh, G. K.; Goel, S. K.; Manuja, S.
err分享
err收藏
A theoretical study of electromagnetic transients in a large conducting plate due to current impact excitation
errPROGRESS IN ELECTROMAGNETICS RESEARCH-PIER
IF9.3
err2007-01-01
err5
errOAAI
errMukerji, S. K.; Singh, G. K.; Goel, S. K.; Manuja, S.
err分享
err收藏
Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test—Part I客座编辑 2.5D/3D 芯粒电路与系统、EDA、先进封装及测试——第一部分
errIEEE Journal on Emerging and Selected Topics in Circuits and Systems
IF3.8
err
err0
PREAI
errQinfen Hao; Kuan-Neng Chen; Sandeep Kumar Goel; Hai Li; Erik Jan Marinissen
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
K
Krishnendu Chakrabarty
H 指数: 80 · 论文数: 1.4K
李海 封面图
李海 (Hai Li)
H 指数: 61 · 论文数: 694
E
Erik Jan Marinissen
H 指数: 45 · 论文数: 281
K
Kuan‐Neng Chen
H 指数: 40 · 论文数: 321
G
Ghanshyam Singh
H 指数: 37 · 论文数: 525
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