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D

David Bušek

electrotechnology

17H指数
111论文数
843被引数
收录论文 25
发表时间
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Quality and microstructural analysis of SnBiAg-xTiO2 composite low-temperature solder jointsSnBiAg-xTiO2复合材料低温焊点的质量与微观结构分析
errJournal of Materials Research and Technology
IF6.6
err2026-03-04
err0
errOAAI
errBalázs Illés; Krzysztof Szostak; Andras Hegyessy; Karel Dušek; David Bušek; Attila Géczy
err分享
err收藏
Vapour phase reflow soldering with vertical assembly stacking to improve productivity
errRESULTS IN ENGINEERING
IF7.9
err2025-03-01
err0
errOAAI
errHavellant, Gergo; Illes, Balazs; Kovacs, Patrik; Busek, David; Dusek, Karel; Geczy, Attila
err分享
err收藏
Effects of ZrO2 Nano-Particles' Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical Study
errNANOMATERIALS
IF4.3
err2024-10-12
err3
errOAAI
errSkwarek, Agata; Choi, Halim; Hurtony, Tamas; Byun, Jaeduk; Mohamad, Ahmad Azmin; Busek, David; Dusek, Karel; Illes, Balazs
err分享
err收藏
A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation
errMATERIALS
IF3.2
err2024-06-02
err0
errOAAI
errSorokina, Kristina; Dusek, Karel; Busek, David
err分享
err收藏
Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring
errCASE STUDIES IN THERMAL ENGINEERING
IF6.4
err2024-05-01
err2
errOAAI
errHavellant, Gergo; Illes, Balazs; Busek, David; Geczy, Attila
err分享
err收藏
Personal Air-Quality Monitoring with Sensor-Based Wireless Internet-of-Things Electronics Embedded in Protective Face Masks
errSENSORS
IF3.5
err2024-04-18
err1
errOAAI
errKuglics, Lajos; Geczy, Attila; Dusek, Karel; Busek, David; Illes, Balazs
err分享
err收藏
Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study
errSCRIPTA MATERIALIA
IF5.6
err2024-04-01
err5
errOAAI
errIlles, Balazas; Michalowski, Pawel Piotr; Skwarek, Agata; Choi, Halim; Byun, Jaeduk; Dusek, Karel; Busek, David; Pietruszka, Adrian
err分享
err收藏
Effect of non-standard SnAg surface finishes on properties of solder joints
errAPPLIED SURFACE SCIENCE ADVANCES
IF8.7
err2023-12-01
err1
errOAAI
errPietrikova, Alena; Dzivy, Daniel; Provazek, Peter; Livovsky, Lubomir; Dzunda, Robert; Dusek, Karel; Busek, David
err分享
err收藏
Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study
errCERAMICS INTERNATIONAL
IF5.6
err2023-07-01
err11
errOAAI
errIlles, Balazs; Choi, Halim; Byun, Jaeduk; Dusek, Karel; Busek, David; Skwarek, Agata
err分享
err收藏
Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic
errMATERIALS
IF3.2
err2023-01-17
err2
errOAAI
errGeczy, Attila; Havellant, Gergo; Batorfi, Reka; Skwarek, Agata; Dusek, Karel; Busek, David; Illes, Balazs
err分享
err收藏
Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2022-09-01
err18
errOAAI
errIlles, Balazs; Choi, Halim; Hurtony, Tamas; Dusek, Karel; Busek, David; Skwarek, Agata
err分享
err收藏
Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment
errCASE STUDIES IN THERMAL ENGINEERING
IF6.4
err2022-05-01
err8
errOAAI
errStraubinger, Daniel; Illes, Balazs; Busek, David; Codreanu, Norocel; Geczy, Attila
err分享
err收藏
Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation基于nernst-plank方程的Cu电化学迁移数值模拟
errINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
IF5.8
err2022-03-01
err17
errOAAI
errIlles, Balazs; Medgyes, Balint; Dusek, Karel; Busek, David; Skwarek, Agata; Geczy, Attila
err分享
err收藏
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints助焊剂及相关因素对SAC305焊点内金属间层生长的影响
errMATERIALS
IF3.2
err2021-12-20
err7
errOAAI
errDusek, Karel; Vesely, Petr; Busek, David; Petrac, Adam; Geczy, Attila; Illes, Balazs; Krammer, Oliver
err分享
err收藏
Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers
errVACUUM
IF3.9
err2021-05-01
err9
errOAAI
errIlles, Balazs; Hurtony, Tamas; Medgyes, Balint; Krammer, Oliver; Dusek, Karel; Busek, David
err分享
err收藏
Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates
errMATERIALS
IF3.2
err2020-11-20
err4
errOAAI
errHurtony, Tamas; Krammer, Oliver; Illes, Balazs; Harsanyi, Gabor; Busek, David; Dusek, Karel
err分享
err收藏
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb
errMATERIALS
IF3.2
err2020-02-21
err3
errOAAI
errSkwarek, Agata; Illes, Balazs; Hurtony, Tamas; Busek, David; Dusek, Karel
err分享
err收藏
Analysis of no-clean flux spatter during the soldering process
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2020-01-01
err26
PREAI
errVesely, P.; Busek, D.; Krammer, O.; Dusek, K.
err分享
err收藏
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
errMATERIALS
IF3.2
err2019-11-03
err13
errOAAI
errIlles, Balazs; Hurtony, Tamas; Krammer, Oliver; Medgyes, Balint; Dusek, Karel; Busek, David
err分享
err收藏
The influence of the crystallographic structure of the intermetallic grains on tin whisker growth
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2019-05-01
err20
errOAAI
errIlles, Balazs; Skwarek, Agata; Ratajczak, Jacek; Dusek, Karel; Busek, David
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
A
Ahmad Azmin Mohamad
H 指数: 41 · 论文数: 251
G
Gábor Harsányi
H 指数: 29 · 论文数: 203
B
Balázs Illés
H 指数: 29 · 论文数: 216
A
András Szilágyi
H 指数: 27 · 论文数: 95
B
Benjámin Gyarmati
H 指数: 23 · 论文数: 64
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