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T

Tao Hang

Shanghai Jiao Tong University

32H指数
194论文数
4.0K被引数
收录论文 99
发表时间
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Optimized modeling for adsorption behavior of 3-amino-5-mercapto-1,2,4-triazole in copper chemical mechanical polishing铜化学机械抛光中3-氨基-5-巯基-1,2,4-三唑吸附行为的优化建模
errJournal of Molecular Structure
IF4.7
err2026-08-25
err0
PREAI
errYifan Chen; Pengfei Chang; Yulong Chen; Nuo Lv; Xiaolin Tian; Huiqin Ling; Tao Hang
err分享
err收藏
Corrosion inhibition performance of three imidazole derivatives in acidic etching solutions to fabricate copper lines of printed circuit boards
errSurfaces and Interfaces
IF6.3
err2026-01-28
err0
PREAI
errXue Yang; Miao Yu; Tao Hang; Wenjing Chen; Xianming Chen; Mingji Zhou; Chunqin Yang; Jianjun Zhang; Houwen Liu; Zongyi Ma; Min Zhu; Yuanming Chen
err分享
err收藏
Low-temperature bonding via micro-cone array insertion with indium-mediated interfacial void elimination
errSurfaces and Interfaces
IF6.3
err2026-01-20
err0
PREAI
errYuanxun Cui; Chongyang Li; Anmin Hu; Ming Li; Tao Hang
err分享
err收藏
Ethyl maltol as a green complexing agent for chemical mechanical polishing of cobalt interconnects to achieve high removal rate and nanometer scale smoothness乙基麦芽酚作为一种绿色络合剂，用于钴互连的化学机械抛光，以实现高去除率和纳米级平滑度。
errApplied Surface Science
IF6.9
err2025-09-03
err0
PREAI
errNuo Lv; Pengfei Chang; Yulong Chen; Chuang Jiang; Li Ma; Hongqi Sun; Tao Hang
err分享
err收藏
Development of NiW coatings with low stress and excellent anticorrosion performance by grain refinement for electronic connector application通过晶粒细化开发低应力、优异抗腐蚀性能的NiW涂层，用于电子连接器应用
errApplied Surface Science
IF6.9
err2025-09-01
err0
PREAI
errHaibo Wang; Pengfei Chang; Ming Li; Tao Hang; Huiqin Ling
err分享
err收藏
Dendrites-Free Zn Anode Enabled by Dense Zn Deposition and Spontaneous Texture Reconstruction on (110)-Oriented Nanotwinned Cu通过密集Zn沉积和(110)-取向纳米孪晶Cu上的自发织构重构实现的免枝晶Zn阳极
errAdvanced Functional Materials
IF19
err2025-08-13
err0
PREAI
errYuhang Li; Xiangyu Ren; Dewei Zhang; Shenghong Ju; Wang Hu; Tao Hang; Ming Li; Yunwen Wu
err分享
err收藏
The influence of amino and carboxyl groups on the corrosion inhibition performance of Azole inhibitors in chemical mechanical polishing processes氨基和羧基对化学机械抛光过程中唑类缓蚀剂缓蚀性能的影响
errCOLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
IF5.4
err2025-06-15
err0
PREAI
errChen, Yulong; Chang, Pengfei; Lv, Nuo; Chen, Yifan; Tian, Xiaolin; Ling, Huiqin; Sun, Hongqi; Hang, Tao
err分享
err收藏
Enhanced corrosion resistance of Co-W alloy coatings through multilayering strategy通过多层结构策略增强Co-W合金涂层的耐腐蚀性能
errMATERIALS LETTERS
IF2.7
err2025-04-01
err0
PREAI
errKuang, Yuang; Lei, Han; Chang, Pengfei; Hang, Tao; Li, Ming
err分享
err收藏
Unveiling electron scattering mechanism at Al-doped grain boundaries in Cu interconnects揭示Cu互连中Al掺杂晶界处的电子散射机制
errMATERIALS & DESIGN
IF7.9
err2025-03-01
err0
errOAAI
errJin, Xinyu; Ren, Xiangyu; Cui, Guoxiang; Ju, Shenghong; Hang, Tao; Li, Ming
err分享
err收藏
Ablation resistance and current-carrying friction performance of WMoCu alloy with different Mo contents
errTRIBOLOGY INTERNATIONAL
IF6.9
err2025-03-01
err1
PREAI
errWang, Xu; Song, Kexing; Feng, Jiang; Xing, Jiandong; Hang, Tao; Zhang, Yiming
err分享
err收藏
Investigation of phenyl methyl sulfoxide as an additive for cobalt super-filling in 3D interconnect
errSURFACES AND INTERFACES
IF6.3
err2025-01-01
err0
PREAI
errWu, Yunwen; Zhang, Mengyun; Jiang, Yuhang; Tong, Yiting; Chang, Pengfei; Hang, Tao; Li, Ming
err分享
err收藏
Abnormal grain growth of (110)-oriented perpendicular nanotwinned copper into ultra-large grains at low temperatures
errJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
IF14.3
err2024-12-01
err3
PREAI
errChen, Peixin; Li, Chongyang; Han, Silin; Hang, Tao; Ling, Huiqin; Wu, Yunwen; Li, Ming
err分享
err收藏
Investigation of grain growth and impurity diffusion in highly conductive copper interconnect films obtained by pulsed laser scanning annealing通过脉冲激光扫描退火获得的高导电铜互连膜中晶粒生长和杂质扩散的研究
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2024-12-01
err0
PREAI
errHan, Silin; Zhou, Zihan; Chen, Peixin; Wu, Yunwen; Li, Ming; Hang, Tao
err分享
err收藏
A design of green slurry for copper/cobalt barrier-step chemical mechanical polishing with controlled removal selectivity and dynamic galvanic corrosion inhibition
errSURFACES AND INTERFACES
IF6.3
err2024-12-01
err0
PREAI
errChang, Pengfei; Huang, Zisheng; Ling, Huiqin; Wu, Yunwen; Li, Ming; Hang, Tao
err分享
err收藏
Rational utilization of the size and electronic effect of inhibitors enabling high polishing rate with minimum corrosion in copper chemical mechanical polishing
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-11-01
err1
PREAI
errChang, Pengfei; Huang, Zisheng; Chen, Yulong; Ling, Huiqin; Wu, Yunwen; Li, Ming; Shacham-Diamand, Yosi; Hang, Tao
err分享
err收藏
Effect of Superfilling and Leveling Inhibitors in Hybrid Additives on the Microstructure Evolution of Electroplated Copper Interconnect Films during Self-Annealing
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2024-09-30
err0
errOAAI
errHan, Silin; Zhang, Mengyun; Chen, Yuhang; Wu, Yunwen; Li, Ming; Hang, Tao
err分享
err收藏
Controlled corrosion behaviors of copper in oxidizer solutions for chemical mechanical polishing: Influence of the decomposition products
errCORROSION SCIENCE
IF8.5
err2024-09-01
err0
PREAI
errChang, Pengfei; Huang, Zisheng; Chen, Yulong; Ling, Huiqin; Wu, Yunwen; Li, Ming; Hang, Tao
err分享
err收藏
Inhibitor Alkyne-PEG4-amine Contributes to Cobalt Superfilling
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-08-05
err0
PREAI
errTong, Yiting; Lai, Dawei; Li, Ya; Hang, Tao; Li, Ming; Wu, Yunwen
err分享
err收藏
Unveiling polycrystalline silicon channel dissolution mechanism in wet etching process of 3D NAND fabrication
errSURFACES AND INTERFACES
IF6.3
err2024-07-01
err0
PREAI
errZhou, Zihan; Wu, Yunwen; Han, Silin; Hang, Tao; Ling, Huiqin; Guo, Jie; Wang, Su; Li, Ming
err分享
err收藏
The influence of sub-surface damage microstructure on ultra-thin die flexural strength
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-07-01
err0
errOAAI
errShu, Liu; Li, Chongyang; Wu, Yunwen; Hang, Tao; Liu, Lei; Li, Ming
err分享
err收藏

研究方向

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合作期刊
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