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J

Jeong‐Won Yoon

Chungbuk National University

37H指数
218论文数
4.3K被引数
收录论文 65
发表时间
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High-Performance Piezoresistive Sensors via Pd/Sn-Free Graphene-Catalyzed Metallization of Thermally Repairable Microfiber Scaffolds高性能压阻传感器通过钯/锡自由石墨烯催化对热修复微纤维支架的金属化
errAdvanced Science
IF14.1
err2026-09-26
err0
errOAAI
errByungJun Kim; Su Bin Choi; Yeonwook Jeong; Jeong-Won Yoon; Seung-Boo Jung; Jong-Woong Kim
err分享
err收藏
Effects of Cu core balls on the mechanical properties and electromigration reliability of Sn-57Bi-1Ag solder jointsCu核微球对Sn-57Bi-1Ag焊点力学性能和电迁移可靠性的影响
errJournal of Materials Research and Technology-JMR&T
IF6.6
err2026-09-23
err0
errOAAI
errEun-Su Jang; Dong-Bok Lee; Jeong-Won Yoon
err分享
err收藏
Effects of intense pulsed light on microstructural evolution and reliability of TiC-reinforced Sn58Bi/Sn3.0Ag0.5Cu hybrid solder joints强脉冲光对TiC增强Sn58Bi/Sn3.0Ag0.5Cu复合焊点微观结构演变及可靠性的影响
errMaterials Characterization
IF5.5
err2026-08-01
err0
PREAI
errLim, Kwan-Soo; Kim, Min-Jae; Jung, Seung-Boo; Yoon, Jeong-Won
err分享
err收藏
Soldering characteristics of active metal brazing ceramic substrates with various surface finishes活性金属钎焊陶瓷基板在不同表面处理条件下的焊接特性
errJournal of Materials Research and Technology-JMR&T
IF6.6
err2026-07-31
err0
errOAAI
errEun-Su Jang; Jee-Yeon Park; Eun-Chae Noh; Chul-Min Oh; Jeong-Won Yoon
err分享
err收藏
Bonding properties and interfacial diffusion mechanism of low-temperature Cu–Cu bonded joints using electroless Ag layer低温Cu–Cu键合连接件的键合性能及电镀Ag层界面扩散机制
errJournal of Materials Research and Technology-JMR&T
IF6.6
err2026-07-23
err0
errOAAI
errSong-Yeon Baek; Jeong-Won Yoon
err分享
err收藏
Interfacial stability of solder joints under multiple reflow cycles: A comparison of intense pulsed light, laser, and reflow soldering在多次回流循环下焊点的界面稳定性：强脉冲光、激光和回流焊接的比较
errJournal of Materials Research and Technology-JMR&T
IF6.6
err2026-07-01
err0
PREAI
errLee, Hyo-Won; Noh, Eun-Chae; Yoon, Jeong-Won
err分享
err收藏
Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL SolderingSn修饰MWCNT增强Sn-3.0Ag-0.5Cu复合焊料的制备与结合强度：回流焊与IPL焊接的比较
errMaterials
IF3.2
err2026-05-22
err0
errOAAI
errDongGil Kang; HoGyeong Seong; JaeJun Yoon; MinJae Sung; JinHo Joo; JeongWon Yoon; SeungBoo Jung
err分享
err收藏
Rapid equiaxed Cu3Sn formation and high-temperature reliability of transient liquid phase bonding with an Sn/2 μm Cu/Sn preform快速等轴Cu3Sn的形成及含Sn/2 μm Cu/Sn预制片的瞬时液相键合的高温可靠性
errJournal of Materials Research and Technology
IF6.6
err2026-04-22
err0
errOAAI
errDong-Bok Lee; Jeong-Won Yoon
err分享
err收藏
Advantages of intense pulsed light soldering: Compared with traditional reflow soldering and alternative laser soldering高强度脉冲光焊接的优势：与传统再流焊接和替代激光焊接相比
errJournal of Materials Research and Technology
IF6.6
err2026-03-27
err0
errOAAI
errHyo-Won Lee; Eun-Chae Noh; Kwan-Soo Lim; Dong-Bok Lee; Seung-Boo Jung; Jong-Woong Kim; Jeong-Won Yoon
err分享
err收藏
High-Temperature Long-Term reliability of transient liquid phase bonding using Sn/Ni/Sn laminated metal preform
errEngineering Failure Analysis
IF5.7
err2026-01-23
err0
PREAI
errDong-Bok Lee; Jeong-Won Yoon
err分享
err收藏
Substrate surface finish-dependent strength evolution and reliability of ultrasonic bonded power module terminal joints
errmaterials science and engineering: a
IF0
err2026-01-07
err0
PREAI
errDong-Bok Lee; Kwan-Soo Lim; Hyojin Park; Ji-Hyung Lee; Semin Park; Chul-Min Oh; Jeong-Won Yoon
err分享
err收藏
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging基于强脉冲光钎焊的超快半导体芯片键合技术用于玻璃基板封装芯片
errACS Omega
IF4.3
err2025-11-08
err0
errOAAI
errTaejoon Noh; Eun-Chae Noh; Minjae Sung; Jaejun Yoon; Ho-Kyeong Seong; Dong-Gil Kang; Jeong-Won Yoon; Seung-Boo Jung
err分享
err收藏
Novel surface finish with nanometer-thick Al2O3 layers via atomic layer deposition process: Properties of solder joint for advanced semiconductor packaging通过原子层沉积工艺制备的纳米级Al₂O₃层新型表面处理：先进半导体封装中焊点连接的性能
errMaterials Characterization
IF5.5
err2025-10-21
err0
PREAI
errEun-Chae Noh; Min Jeong Kim; Seyoung Oh; Byungjin Cho; Jeong-Won Yoon
err分享
err收藏
Microstructural and mechanical properties of Sn58Bi/Sn3.0Ag0.5Cu hybrid solder joints containing TiC nanoparticle additions添加TiC纳米粒子的Sn58Bi/Sn3.0Ag0.5Cu混合焊点的微观结构和力学性能
errJournal of Materials Research and Technology
IF6.6
err2025-09-24
err0
errOAAI
errKwan-Soo Lim; Jeong-Won Yoon
err分享
err收藏
Sn-3.0Ag-0.5Cu/OSP solder joints assembled using multi-wavelength lightSn-3.0Ag-0.5Cu/OSP焊点采用多波长光组装
errMaterials Today Communications
IF4.5
err2025-07-07
err0
PREAI
errHyo-Won Lee; Eun-Chae Noh; Jong-Woong Kim; Seung-Boo Jung; Jeong-Won Yoon
err分享
err收藏
Impact of trimodal copper powder mixing on copper-sintered joints for power semiconductor packaging
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2025-02-01
err0
PREAI
errNoh, Eun-Chae; Lee, Byung-Suk; Ko, Yong-Ho; Yoon, Jeong-Won
err分享
err收藏
Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering各种焊接条件下Sn-3.0Ag-0.5Cu焊点的性能: 回流焊与激光与强脉冲光焊接
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-11-01
err0
errOAAI
errNoh, Eun-Chae; Lee, Hyo-Won; Kim, Jong-Woong; Jung, Seung-Boo; Yoon, Jeong-Won
err分享
err收藏
Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability
errMATERIALS CHARACTERIZATION
IF5.5
err2024-10-01
err0
PREAI
errKim, Seahwan; Min, Kyung Deuk; Yoon, Jeong-Won; Jung, Seung-Boo
err分享
err收藏
Transient liquid phase bonding using Cu foam and Cu-Sn paste for high-temperature applications高温应用中使用Cu泡沫和cu-sn浆料的瞬态液相键合
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-11-01
err1
errOAAI
errHeo, Min-Haeng; Seo, Young -Jin; Yoon, Jeong-Won
err分享
err收藏
Novel and fast transient liquid phase bonding using etched Cu foam/Sn-3.0Ag-0.5Cu composite solder preform
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2023-06-01
err13
PREAI
errHeo, Min-Haeng; Seo, Young-Jin; Yoon, Jeong-Won
err分享
err收藏

研究方向

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合作学者
合作期刊
Y
Young‐Chul Lee
H 指数: 55 · 论文数: 491
J
Jae‐Wook Lee
H 指数: 53 · 论文数: 356
S
Seung‐Boo Jung
H 指数: 51 · 论文数: 506
C
Cheol‐Woong Yang
H 指数: 41 · 论文数: 282
C
Chang‐Yong Lee
H 指数: 40 · 论文数: 299
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