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Bongtae Han

university of maryland

H指数:33

被引数:5,243

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Novel test method to measure time-cure superposition shift factors of filled-thermoset under isocure testing conditions

在等固化测试条件下测量填充热固性材料的时间-固化叠加位移因子的新型测试方法

Journal of Materials Science

IF3.9

2026-02-030

OA

Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint

Bi-Based SAC305混合焊点疲劳模型常数的确定

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

IF3

2025-10-010

PRE

Measurement of temperature-dependent viscoelastic compressibility of highly-filled thermosets using inert gas pressure

使用惰性气体压力测量高填充热固性材料的温度依赖性粘弹性可压缩性

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS

IF6

2025-06-010

PRE

Enhanced DMA Test Procedure to Measure Viscoelastic Properties of Epoxy-Based Molding Compound: Multiple Oscillatory Strain Amplitudes and Monotonic Loading

增强的DMA测试程序以测量环氧基模塑料的粘弹性特性：多重振荡应变幅值和单调加载

IF3

2025-03-270

OA

Novel method to determine autocatalytic cure kinetics model constants of dual-reaction thermosets

MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS

IF4.6

2025-01-010

PRE

A Simple but Effective Way to Handle Rotating Machine Fault Diagnosis With Imbalanced-Class Data: Repetitive Learning Using an Advanced Domain Adaptation Model

IF3.6

2024-01-010

OA

Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS

IF7.2

2022-03-018

OA

Implementation and Performance Evaluation of a Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables

IF3.2

2021-08-170

OAAI

Machine learning based meta-models for sensorless thermal load prediction

基于机器学习的无传感器热负荷预测元模型

proceedings of the sixteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems itherm

IF0

2021-06-010

PRE

High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

POLYMER DEGRADATION AND STABILITY

IF7.4

2021-06-0136

PRE

Volumetric effective cure shrinkage measurement of dual curable adhesives by fiber Bragg grating sensor

JOURNAL OF MATERIALS SCIENCE

IF3.9

2020-05-0813

PREAI

Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

IEEE SENSORS JOURNAL

IF4.5

2019-10-1512

PREAI

Algorithm to Determine the Knee Point on Capacity Fade Curves of Lithium-Ion Cells

确定锂离子电池容量衰减曲线拐点的算法

IF3.2

2019-07-2964

OAAI

Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation

ACTA MATERIALIA

IF9.3

2018-09-0111

PREAI

Autocorrelation-based time synchronous averaging for condition monitoring of planetary gearboxes in wind turbines

MECHANICAL SYSTEMS AND SIGNAL PROCESSING

IF8.9

2016-03-01106

PREAI

Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2015-05-01409

PREAI

Measurement of effective chemical shrinkage and equilibrium modulus of silicone elastomer used in potted electronic system

JOURNAL OF MATERIALS SCIENCE

IF3.9

2014-08-1921

PREAI

Analytical and molecular simulation study of water condensation behavior in mesopores with closed ends

JOURNAL OF CHEMICAL PHYSICS

IF3.1

2010-03-094

PREAI

Ideal laminate theory for water transport analysis of metal-coated polymer films

APPLIED PHYSICS LETTERS

IF3.6

2008-10-0214

PREAI

Thermo-optical modeling of polymer fiber Bragg grating illuminated by light emitting diode

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2007-12-0111

PREAI