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S

Sunghoon Kim

yonsei university

2H指数
6论文数
8被引数
收录论文 3
发表时间
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Test Cycle Reduction for TSV Test Using Streaming Scan Network on 3-D IC在3-D IC上使用流扫描网络减少TSV测试的测试周期
errIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
IF3.1
err2025-09-01
err0
PREAI
errKim, Sunghoon; Han, Donghyun; Kim, Dayoung; Kang, Sungho
err分享
err收藏
Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults使用基于开关的矩阵的低成本TSV修复架构，用于高度聚集的故障
errIEEE ACCESS
IF3.6
err2025-01-01
err0
errOAAI
errJang, Seokjun; Han, Donghyun; Kim, Sunghoon; Kim, Dayoung; Kang, Sungho
err分享
err收藏
TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM
errIEEE TRANSACTIONS ON RELIABILITY
IF5.7
err2024-01-01
err0
PREAI
errHan, Donghyun; Won, Duyeon; Kim, Sunghoon; Kang, Sungho
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
S
Sungho Kang
H 指数: 22 · 论文数: 436
D
Donghyun Han
H 指数: 4 · 论文数: 25
S
Seokjun Jang
H 指数: 4 · 论文数: 14
D
D K Kim
H 指数: 3 · 论文数: 6
D
Duyeon Won
H 指数: 2 · 论文数: 4
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