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J

Jinhyun Lee

Pukyong National University
H指数:14
被引数:1,069
浏览量:0

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Study for Defect Minimization of Ag Nano Layer using Galvanic Displacement Deposition for Cu-Cu Hybrid Bonding

Ag纳米层缺陷最小化的电化学置换沉积法用于Cu-Cu混合键合的研究

Journal of The Electrochemical Society
IF3.3
2025-10-170
PRE
Y. Kim; H. Han; J. Seo; J. Lee; B. Kwak; S. Yoon; B. Yoo
Tuning atomic diffusion and carrier concentration in ITO films via in-situ resistance monitoring

通过原位电阻监测调节ITO薄膜中的原子扩散和载流子浓度

Journal of Alloys and Compounds
IF6.3
2025-10-050
PRE
Gyuho Lee; Seonghoon Han; Hyeonyu Kim; Sehwan Song; Ju Hyeon Kim; Jinhyun Lee; Jisung Lee; Jong-Seong Bae; Okkyun Seo; Jiayi Tang; Sangmoon Yoon; Chang-woo Cho; Kyeong Tae Kang; Younjung Jo; Sungkyun Park; Dooyong Lee
Hybrid emplacement mechanisms and structural interactions: insights into dike-fault-fracture systems in SE Korea

混合就位机制与结构相互作用：对韩国东南部岩脉-断层-节理系统的认识

FRONTIERS IN EARTH SCIENCE
IF2
2025-10-030
OAAI
Lee, Jinhyun; Kim, Goeun; Kim, Young-Seog
Silicon dioxide (SiO2) solid blocking layer on through-glass via surface for efficient highly selective copper filling

用于高效高选择性铜填充的玻璃通孔表面上的二氧化硅 (SiO2) 固体阻挡层

SURFACES AND INTERFACES
IF6.3
2024-12-010
PRE
Yang, Fan; Wang, Qing; Lee, Jinhyun; Song, Yunha; Hwang, Inseong; Yoon, Sanghwa; Yoo, Bongyoung
Mixed air temperature reset by data-driven model for optimal economizer control
APPLIED THERMAL ENGINEERING
IF6.9
2024-02-013
PRE
Lee, Jin-Hyun; Jo, Jae-Hun; Cho, Young-Hum
Electrodeposition of stress-relaxation-induced (111)-oriented nanotwin copper film by direct current in additive-free electrolyte

在无添加剂的电解质中通过直流电电沉积应力松弛诱导的 (111) 取向的纳米孪晶铜膜

ELECTROCHIMICA ACTA
IF5.6
2024-01-015
PRE
Han, Haneul; Seo, Jinmyeong; Kim, Youjung; Lee, Jinhyun; Park, Jungjoon; Yoon, Sanghwa; Yoo, Bongyoung
The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density
FRONTIERS IN CHEMISTRY
IF4.2
2022-11-249
OAAI
Han, Haneul; Lee, Chaerin; Kim, Youjung; Lee, Jinhyun; Yoon, Sanghwa; Yoo, Bongyoung
Study of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor Diffusion
FRONTIERS IN CHEMISTRY
IF4.2
2021-10-215
OAAI
Park, Kimoon; Lee, Jinhyun; Kim, Youjung; Yoon, Sangwha; Yoo, Bongyoung
Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu
APPLIED SURFACE SCIENCE
IF6.9
2021-06-0123
PREAI
Han, Haneul; Lee, Chaerin; Kim, Youjung; Lee, Jinhyun; Kim, Rosa; Kim, Jongryoul; Yoo, Bongyoung
Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)
FRONTIERS IN CHEMISTRY
IF4.2
2020-10-1410
OAAI
Kim, Youjung; Jin, Sanghyun; Park, Kimoon; Lee, Jinhyun; Lim, Jae-Hong; Yoo, Bongyoung
Local electroluminescence and time-resolved photoluminescence study of InGaN light-emitting diodes
APPLIED PHYSICS LETTERS
IF3.6
2009-09-097
PREAI
Onushkin, Grigory A.; Hong, Sang-Su; Lee, Jin-Hyun; Park, June-Sik; Son, Joong-Kon; Kim, Min-Ho; Park, YongJo
InGaN-based ultraviolet emitting heterostructures with quaternary AlInGaN barriers
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
IF5.1
2003-09-0122
PREAI
Lee, J; Eliseev, PG; Osinski, M; Lee, DS; Florescu, DI; Guo, SP; Pophristic, M

研究方向

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B
Bongyoung Yoo
H 指数:38论文数:252被引数:5,595
Y
Youjung Kim
H 指数:6论文数:23被引数:132
S
Sanghwa Yoon
H 指数:11论文数:53被引数:308
H
Haneul Han
H 指数:5论文数:14被引数:76
J
Jinmyeong Seo
H 指数:5论文数:40被引数:90
C
Chaerin Lee
H 指数:7论文数:26被引数:344
H 指数:0论文数:174被引数:0
S
Sangmoon Yoon
H 指数:15论文数:80被引数:1,306
J
Jae‐Hong Lim
H 指数:35论文数:220被引数:4,666
J
Jisung Lee
H 指数:19论文数:68被引数:1,290