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Printing Nanostructured Copper for Electromagnetic Interference Shielding

delete2022-03-26
delete12
PRE
AI
A
Aaron Sheng
J
Jian Yu
S
Shenqiang Ren *
DOI:10.1021/acsaelm.2c00199delete
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摘要

摘要

En 中文
Printing metallic nanomaterials toward electromagnetic interference shielding is highly desirable, especially with a minimal thickness and mechanical flexibility. Here, we report the geometry and conductivity effects of printed nanostructured copper on the reflection and absorption of electromagnetic interference shielding. The electromagnetic interference shielding is observed to increase as the conductivity increases with the optimum electromagnetic interference shielding effectiveness of 65 dB, on which a shielding effectiveness diagram is constructed to illustrate the role of electric conductivity and architectures of printed nanostructured copper features. The findings reported here provide insight into printed flexible metallic materials for electromagnetic interference shielding.
Keyword:
copper nanoplates
copper nanowires
copper nanoparticles
electromagnetic interference shielding
electrical conductivity

期刊

ACS Applied Electronic Materials 封面图
ACS Applied Electronic Materials
IF:
4.7
论文数:
5.0K
被引数:
1.4W

机构

S
state university of new york (suny) system
学者数:
6.5W
论文数: 5.8W
被引数: 65
U
university at buffalo, suny
学者数:
1.2W
论文数: 9.5K
被引数: 9
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