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J

Jian Yu

stomatology

23H指数
126论文数
2.1K被引数
收录论文 43
发表时间
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Effects of cleaning methods on the removal efficacy of Streptococcus mutans biofilm and material properties of thermoplastic aligner materials清洁方法对链球菌属变形链球菌生物膜去除效果及热塑性牙套材料性能的影响
errBMC Oral Health
IF3.1
err2026-03-16
err0
errOAAI
errJun Hu; Jinmei Lei; Jian Yu; Chunxiao Jin; Shengjie Liang; Jingmei Guo; Cui Huang
err分享
err收藏
Recent Advances of Mesoporous Nanoparticles in the Management of Dentin Hypersensitivity介孔纳米粒子在牙本质过敏管理中的最新进展
errAdvanced Functional Materials
IF19
err2026-03-09
err0
PREAI
errYize Wang; Jian Yu; Xinyu Zhang; Chuliang Tang; Kangning Wang; Yaning Zhao; Cui Huang; Hongye Yang
err分享
err收藏
Pyrolyzed preceramic precursors to compositionally complex ceramics热解的预陶瓷前驱体制备组分复杂的陶瓷
errMatter
IF17.5
err2025-07-21
err0
errOAAI
errSaurabh Khuje; Jiayue Sun; Chong Yang; Zhongxuan Wang; Long Zhu; Tangyuan Li; Gianna Valentino; Nicholas Ku; Andres Bujanda; Jian Yu; Tucker Moore; Taylor J. Woehl; Liangbing Hu; Shenqiang Ren
err分享
err收藏
AlSi10Mg plate-lattice structures fabricated by laser powder bed fusion exhibiting high specific energy absorption由激光粉末床熔融制造的AlSi10Mg板-点阵结构，表现出高比能量吸收特性
errMaterials & Design
IF7.9
err2025-07-14
err0
errOAAI
errJoseph Berthel; Joshua Taggart-Scarff; Jian Yu; Brandon McWilliams; Rahul Panat; Jack Beuth
err分享
err收藏
Photonic sintering of inkjet printable molecular base copper ink at ambient conditions在环境条件下对喷墨可打印的分子基铜墨水进行光子烧结
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
IF2.8
err2025-03-21
err0
PREAI
errJackson, Sean; Ren, Shenqiang; Yu, Jian
err分享
err收藏
Interface microstructure and nano-mechanical properties of Fe-SiC composites fabricated by laser-directed energy deposition
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-01-01
err0
errOAAI
errDixit, Som; Villegas, Arturo; Smith, Pauline M.; Ku, Nicholas; Mock, Clara M.; Yu, Jian H.; Xiao, Hai; Peng, Fei; Liu, Shunyu
err分享
err收藏
Copper-Coated E-Glass Fiber-Based Strain Sensors for High Temperatures
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-11-07
err0
PREAI
errKhuje, Saurabh; Zhu, Long; Yu, Jian; Ren, Shenqiang
err分享
err收藏
Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-09-16
err0
PREAI
errKhuje, Saurabh; Islam, Abdullah; Zhu, Long; Zhang, Jun; Wang, Zhongxuan; Parker, Thomas; Yu, Jian; Ren, Shenqiang
err分享
err收藏
Additive Manufacturing of High-Temperature Hybrid Electronics via Molecular-Decomposed Metals
errADVANCED FUNCTIONAL MATERIALS
IF19
err2023-10-20
err6
errOAAI
errKhuje, Saurabh; Alshatnawi, Firas; Smilgies, Detlef; Alhendi, Mohammed; Islam, Abdullah; Armstrong, Jason; Yu, Jian; Poliks, Mark; Ren, Shenqiang
err分享
err收藏
Anisotropic and high-strength SiO2/cellulose nanofiber composite aerogel with thermal superinsulation and superhydrophobicity具有超隔热和超疏水性的各向异性和高强度SiO2/纤维素纳米纤维复合气凝胶
errCERAMICS INTERNATIONAL
IF5.6
err2023-09-01
err10
PREAI
errLong, Xin; Wei, Xiongbang; Hu, Min; Yu, Jian; Wang, Sizhe; Zhou, Lichun; Liao, Jiaxuan
err分享
err收藏
Printing conformal and flexible copper networks for multimodal pressure and flow sensing
errNANOSCALE
IF5.1
err2023-01-01
err3
PREAI
errKhuje, Saurabh; Islam, Abdullah; Yu, Jian; Ren, Shenqiang
err分享
err收藏
Conformal Cu-CuNi Thermocouple Using Particle-Free Ink Materials
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2022-10-25
err16
PREAI
errSheng, Aaron; Khuje, Saurabh; Li, Zheng; Yu, Jian; Ren, Shenqiang
err分享
err收藏
High-Temperature Hybridized Copper-Boron Nitride Materials from Additive Manufacturing
errADVANCED ENGINEERING MATERIALS
IF3.3
err2022-10-06
err1
errOAAI
errSheng, Aaron; Khuje, Saurabh; Yu, Jian; Zhuang, Cheng-Gang; Ren, Shenqiang
err分享
err收藏
A remote deflection detection method for long-span bridges using adaptive mask and high-resolution camera
errMEASUREMENT
IF5.6
err2022-09-01
err11
PREAI
errPan, Pai; Xing, Cheng; Bai, Jie; Yu, Shuang; Xu, Yaming; Zhou, Jianguo; Yu, Jian
err分享
err收藏
High-Temperature Copper-Graphene Conductors via Aerosol Jetting通过气溶胶喷射高温铜-石墨烯导体
errADVANCED ENGINEERING MATERIALS
IF3.3
err2022-04-04
err5
PREAI
errYu, Jian; Khuje, Saurabh; Sheng, Aaron; Kilczewski, Steven; Parker, Thomas; Ren, Shenqiang
err分享
err收藏
Printing Nanostructured Copper for Electromagnetic Interference Shielding用于电磁干扰屏蔽的纳米结构铜印刷
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2022-03-26
err12
PREAI
errSheng, Aaron; Yu, Jian; Ren, Shenqiang
err分享
err收藏
Molecular copper decomposition ink for printable electronics
errChemical Communications
IF4.2
err2022-01-01
err15
PREAI
errSheng, Aaron; Islam, Abdullah; Khuje, Saurabh; Yu, Jian; Tsang, Harvey; Bujanda, Andres; Ren, Shenqiang
err分享
err收藏
Flexible Copper Nanowire Electronics for Wireless Dynamic Pressure Sensing用于无线动态压力传感的柔性铜纳米线电子设备
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2021-11-23
err19
PREAI
errKhuje, Saurabh; Sheng, Aaron; Yu, Jian; Ren, Shenqiang
err分享
err收藏
Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics
errNANO LETTERS
IF9.1
err2021-10-28
err12
PREAI
errSheng, Aaron; Khuje, Saurabh; Yu, Jian; Petit, Donald; Parker, Thomas; Zhuang, Cheng-Gang; Kester, Lanrik; Ren, Shenqiang
err分享
err收藏
Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation
errSCIENCE ADVANCES
IF12.5
err2021-10-01
err39
errOAAI
errLi, Zheng; An, Lu; Khuje, Saurabh; Tan, Jingye; Hu, Yong; Huang, Yulong; Petit, Donald; Faghihi, Danial; Yu, Jian; Ren, Shenqiang
err分享
err收藏

研究方向

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合作学者
合作期刊
L
Liangbing Hu
H 指数: 188 · 论文数: 665
E
Edwin L. Thomas
H 指数: 112 · 论文数: 807
D
Detlef‐M. Smilgies
H 指数: 78 · 论文数: 416
G
Gregory C. Rutledge
H 指数: 73 · 论文数: 360
张俊 封面图
张俊 (Jun Zhang)
H 指数: 72 · 论文数: 720
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