.png){kind=icon}
返回
Scan-Chain Intra-Cell Aware Testing
.png){kind=icon}
PRE
AI
DOI：10.1109/TETC.2016.2624311.png)
.png){kind=icon}
原文求助.png){kind=icon}
分享.png){kind=icon}
收藏
摘要
En 中文
This paper first presents an evaluation of the effectiveness of different test pattern sets in terms of ability to detect possible infra-cell defects affecting the scan flip-flops. The analysis is then used to develop an effective test solution to improve the overall test quality. As a major result, the paper demonstrates that by combining test vectors generated by a commercial ATPG to detect stuck-at and delay faults, plus a fragment of extra test patterns generated to specifically target the escaped defects, we can obtain a higher intra-cell defect coverage (i.e., 6.46 percent on average) and a shorter test time (i.e., 42.20 percent on average) than by straightforwardly using an ATPG which directly targets these defects.
Keyword:
Fault simulation
intra-cell defect
scan-chain testing
test quality
AI总结
对已上传原文的论文进行重点信息的提取，主要内容包括：简要概述、研究摘要、背景介绍、关键亮点、图文解析、展望与总结。
期刊
IF:
5.4
论文数:
1.1K
被引数:
3.4K
机构
引用论文
.png){kind=icon}
分享收藏Follow-up study of condylar bony changes using helical computed tomography in patients with temporomandibular disorder颞下颌关节紊乱病患者髁突骨改变的螺旋ct随访研究
PREAI
分享收藏
分享收藏 没有更多内容
没有更多内容