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A Parallel-Structure Solder Paste Inspection System
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DOI：10.1109/TMECH.2009.2009638.png)
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Abstract
En 中文
In this paper, we present an innovative design of a solder paste inspection system that can be practically integrated into existing solder paste printing machines. Since solder paste inspection systems usually occupy a large vertical space, we designed a mirror box that can redirect the transmission of fringe patterns. In this way, a new parallel-structure solder paste inspection system with a significant reduction in the vertical constraint is developed. We also developed a hybrid weighting algorithm that applies the distance and fringe contrast to acquire the height of solder pastes. Furthermore, we developed an algorithm that generates the 2-D image from the fringe pattern images during the four-step algorithm. It reduces the time required for solder paste inspection compared to traditional approaches that use special lighting systems to create the 2-D image. Based on the results of the height acquisition algorithm, 2-D and 3-D solder paste inspections are performed. Experimental results show that our system can inspect a 20 mm x 20 mm printed circuit board area within 2 s to detect common 2-D and 3-D defects, and the maximum standard deviation for the average height is 3 mu m.
Keywords:
Phase shifting technique
solder paste inspection
3-D measurement
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