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张

张墅野 (Shuye Zhang)

Harbin Institute of Technology

36H-index
228Paper Count
4.3KCitation Count
Published Papers 102
Publication Date
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Atomic-scale mechanism of nickel-induced chemical heterogeneity and its role in intergranular cracking of Sn-based interconnects
errComposites Part B-Engineering
IF14.2
err2026-08-19
err0
PREAI
errJinhong Liu; Biao Zuo; Yaling Hua; Junfu Liu; Peng He; Shuye Zhang
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Microwave-engineered, defect-regulated HEA-rGO heterointerfaces for broadband solar photothermal conversion
errComposites Part B-Engineering
IF14.2
err2026-08-13
err0
PREAI
errWenqiang Wan; Wenbo Duan; Kaiming Liang; Yifei Li; Xingyu Hu; Pengyu Zhu; Shuye Zhang
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Unraveling degradation mechanisms, microstructure evolution, and thermal-mechanical behavior of TGV-Cu interconnects in advanced glass packaging under thermal cycling
errMaterials Science in Semiconductor Processing
IF4.6
err2026-07-31
err0
PREAI
errGuoli Sun; Jinhong Liu; Ruiting Zhang; Yang Cheng; Jingyi Zhao; Jingjun Yuan; Jialin Zhang; Chengqian Wang; Shuye Zhang
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Contact-localized plasmonic heating-driven non-equilibrium alloying of Cu@Ag core-shell nanoparticles: Interfacial diffusion, supersaturated solid solutions and defect arrest
errJournal of Materials Science & Technology
IF14.3
err2026-07-28
err0
PREAI
errZhenfeng Li; Yifan Zhao; Zixu Wang; Jinyang Li; Peng He; Shuye Zhang
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Simultaneous Improvement of Bendability and Passive Daytime Radiative Cooling Performance in Multilayer Alumina Fiber Membranes
errMaterials
IF3.2
err2026-07-07
err0
errOAAI
errYating Zhuang; Chongyang Fu; Benxing Guo; Weihao Zhai; Xueting Ren; Depeng Fu; Xianchao Li; Guangzheng Wang; Qizheng Li; Yidan Xiao; Shuye Zhang; Hanbin Wang; Xiaoxiong Wang
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Degradation mechanisms and microstructure evolution of TGV-Cu vertical interconnects in glass wafer under high-temperature aging
errMaterials Science in Semiconductor Processing
IF4.6
err2026-05-11
err0
PREAI
errGuoli Sun; Jinhong Liu; Jingyi Zhao; Jialin Zhang; Zhaoyu Li; Shuye Zhang
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Polyurethane-Modified Acrylic Resins: High-Adhesion and Low-Dielectric Solder Resists for Advanced Packaging
errACS Applied Polymer Materials
IF4.7
err2026-05-08
err0
PREAI
errJialin Zhang; Chuanyu Wu; Jie Liu; Shuye Zhang; Tao Wang; Xialei Lv; Jinhui Li; Guoping Zhang; Rong Sun
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Synergistic Crystal Plasticity and Machine Learning Unraveling TSV-Cu Fatigue
errInternational Journal of Mechanical Sciences
IF9.4
err2026-04-29
err0
PREAI
errXinyi Jing; Chenglong Zhou; Yew-Hoong Wong; Peng He; Shuye Zhang
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High-Performance Soldering Achieved through an Energy-Efficient Magnetic Field-Assisted Microwave Hybrid Joining: A Multiscale Study via Molecular Dynamics and First-Principles Calculations
errmaterials science and engineering: a
IF0
err2026-02-12
err0
PREAI
errShuai Zhang; Chen Zeng; Zhehao Gan; Jinhong Liu; Peng He; Tianran Ding; Weimin Long; Sujuan Zhong; Yew-Hoong Wong; Shuye Zhang
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Balancing mechanical and thermal properties in epoxy-based solder resists through polyurethane-polyimide hybrids
errProgress in Organic Coatings
IF7.3
err2025-12-04
err0
PREAI
errJialin Zhang; Wentao Hu; Tao Wang; Xialei Lv; Jinhui Li; Shuye Zhang; Guoping Zhang; Rong Sun
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Machine learning-driven design and optimization of electronic packaging: applications and future developments
errJOURNAL OF MATERIALS INFORMATICS
IF5.6
err2025-12-01
err2
PREAI
errChen, Xiangyu; He, Sirui; Paik, Kyung-Wook; Wong, Yew-Hoong; Zhang, Shuye
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Flat and Fabulous: Squeezing Elemental Metals into the 2D Realm
errChinese Journal of Structural Chemistry
IF10.3
err2025-11-05
err0
PREAI
errJinbo Pang; Shuye Zhang; Mark H. Rummeli; Hong Liu; Yufeng Hao; Weijia Zhou; Rafael G. Mendes
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Microwave hybrid joining of SAC305-Ni@Sn composite solder: Heating mechanism, mechanical reliability, and first-principles calculation
errMaterials Science and Engineering: A
IF0
err2025-10-28
err0
PREAI
errShuai Zhang; Jinhong Liu; Zhehao Gan; Te Li; Peng He; Tianran Ding; Weimin Long; Sujuan Zhong; Yew-Hoong Wong; Shuye Zhang
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Effect of indium (In) on the microstructure evolution, grain orientation and mechanical behaviors of Sn58Bi/Cu solder joints under thermal cycling
errMaterials Characterization
IF5.5
err2025-10-02
err0
PREAI
errWenhao Wang; Lei Sun; Peng He; Liang Zhang; Jing Li; Shuye Zhang
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Advances in micro/nanoparticle-enhanced Sn-based composite solders
errInternational Journal of Minerals, Metallurgy and Materials
IF0
err2025-09-10
err0
PREAI
errKaiming Liang; Wenqiang Wan; Yifei Li; Xin Zhang; Xiangdong Ding; Peng He; Shuye Zhang
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Electrical performance of Sm2O3/ZrO2 gate stacks on 4H-SiC via various O2/N2O gas concentrations
errmaterials science materials in electronics
IF0
err2025-09-05
err0
PREAI
errAhmad Hafiz Jafarul Tarek; Tahsin Ahmed Mozaffor Onik; Chia Ching Kee; Chin Wei Lai; Bushroa Abd Razak; Prastika Krisma Jiwanti; Nurliyana Abu Hasan Sazalli; Shuye Zhang; Yew Hoong Wong
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Novel technique for aluminum thin film thickness measurement using top view SEM-EDX in conjunction with electron beam simulation and machine learning
errULTRAMICROSCOPY
IF2
err2025-09-01
err0
PREAI
errHuq, Tahsinul; Wong, Yew Hoong; Chuah, Joon Huang; Tan, Chee-Keong; Zhang, Shuye
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Two-Dimensional Metals Over; Inside; or Beneath Templates
errResearch
IF10.7
err2025-08-05
err0
errOAAI
errJinbo Pang; Shuye Zhang; Yufeng Hao; Hong Liu; Mark H. Rummeli; Weijia Zhou; Rafael G. Mendes
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Nanoparticle-modified SnBi solder: a comprehensive study on interfacial microstructure, shear strength, and wettability
errmaterials science materials in electronics
IF0
err2025-07-29
err0
PREAI
errLei Sun; Xuanyu Chen; Peng He; Shuye Zhang; Minghe Chen
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Synergistic reinforcement strategy of high performance dual component alkali soluble photosensitive resin composites for solder resist
errProgress in Organic Coatings
IF7.3
err2025-07-14
err0
PREAI
errJialin Zhang; Tao Wang; Xialei Lv; Jinhui Li; Shuye Zhang; Guoping Zhang; Rong Sun
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Research Directions

柔性印刷电子光烧结技术人工突触与自供能器件性能3D封装可靠性
Co-authors
Cooperation Journals
刘泓 cover
刘泓 (Hong Liu)
H-index: 135 · Papers: 2.8K
S
Sang‐Woo Kim
H-index: 115 · Papers: 1.2K
J
Jianbin Xu
H-index: 99 · Papers: 1.2K
K
Kilwon Cho
H-index: 97 · Papers: 636
孙
孙蓉 (Rong Sun)
H-index: 89 · Papers: 991
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