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Y
Yameng Sun
wuhan university
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3
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A New Packaging Design Method for IGBT Modules Based on a Common-Emitter Inductance Decoupling Technology
IEEE Transactions on Components Packaging and Manufacturing Technology
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3
2026-04-01
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Sun, Yameng; Chen, Anning; Liu, Xun; Song, Yifan; Zhang, Xiao; Zhou, Yang; Ma, Kun; Liu, Sheng
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X
Xun Liu
H-index: 0 · Papers: 3
S
Sheng Liu
H-index: 0 · Papers: 3
A
Anning Chen
H-index: 0 · Papers: 10
Y
Yang Zhou
H-index: 0 · Papers: 6
M
Ma, Kun
H-index: 0 · Papers: 1
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