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Y

Yongjun Huo

beijing institute of technology

15H-index
66Paper Count
560Citation Count
Published Papers 32
Publication Date
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Ultrathin silver-indium transient liquid phase bonding enabled by a molybdenum diffusion barrier for void suppression
errMATERIALS & DESIGN
IF7.9
err2026-03-22
err0
errOAAI
errDonglin Zhang; Yuan Zhang; Wenqian Li; Luke Ma; Shuquan Chen; Miao Jiang; Xiuchen Zhao; Gang Zhang; Yongjun Huo
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Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
errAdvanced Science
IF14.1
err2026-02-16
err0
errOAAI
errYongjun Huo; Jiaqi Song; Wenqian Li; Jian Zhang; Yujin Zhang; Yang Fu; Wangchao Yuan; Xin Chen; Sichen Liu; Miao Jiang; Yuan Cheng; Gang Zhang
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errSave
Design and Demonstration of an Ultrasonic-Laser Coupled Microjoining Platform for Electronic Device Packaging
errIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
IF3
err2025-12-01
err0
PREAI
errSong, Jiaqi; Li, Hong; Shi, Sujun; Zhao, Xiuchen; Zhang, Gang; Huo, Yongjun; Lee, Chin C.
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errSave
A lightweight Co1Ni0.5@NC/SiCf filler with excellent low-frequency electromagnetic wave absorption and heat dissipation for electronic packaging
errChemical Engineering Journal
IF13.2
err2025-11-07
err0
PREAI
errXingtao Liu; Luyang Li; Qi Cao; Yongjun Huo; Xiulan Wang; Lihong Gao; Zhuang Ma; Gang Zhang; Miao Jiang
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errSave
Machine learning potentials in studying phononic and thermal properties of germanium telluride
errAIP ADVANCES
IF1.4
err2025-10-01
err0
PREAI
errZhang, Jian; Zhao, Zhuo; Zhang, Yuan; Huo, Yongjun; Hou, Aijun; Zhang, Haochun; Zhang, Gang
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errSave
The anti-electrochemical migration mechanism of Ag-based transient liquid-phase electrically conductive adhesive: Experimental and phase-field study
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-07-01
err1
PREAI
errZhao, Shuang; Yang, Mingkun; Liu, Yingxia; Cao, Chenrui; Liang, Chen; Zhang, Donglin; Zhao, Xiuchen; Zhang, Gang; Huo, Yongjun
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errSave
Plasticity trends in Ag-based disordered solid solutions from first principles
errVACUUM
IF3.9
err2025-06-02
err0
PREAI
errZhao, Shuang; Zheng, Bing; Gu, Songzhao; Wang, Taiyu; Xie, Xiaochen; Wang, Yong; Li, Hong; Shi, Sujun; Zhao, Xiuchen; Huo, Yongjun
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errSave
Molecular Dynamics Analysis of the Solid-State Bonding Mechanism and High Strain Rate Response for (111)-Oriented Nanotwinned Silver
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2025-04-02
err0
PREAI
errLiu, SC; Zhao, S; Zhang, DL; Wang, TY; Liang, C; Shi, SJ; Li, H; Zhao, XC; Zhang, G; Huo, YJ
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A perspective on mechanism of heat transfer and performance optimization in advanced thermal interface materials
errAPPLIED PHYSICS LETTERS
IF3.6
err2025-02-18
err0
PREAI
errLiang, Chen; Hong, Jingtao; Wan, Cheng; Ma, Xinkai; Wang, Zhiteng; Zhao, Xiuchen; Hou, Aijun; Nika, Denis; Huo, Yongjun; Zhang, Gang
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errSave
Sputtering of (111) highly-oriented nanotwinned Ag on polycrystalline Si3N4 substrates for high-power electronic packaging
errSURFACES AND INTERFACES
IF6.3
err2024-12-01
err0
PREAI
errZhang, Donglin; Zhang, Yuan; Song, Jiaqi; Zhao, Shuang; Xu, Tao; Tian, Xin; Zhao, Xiuchen; Huo, Yongjun
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errSave
Mechanical properties and microstructure evolution of Sn-Bi-based solder joints by microalloying regulation mechanism
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-07-01
err2
errOAAI
errWu, Xuefeng; Hou, Zhuangzhuang; Xie, Xiaochen; Lin, Pengrong; Huo, Yongjun; Wang, Yong; Zhao, Xiuchen
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errSave
Study on the plasticity enhancing mechanism of silver-based solid solution for electronic packaging
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-05-01
err1
errOAAI
errZhao, Shuang; Zheng, Bing; Zhang, Donglin; Xie, Xiaochen; Qu, Zhibo; Wang, Yong; Zhao, Xiuchen; Lee, Chin C.; Huo, Yongjun
errShare
errSave
Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions
errMATERIALS
IF3.2
err2024-04-04
err1
errOAAI
errFang, Yexing; Wang, Taiyu; Gu, Yue; Yang, Mingkun; Li, Hong; Shi, Sujun; Zhao, Xiuchen; Huo, Yongjun
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errSave
Ultrasonic-enhanced silver-indium transient liquid phase bonding in advancing rapid and low-temperature packaging
errMATERIALS CHARACTERIZATION
IF5.5
err2024-04-01
err5
PREAI
errSong, Jiaqi; Zhang, Donglin; Chen, Xin; Hu, Shizun; Zhao, Xiuchen; Lee, Chin C.; Huo, Yongjun
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errSave
Fabrication and characterization of Sn-57 wt% Bi film by pulse DC current co-electrodeposition and reflow
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2024-03-01
err1
PREAI
errYe, Zi-Ting; Zhao, Xiuchen; Dong, Yaru; Wu, Xuefeng; Dong, Zhao-Teng; Huo, Yongjun
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errSave
A phase-field model of electrochemical migration for silver-based conductive adhesives
errELECTROCHIMICA ACTA
IF5.6
err2023-12-01
err9
PREAI
errCao, Chenrui; Yang, Mingkun; Liang, Chen; Zhang, Donglin; Chen, Xin; Zhao, Xiuchen; Lee, Chin C.; Huo, Yongjun
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errSave
Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-09-01
err4
errOAAI
errWu, Xuefeng; Hou, Zhuangzhuang; Xie, Xiaochen; Lin, Pengrong; Huo, Yongjun; Wang, Yong; Zhao, Xiuchen
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errSave
Room-temperature, rapid, solid-state solder bonding technology for future ultra-high-density interconnects manufacturing
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-07-01
err5
errOAAI
errYang, Mingkun; Huo, Yongjun; Zhao, Xiuchen; Guo, Yuzheng; Liu, Yingxia
errShare
errSave
Plasma-induced growth mechanism of surface-state silver oxide in nanoscale for low-temperature bonding technology
errMATERIALS CHARACTERIZATION
IF5.5
err2023-05-01
err6
PREAI
errWang, Taiyu; Gu, Songzhao; Fang, Yexing; Zhang, Donglin; Xie, Xiaochen; Qu, Zhibo; Wang, Yong; Zhao, Xiuchen; Wu, Jiaqi; Lee, Chin C.; Huo, Yongjun
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errSave
Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-05-01
err3
errOAAI
errYang, Mingkun; Zhao, Xiuchen; Huo, Yongjun; Tu, King-Ning; Liu, Yingxia
errShare
errSave

Research Directions

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Co-authors
Cooperation Journals
李红 cover
李红 (Hong Li)
H-index: 153 · Papers: 2.0K
张刚 cover
张刚 (Gang Zhang)
H-index: 83 · Papers: 891
K
K. N. Tu
H-index: 81 · Papers: 651
王
王勇 (Yong Wang)
H-index: 77 · Papers: 887
张远 cover
张远 (Yuan Zhang)
H-index: 72 · Papers: 493
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