Not logged inChallenges and Mitigations of Microbumps Pitch Scaling for Chiplet Applications
Derakhshandeh, Jaber; Beyne, Eric; Cochet, Tom; Cherman, Vladimir; Dangol, Anish; Cuypers, Dieter H.; Vaquilar, Aldrin; Rip, Jens; Slabbekoorn, John; Hiro, Akito; Dhakras, Prathamesh; Ceulemans, Karl; Hussain, Tassawar; Suhard, Samuel; Beyer, Gerald .png)
Share.png)
SaveShare Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Influence of Si wafer thinning processes on (sub)surface defectsInoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric; Uedono, Akira Share Save Hydrogen outgassing induced liner/barrier reliability degradation in through silicon via'sLi, Yunlong; Oba, Yoshiyuki; Wu, Chen; Van Huylenbroeck, Stefaan; Van Besien, Els; Vereecke, Guy; Stucchi, Michele; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric; Croes, Kristof Share Save Share Save Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu SeedArmini, S.; El-Mekki, Z.; Vandersmissen, K.; Philipsen, H.; Rodet, S.; Honore, M.; Radisic, A.; Civale, Y.; Beyne, E.; Leunissen, L. Share Save Share Save Share Save Share Save Electrical field induced ageing of polymer light-emitting diodes in an oxygen-rich atmosphere studied by emission microscopy, scanning electron microscopy and secondary ion mass spectroscopyBijnens, W; De Wolf, I; Manca, J; D'Haen, J; Wu, TD; D'Olieslaeger, M; Beyne, E; Kiebooms, R; Vanderzande, D; Gelan, J; De Ceuninck, W; De Schepper, L; Stals, LM Share Save 
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}