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Hiroshi Nishikawa

University of Osaka

55H-index
884Paper Count
1.3WCitation Count
Published Papers 126
Publication Date
Effect of surface-modified nanoparticles on microstructure and hardness of low-temperature solder alloys
err2026-02-14
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errOAAI
errShunya Nitta; Hiroaki Tatsumi; Atsushi M Ito; Arimichi Takayama; Takeshi Wada; Hidemi Kato; Hiroshi Nishikawa
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Experimental and first-principles insights into Ti-mediated Cu–Si3N4 interfaces for high-reliability electronic substrates
err2025-12-05
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errOAAI
errHiroaki Tatsumi; Shunya Nitta; Atsushi M. Ito; Arimichi Takayama; Makoto Takahashi; Seongjae Moon; Eiki Tsushima; Hiroshi Nishikawa
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Mechanism of void growth in electroless copper plating layer of microvias in high-density interconnect packaging substrates
err2025-12-04
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PREAI
errHsieh, Ming-chun; Zhang, Zheng; Nishijima, Masahiko; Okumura, Rieko; Seto, Hiroki; Nishikawa, Hiroshi; Suganuma, Katsuaki
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Ion milling-enhanced preferential growth of CoSn3 for crystallographic orientation control of Sn on polycrystalline Co substrates
err2025-12-01
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errOAAI
errWang, Xinjie; Tatsumi, Hiroaki; Li, Chia-Lin; Lee, Jyh-Wei; Nishikawa, Hiroshi
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Isolation and characterization of a novel halotolerant selenate-reducing bacterium, Citrobacter koseri Y2
err2025-12-01
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PREAI
errOkahata, Shunsuke; Ueda, Yuya; Kikuchi, Yuki; Naoe, Takuya; Inoue, Daisuke; Dohra, Hideo; Nishikawa, Hiroshi; Ike, Michihiko
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Interfacial Strengthening of Epoxy Composites by Functionalized UiO-66 MOFs under Thermal Cycling
err2025-12-01
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PREAI
errKe, Shuai; Luo, Cui; He, Siliang; Wang, Bo; Huang, Wei; Nishikawa, Hiroshi; Pan, Kailin
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Cu/Sn-58Bi/Microporous-Cu Composite Joint Formation via Capillary-Driven Transient Liquid-Phase Bonding Under Air Atmosphere
err2025-11-01
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PREAI
errXiong, Bifu; Luo, Cui; Li, Xingyu; Hu, Liangyin; Dong, Haobo; He, Siliang; Liang, Zhishen; Zhang, Ni; Qin, Hongbo; Nishikawa, Hiroshi
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Effect of copper on interfacial reaction and microstructure of soldering on aluminum substrate
err2025-07-08
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errOAAI
errJiahui Li; Yu-An Shen; Hiroaki Tatsumi; Hiren Kotadia; Runhua Gao; Hiroshi Nishikawa
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Lead whisker growth characteristics on satellites in Earth orbit
err2025-06-21
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PREAI
errShinichiro Ichimaru; Tsuyoshi Nakagawa; Norio Nemoto; Katsuaki Suganuma; Hiroaki Tatsumi; Hiroshi Nishikawa
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Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
err2025-04-01
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errOAAI
errPak, Seong-Woo; Tatsumi, Hiroaki; Wang, Jianhao; Wu, Albert T.; Nishikawa, Hiroshi
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Low-temperature soldering using Sn/Bi electrodeposited bilayer
err2025-02-01
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PREAI
errWang, Wei-Li; Cherng, Sheng-Jye; Huang, Yu-Ting; Gao, Runhua; Tatsumi, Hiroaki; Nishikawa, Hiroshi; Chen, Chih-Ming
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Mechanisms of multidrug resistance caused by an Ipi1 mutation in the fungal pathogen Candida glabrata
err2025-01-25
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errOAAI
errMiyazaki, Taiga; Shimamura, Shintaro; Nagayoshi, Yohsuke; Nakayama, Hironobu; Morita, Akihiro; Tanaka, Yutaka; Matsumoto, Yasuhiko; Inamine, Tatsuo; Nishikawa, Hiroshi; Nakada, Nana; Sumiyoshi, Makoto; Hirayama, Tatsuro; Kohno, Shigeru; Mukae, Hiroshi
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Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition
err2024-10-01
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errOAAI
errLi, Wangyun; Chen, Chuantong; Nishijima, Masahiko; Ueshima, Minoru; Nishikawa, Hiroshi; Suganuma, Katsuaki
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Substrate-Dependent Sintering Mechanism of Ag Nanostructures Derived from Ag-Based Complex
err2024-09-27
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PREAI
errWang, Chuncheng; Tatsumi, Hiroaki; Kotadia, Hiren; Nishikawa, Hiroshi
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Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging
errVACUUM
IF3.9
err2024-09-01
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PREAI
errLi, Wangyun; Mo, Lanqing; Chen, Feng; Dai, Zongbei; Xu, Yiqin; He, Siliang; Nishikawa, Hiroshi
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Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
err2024-07-01
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errOAAI
errLiu, Yang; Chen, Chuantong; Wang, Ye; Zhang, Zheng; Liu, Ran; Ueshima, Minoru; Ota, Ichiro; Nishikawa, Hiroshi; Nishijima, Masahiko; Nakayama, Koji S.; Suganuma, Katsuaki
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