Not logged in.png)
Share.png)
SaveShare Save Digital Etching of Molybdenum Interconnects Using Plasma Oxidation
Erofeev, Ivan; Hartanto, Antony Winata; Khan, Muhaimin Mareum; Deng, Kerong; Kumar, Krishna; Aabdin, Zainul; Tjiu, Weng Weei; Zhang, Mingsheng; Pacco, Antoine; Philipsen, Harold; Chowdhuri, Angshuman Ray; Huynh, Han Vinh; Holsteyns, Frank; Mirsaidov, Utkur Share Save Nanoscale Wet Etching of Molybdenum Interconnects with Organic SolutionsDeng, Kerong; Erofeev, Ivan; Chowdhuri, Angshuman Ray; Philipsen, Harold; Aabdin, Zainul; Hartanto, Antony Winata; Tjiu, Weng Weei; Zhang, Mingsheng; Fernando, Devshan; Saidov, Khakimjon; Kumar, Krishna; Pacco, Antoine; Holsteyns, Frank; Huynh, Han Vinh; Mirsaidov, Utkur Share Save Share Save Controlled Stepwise Wet Etching of Polycrystalline Mo NanowiresSaidov, Khakimjon; Erofeev, Ivan; Aabdin, Zainul; Pacco, Antoine; Philipsen, Harold; Hartanto, Antony Winata; Chen, Yifan; Yan, Hongwei; Tjiu, Weng Weei; Holsteyns, Frank; Mirsaidov, Utkur Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save TSV Cu Plating and Implications for CMPRadisic, A.; Philipsen, H. G. G.; Honore, M.; Wang, Y. S.; Heylen, N.; El-Mekki, Z.; Armini, S.; Vandersmissen, K.; Rodet, S.; Van Ammel, A.; Bender, H.; Drijbooms, C.; Vanstreels, K.; Ruythooren, W. Share Save Share Save Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu SeedArmini, S.; El-Mekki, Z.; Vandersmissen, K.; Philipsen, H.; Rodet, S.; Honore, M.; Radisic, A.; Civale, Y.; Beyne, E.; Leunissen, L. Share Save Share Save 
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}