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刘洋 cover

刘洋 (Yang Liu)

Shangluo University

27H-index
2.3KPaper Count
3.2KCitation Count
Published Papers 50
Publication Date
logo
errCeramics International
IF5.6
err2025-12-05
err0
PREAI
errNuo Cheng; Xiaokai Liu; Wenyu Zhang; Xina Liang; Huiyu Zhang; Hetao Zhao; Jianhang Zhang; Yuanpei Yang; Wenhui Bi; Mingzhen Zhang; Yang Liu; Benshuang Sun; Jilin He
errShare
errSave
errAmerican Journal of Obstetrics and Gynecology
IF8.4
err2025-12-02
err0
PREAI
errDarington Richardson; Courtney S. Lim; Yang Liu; Daniel M. Morgan; Sawsan As-Sanie; Sarah Santiago; Christopher X. Hong; Sara R. Till
errShare
errSave
errCoatings 2025, Vol. 15, Page 1217
IF0
err2025-10-16
err0
errOAAI
errLiu Yang; Shiyuan Li; Hao Peng; Hao Jiang; Yong Wang; Yingping Guan; Hongwang Zhang
errShare
errSave
errPOLYHEDRON
IF2.6
err2025-10-01
err1
PREAI
errYuan, Fei; Liu, Yang; Chen, Yong; Li, Tong; Xu, Zhen-Ning; Qiao, Cheng-Fang; Srivastava, Devyani
errShare
errSave
errMICROELECTRONICS RELIABILITY
IF1.9
err2025-09-01
err0
PREAI
errZhang, Jinlong; Zhang, Chenghao; Pan, Zhen; Li, Chun; Si, Xiaoqing; He, Zongjing; Liu, Yang; Cao, Jian
errShare
errSave
errAdvanced Functional Materials
IF19
err2025-08-13
err0
PREAI
errYingchao Lai; Zhao-Di Yang; Guobin Ren; Wenshan Liu; Yang Liu; Rui Cao; Rui Zhang; Guiling Zhang; Wei Zheng
errShare
errSave
errmaterials science materials in electronics
IF0
err2025-07-28
err0
PREAI
errJun Wang; Liwei Guo; Zehou Li; Xuening Jiang; Tianqi Xue; Jicun Lu; Yang Liu
errShare
errSave
errMechanical Systems and Signal Processing
IF8.9
err2025-07-01
err0
PREAI
errJichuan Cao; Hui Li; Zhaoye Qin; Yang Liu; Haiyang Zhang; Xiangping Wang; Qingkai Han
errShare
errSave
errPhytochemistry
IF3.4
err2025-06-19
err0
PREAI
errWei Su; Xudong Zhou; Hanwen Yuan; Gang Fu; Shiqi Liu; Qingling Xie; Yupei Yang; Kang Zhou; Yang Liu; Bin Li; Wei Wang
errShare
errSave
errJournal of Materials Research and Technology
IF6.6
err2025-06-05
err0
errOAAI
errXiaochun Lv; Zhiyuan Wang; Zhen Pan; Chenghao Zhang; Lin Cao; Fenglian Sun; Yang Liu
errShare
errSave
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-05-01
err1
errOAAI
errLv, Xiaochun; Wang, Zhiyuan; Pan, Zhen; Zhang, Chenghao; Cao, Lin; Sun, Fenglian; Liu, Yang
errShare
errSave
errSTRUCTURE AND INFRASTRUCTURE ENGINEERING
IF2.6
err2025-04-23
err0
PREAI
errHaiping Zhang; Yu Deng; Yuan Cao; Fanghuai Chen; Yuan Luo; Xinhui Xiao; Yang Deng; Yang Liu
errShare
errSave
errMATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
IF4.6
err2025-04-01
err0
PREAI
errChang, Jinyan; Yang, Liu; Hu, Gongwei; Fan, Shuaiwei
errShare
errSave
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
IF2.8
err2025-03-08
err0
PREAI
errLiu, Yang; Jiang, Mengxia; Xia, Yangjing; Zhao, Xuewei; Meng, Fanchen; Li, Nannan; Xing, Chaoyang; Xue, Yuxiong
errShare
errSave
errMATERIALS
IF3.2
err2025-02-16
err0
errOAAI
errLv, Xiaochun; Zhang, Chenghao; Liu, Yang; Pan, Zhen; Wang, Zhiyuan; Sun, Fenglian
errShare
errSave
errCHEMSUSCHEM
IF6.6
err2025-02-09
err1
PREAI
errRehman, Munir Ur; Yin, Rong; Yang, Zhao-Di; Zhang, Guiling; Liu, Yang; Zhang, Feng-Ming; Yu, Cancan; Muhammad, Sheraz
errShare
errSave
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
IF2.8
err2025-02-03
err0
PREAI
errHuang, Huizhen; Huang, Zhufa; Shuai, Gewang; Liu, Yang; Yu, Xinyuan
errShare
errSave
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-01-01
err1
PREAI
errLiu, Yang; Lv, Shiqing; Cui, Qiulang; Xia, Yangjing; Jiang, Mengxia; Lv, Jun; Huang, Mairui; Xue, Yuxiong
errShare
errSave
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-11-01
err0
errOAAI
errZhang, Haiping; Liu, Haojie; Chen, Fanghuai; Luo, Yuan; Xiao, Xinhui; Deng, Yang; Lu, Naiwei; Liu, Yang
errShare
errSave
errJOURNAL OF ENVIRONMENTAL MANAGEMENT
IF8.4
err2024-11-01
err2
PREAI
errLei, Kexin; Zhang, Huaiqing; Qiu, Hanqing; Liu, Yang; Wang, Jiansen; Hu, Xingtao; Cui, Zeyu; Zheng, Dongping
errShare
errSave

Research Directions

半导体封装材料及工艺开发精密焊接及微纳连接器件可靠性及失效物理多物理场仿真模拟数字李生及健康管理学术/社会任职中国焊接学会理事中国焊接协会理事SiC控制器功率模块封装电子封装互联焊点的服役行为及失效规律宽禁带半导体高耐热封装关键材料与技术器件应用第三代半导体SiC功率器件封装模块界面连接材料封装用高可靠无银焊料合金开发，企业委托项目，主持功率器件用高性能铜烧结接头铜颗粒烧结低温键合纳米银焊点微观结构与力学性能演变sintering mechanismAg nanoparticlenanoflakemolecular dynamics simulation低成本多形状烧结复合焊膏高温应用烧结互连强化方法2015至今毕业生去向
Co-authors
Cooperation Journals
A
Ahmad Umar
H-index: 97 · Papers: 980
张羽 cover
张羽 (Yu Zhang)
H-index: 82 · Papers: 967
K
Katsuaki Suganuma
H-index: 73 · Papers: 907
曹
曹睿 (Rui Cao)
H-index: 73 · Papers: 565
张国良 cover
张国良 (Guoliang Zhang)
H-index: 70 · Papers: 697
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