Erping Deng - Publications, H-index & Citations

Erping Deng

Hefei University of Technology

19H指数

81论文数

1.0K被引数

收录论文 24

发表时间

A Dynamic Current Sharing Method for Multichip SiC Power Modules Based on Mutual Couplings 基于互感的动态电流分配方法用于多芯片SiC功率模块

IEEE Transactions on Components Packaging and Manufacturing Technology

IF3

2026-02-01

PREAI

Liu, Xun; Deng, Erping; Gao, Xu; Song, Yifan; Zhang, Xiao; Sun, Yameng; Li, Miao; Zhou, Yang; Ma, Kun; Liu, Sheng

State-of-the-art of Power Cycling Lifetime Models for Power Electronics 功率电子器件功率循环寿命模型的最新研究进展

CHINESE JOURNAL OF ELECTRICAL ENGINEERING

IF3.5

2025-12-01

PREAI

Wang, Weijie; Ren, Bin; Pan, Maoyang; Zhou, Yuhao; Deng, Erping; Huang, Yongzhang

The Solder Layers Degradation of 6.5 kV IGBT Modules for Railway in Power Cycling Tests Considering Moisture Intrusion 考虑湿气侵入的6.5 kV IGBT模块在铁路应用中的功率循环测试下的焊层退化

IEEE Transactions on Power Electronics

IF6.5

2025-10-07

PREAI

Yuxing Yan; Luhong Xie; Erping Deng; Weijie Wang; Qingtong He; Hongyu Sun; Maoyang Pan; Yongzhang Huang

Influence of Moisture Absorption on Power Cycling Capability of IGBT Modules 吸湿对IGBT模块功率循环能力的影响

IEEE Transactions on Power Electronics

IF6.5

2025-08-19

PREAI

Qingtong He; Yuxing Yan; Erping Deng; Luhong Xie; Maoyang Pan; Hao Liu; Yongzhang Huang

An Estimation Method for Lateral Temperature Gradient on Chip Surface of Power Semiconductor Devices 功率半导体器件芯片表面横向温度梯度的估算方法

ieee journal on emerging and selected topics in circuits and systems

IF4.9

2025-06-01

PREAI

Maoyang Pan; Erping Deng; Xia Wang; Yushan Zhao; Hongyu Sun; Yuxing Yan; Yunxia Dong; Yongzhang Huang

Remaining Useful Lifetime Prediction Method of Power Modules Based on the Aging Characteristic Parameters

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2025-01-01

PREAI

Xie, Luhong; Deng, Erping; Gu, Dianjie; Wang, Weijie; Liu, Hao; Zhang, Ying; Huang, Yongzhang

Optimization and Validation of Current Sharing in IGBT Modules With Multichips in Parallel

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2024-12-01

PREAI

Chang, Guiqin; Peng, Cheng; Liu, Yuanjian; Deng, Erping; Li, Xiang; Xiao, Qiang; Huang, Yongzhang

An Alternative Junction-to-Case Thermal Resistance Test Method for High Power Press-Pack IGBTs

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2024-12-01

PREAI

Sun, Hongyu; Sun, Yuan; Deng, Erping; Zhao, Yushan; Li, Weibang; Pan, Maoyang; Liu, Peng; Yan, Yuxing; Huang, Yongzhang

A Multi-Currents Method for Junction Temperature Separation of Cascode GaN

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2024-12-01

PREAI

Wu, Lixin; Deng, Erping; Wang, Yanhao; Xu, Shengqian; Hua, Wenbo; Yang, Shaohua; Ding, Lijian

Study on High Voltage Reverse Bias (HTRB) Test Method of 6.5 kV High-Voltage IGBT Modules for Railway 铁路用6.5 kV高压IGBT模块的高压反向偏置 (HTRB) 测试方法研究

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2024-11-01

PREAI

Yan, Yuxing; Wang, Weijie; Deng, Erping; Wang, Zuoyi; Wang, Yanhao; He, Qingtong; Sun, Hongyu; Huang, Yongzhang

Machine learning to estimate the bond strength of the corroded steel bar-concrete

STRUCTURAL CONCRETE

IF3.3

2023-12-28

PREAI

Wang, Kai-Lai; Li, Jingyi; Li, Li; Deng, E.; Zhang, Yang; Li, Zongli

Thermo-Hygroscopic-Mechanical Coupling Simulation Method for Power Electronics Under Power Cycling Test

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2023-09-01

PREAI

Wang, Yanhao; Deng, Erping; Wu, Tianhua; Zhang, Yiming; Xie, Luhong; Huang, Yongzhang

Difference Between the PWM and Standard DC Power Cycling Tests Based on the Finite-Element Simulation

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2023-07-01

PREAI

Xie, Luhong; Wu, Lixin; Deng, Erping; Zhang, Ying; Zhao, Yushan; Huang, Yongzhang

Advanced Power Cycling Test Integrated With Voltage, Current, Temperature, and Humidity Stress 集成了电压、电流、温度和湿度应力的高级功率循环测试

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2023-06-01

PREAI

Wang, Yanhao; Deng, Erping; Wu, Lixin; Cao, Haiyang; Yan, Yuxing; Zeng, Pin; Zhang, Yiming; Zhao, Yushan; Huang, Yongzhang

Influence of the Uneven Temperature Distribution on the Electrode Warpage of PP IGBTs

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2023-04-01

PREAI

Zhang, Yiming; Deng, Erping; Guo, Jiaqi; Zhao, Zhibin; Zhong, Yan; Zhang, Lei; Tang, Xinling; Cui, Xiang

Influence of Thermal Coupling on Lifetime Under Power Cycling Test

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2022-11-01

PREAI

Zhao, Yushan; Deng, Erping; Pan, Maoyang; Zhang, Yiming; Huang, Yongzhang

Junction-to-Case Thermal Resistance Measurement and Analysis of Press-Pack IGBTs Under Double-Side Cooling Condition

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2022-07-01

PREAI

Chen, Jie; Deng, Erping; Zhang, Yiming; Huang, Yongzhang

Temperature Influence on the Accuracy of the Transient Dual Interface Method for the Junction-to-Case Thermal Resistance Measurement 温度对瞬态双界面法测量结-壳热阻的准确性的影响

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2021-07-01

PREAI

Deng, Erping; Chen, Weinan; Heimler, Patrick; Lutz, Josef

Sequential Vce(T) Method for the Accurate Measurement of Junction Temperature Distribution Within Press-Pack IGBTs

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2021-04-01

PREAI

Zhang, Yiming; Deng, Erping; Zhao, Zhibin; Chen, Jie; Zhao, Yushan; Guo, Jiaqi; Cui, Xiang

Correction of Delay-Time-Induced Maximum Junction Temperature Offset During Electrothermal Characterization of IGBT Devices

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2021-03-01

PREAI

Deng, Erping; Borucki, Ludger; Lutz, Josef

研究方向