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于大全 封面图

于大全 (Daquan Yu)

Xiamen University

28H指数
264论文数
3.5K被引数
收录论文 33
发表时间
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The Influence of Different Nanoscale Channel Lengths in Low-Temperature-Grown Lateral MoS2 Memristors
errACS Applied Materials and Interfaces
IF8.2
err2025-12-01
err0
PREAI
errWang, Danyun; Yu, Daquan; Chen, Hongyu; Zhao, Caiyuan; Chen, Xinyi; Lu, Miao
err分享
err收藏
Degradation Analysis of Integrated Metal–Insulator–Metal Capacitors Due to Recrystallization集成金属-绝缘体-金属电容器因再结晶导致的退化分析
errIEEE Transactions on Electron Devices
IF3.2
err2025-11-03
err0
PREAI
errDongchen Fan; Binbin Jiang; Zeming Tao; Wenbiao Ruan; Jin Zhao; Manyu Wang; Yi Zhong; Daquan Yu
err分享
err收藏
Hybrid Bonding of Nonphotosensitive Dry Films and Cu/SnAg Microbumps for Multilayer Glass Packaging
errIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
IF3
err2025-11-01
err0
PREAI
errZhou, Qing; Tian, Ying; Zhou, Yaqing; Zhong, Yi; Yu, Tian; Zhang, Miao; Yu, Daquan
err分享
err收藏
Heterogeneous Integration Technology Drives the Evolution of Co-Packaged Optics异构集成技术推动共封装光学发展
errMicromachines 2025, Vol. 16, Page 1037
IF3
err2025-10-01
err0
errOAAI
errHan Gao; Wanyi Yan; Dan Zhang; Daquan Yu
err分享
err收藏
High-Q Dual-Mode On-Chip Filter Based on Through Glass Via Technology基于玻璃通孔技术的高Q双模片上滤波器
errIEEE Microwave and Wireless Technology Letters
IF3.4
err2025-08-07
err0
PREAI
errXin Chen; Jing-Yu Lin; Lin Yan; Tian Yu; Miao Zhang; Daquan Yu
err分享
err收藏
Development and Reliability of Wafer-Level SAW Filter Packaging Using Photosensitive Films基于光敏薄膜的晶圆级SAW滤波器封装的开发与可靠性
errIEEE Transactions on Electron Devices
IF3.2
err2025-08-01
err0
PREAI
errWenjiao Pei; Shaocheng Wu; Jiazhe Zhang; Yi Zhong; Weiyi Lin; Dongxue Liang; Rongbin Xu; Daquan Yu
err分享
err收藏
Research on high inductance and quality factor embedded 3D inductors using ultra-high aspect ratio TGV technology
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-06-01
err0
PREAI
errWang, Manyu; Liu, Limin; Hu, Yuwen; Yu, Tian; Huang, Shiwei; Yu, Chen; Zhang, Hengxiang; Luo, Xiao; Chen, Qi; Ruan, Wenbiao; Yu, Daquan
err分享
err收藏
Scaling effect of nanoscale channel on the resistive switching performance of lateral molybdenum disulfide memristors纳米通道尺寸缩放效应对横向二硫化钼忆阻器电阻开关性能的影响
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-05-01
err0
PREAI
errWang, Danyun; Yu, Daquan; Chen, Hongyu; Zhao, Caiyuan; Chen, Xinyi; Lu, Miao
err分享
err收藏
A Review of Wafer-Level Packaging Technology for SAW and BAW Filters
errMICROMACHINES
IF3
err2025-03-11
err0
errOAAI
errLiu, Xinyue; Pei, Wenjiao; Zhao, Jin; Xu, Rongbin; Zhong, Yi; Yu, Daquan
err分享
err收藏
Single crystal diamond polishing assisted by inductively coupled plasma etching单晶金刚石辅助以电感耦合等离子体刻蚀的抛光
errDIAMOND AND RELATED MATERIALS
IF5.1
err2025-02-01
err0
PREAI
errYu, Jiarong; Liu, Xinyue; Xu, Rongbin; Yu, Daquan
err分享
err收藏
A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging
errFUNDAMENTAL RESEARCH
IF6.3
err2024-11-01
err0
errOAAI
errCheng, Lin; Chen, Zuohuan; Yu, Daquan; Pan, Dongfang
err分享
err收藏
Quasi-2D Phonon Transport in Diamond Nanosheet
errADVANCED FUNCTIONAL MATERIALS
IF19
err2024-07-26
err0
PREAI
errZhu, Yunting; Ye, Tian; Wen, Hailang; Xu, Rongbin; Zhong, Yi; Lin, Guangyang; Liang, Dongxue; Cai, Weiwei; Yu, Daquan; Lin, Weiyi
err分享
err收藏
Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers
errJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
IF14.3
err2024-07-01
err4
PREAI
errZhong, Yi; Bao, Shuchao; He, Ran; Jiang, Xiaofan; Zhang, Hengbo; Ruan, Wenbiao; Zhang, Mingchuan; Yu, Daquan
err分享
err收藏
Meta-Biosensor With High Q-Factor Based on Wet Etching for Terahertz Detection
errIEEE SENSORS JOURNAL
IF4.5
err2024-04-01
err3
PREAI
errChen, Xueer; Ye, Longfang; Yu, Daquan
err分享
err收藏
Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnectsRu取代Cu互连的原子层沉积生长行为及机理
errVACUUM
IF3.9
err2024-03-01
err0
PREAI
errWang, Manyu; Wang, Jiahui; Jin, Lei; Yu, Tian; Yu, Daquan
err分享
err收藏
Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces
errSURFACES AND INTERFACES
IF6.3
err2024-03-01
err0
PREAI
errZhou, Shangtong; Jiang, Xiaofan; Zhong, Yi; Yu, Daquan; Cheng, Qijin
err分享
err收藏
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging玻璃通孔 (TGV) 技术在传感器制造和封装中的应用
errSENSORS
IF3.5
err2023-12-28
err12
errOAAI
errYu, Chen; Wu, Shaocheng; Zhong, Yi; Xu, Rongbin; Yu, Tian; Zhao, Jin; Yu, Daquan
err分享
err收藏
Synthesis of 4-in. multilayer molybdenum disulfide via space-confinement thermolysis
errAPPLIED PHYSICS LETTERS
IF3.6
err2023-11-21
err2
PREAI
errLi, Bo; Ye, Tian; Yan, Han; Zhu, Yunting; Bao, Lingjie; Li, Mingpo; Cheng, Qijin; Zhuang, Pingping; Lin, Weiyi; Yu, Daquan
err分享
err收藏
Large-area multilayer molybdenum disulfide for 2D memristors
errMATERIALS TODAY NANO
IF8.2
err2023-08-01
err10
PREAI
errZhuang, Pingping; Yan, Han; Li, Bo; Dou, Chao; Ye, Tian; Zhou, Changjie; Zhu, Huili; Tian, Bo; Chen, Yushan; Lin, Dong; Cai, Weiwei; Yu, Daquan; Liu, Jing; Lin, Weiyi
err分享
err收藏
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
errMICROMACHINES
IF3
err2022-10-21
err14
errOAAI
errZhao, Jin; Chen, Zuohuan; Qin, Fei; Yu, Daquan
err分享
err收藏

研究方向

集成电路封装、微系统集成、微纳器件制造先进电子封装及测试技术（本科生课）
合作学者
合作期刊
C
Chengkuo Lee
H 指数: 112 · 论文数: 958
陈倩 封面图
陈倩 (Qian Chen)
H 指数: 90 · 论文数: 2.2K
陈奇 封面图
陈奇 (Qi Chen)
H 指数: 86 · 论文数: 660
刘黎明 封面图
刘黎明 (Limin Liu)
H 指数: 68 · 论文数: 413
李波 封面图
李波 (Bo Li)
H 指数: 60 · 论文数: 457
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