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E

Emeka H. Amalu

university of teesside

23H指数
81论文数
1.7K被引数
收录论文 14
发表时间
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Moisture ingress evaluation of encapsulation materials using multiphysics modelling for perovskite solar cell packaging钙钛矿太阳能电池封装材料的湿气侵入评估：基于多物理场建模
errNext Materials
IF0
err2026-02-01
err0
errOAAI
errAmalu, Emeka H.; Fabunmi, Oluwagbemiga A.; Hughes, David J.; Short, Michael; Omairey, Eman L.
err分享
err收藏
Critical methods of geopolymer feedstocks activation for suitable industrial applications
errHELIYON
IF3.6
err2024-05-01
err1
errOAAI
errKehinde, Oluyemi; Hughes, David J.; Amalu, Emeka H.
err分享
err收藏
Critical skills needs and challenges for STEM/STEAM graduates increased employability and entrepreneurship in the solar energy sector
errRENEWABLE & SUSTAINABLE ENERGY REVIEWS
IF16.3
err2023-11-01
err5
errOAAI
errAmalu, Emeka H.; Short, Michael; Chong, Perk Lin; Hughes, David J.; Adebayo, David S.; Tchuenbou-Magaia, Fideline; Lahde, Petri; Kukka, Marko; Polyzou, Olympia; Oikonomou, Theoni I.; Karytsas, Constantine; Gebremedhin, Alemayehu; Ossian, Charmant; Ekere, N. N.
err分享
err收藏
Thermal control of crystalline silicon photovoltaic (c-Si PV) module using Docosane phase change material (PCM) for improved performance
errSOLAR ENERGY
IF6.6
err2022-03-01
err42
errOAAI
errAmalu, Emeka H. H.; Fabunmi, Oluwagbemiga A. A.
err分享
err收藏
Effect of Relative Density on Compressive Load Response of Crumpled Aluminium Foil Mesh
errMATERIALS
IF3.2
err2019-12-03
err3
errOAAI
errHughes, David; Amalu, Emeka H.; Pak, Tannaz; Kennedy, Ryan
err分享
err收藏
Generating temperature cycle profile from in-situ climatic condition for accurate prediction of thermo-mechanical degradation of c-Si photovoltaic module
errENGINEERING SCIENCE AND TECHNOLOGY-AN INTERNATIONAL JOURNAL-JESTECH
IF5.4
err2019-04-01
err16
errOAAI
errNyarko, Frank K. A.; Takyi, G.; Amalu, Emeka H.; Adaramola, Muyiwa S.
err分享
err收藏
Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates
errSOLAR ENERGY
IF6.6
err2018-08-01
err69
errOAAI
errOgbomo, Osarumen O.; Amalu, Emeka H.; Ekere, N. N.; Olagbegi, P. O.
err分享
err收藏
Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections
errROBOTICS AND COMPUTER-INTEGRATED MANUFACTURING
IF11.4
err2017-10-01
err58
errOAAI
errZarmai, Musa T.; Ekere, N. N.; Oduoza, C. F.; Amalu, Emeka H.
err分享
err收藏
Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies
errJOURNAL OF MANUFACTURING SYSTEMS
IF14.2
err2016-04-01
err53
PREAI
errAmalu, Emeka H.; Ekere, N. N.
err分享
err收藏
Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method
errFINITE ELEMENTS IN ANALYSIS AND DESIGN
IF3.5
err2015-12-01
err21
PREAI
errAmalu, Emeka H.; Ekere, N. N.; Zarmai, M. T.; Takyi, G.
err分享
err收藏
A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly改进的晶体硅太阳能电池光伏组件组件互连技术综述
errAPPLIED ENERGY
IF11
err2015-09-01
err129
errOAAI
errZarmai, Musa T.; Ekere, N. N.; Oduoza, C. F.; Amalu, Emeka H.
err分享
err收藏
Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling倒装芯片组件中无铅焊点的高温热循环损伤
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2012-12-01
err23
PREAI
errAmalu, Emeka H.; Ekere, N. N.
err分享
err收藏
High temperature reliability of lead-free solder joints in a flip chip assembly倒装芯片组件中无铅焊点的高温可靠性
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2012-02-01
err60
PREAI
errAmalu, Emeka H.; Ekere, Ndy N.
err分享
err收藏
Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process
errMATERIALS & DESIGN
IF7.9
err2011-06-01
err45
PREAI
errAmalu, E. H.; Ekere, N. N.; Mallik, S.
err分享
err收藏

研究方向

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合作学者
合作期刊
M
Muyiwa S. Adaramola
H 指数: 44 · 论文数: 211
D
David J. Hughes
H 指数: 39 · 论文数: 175
D
David Hughes
H 指数: 35 · 论文数: 557
N
N.N. Ekere
H 指数: 31 · 论文数: 180
M
Michael Short
H 指数: 28 · 论文数: 244
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