Muhannad S. Bakir - Publications, H-index & Citations

Muhannad S. Bakir

georgia institute of technology

32H指数

343论文数

4.1K被引数

收录论文 17

发表时间

High-Performance Packaging of RF/mm-Wave Chiplets With 3-D Stitch-Chips (3DSCs)采用3-D Stitch-Chips（3DSCs）的高性能射频/毫米波芯片封装

IEEE Transactions on Components Packaging and Manufacturing Technology

IF3

2026-05-01

PREAI

Oh, Shane; Zhang, Zhonghao; Jo, Paul K.; Baig, Danish A.; Ang, Andre Z.; Park, Hyunggyu; Yan, Geyu; Bakir, Muhannad S.

Board-Level Reliability of 100 100 mm Large Glass Packages: Warpage and Thermomechanical Reliability for AI/HPC Applications 100×100 mm大尺寸玻璃封装的板级可靠性：面向AI/HPC应用的翘曲与热机械可靠性

IEEE Transactions on Components Packaging and Manufacturing Technology

IF3

2026-02-01

PREAI

Lee, Yongwon; Godbole, Kaushik; Park, Hyunggyu; Moon, Kyoung-Sik; Bakir, Muhannad; Sitaraman, Suresh K.

Chiplet Encapsulation and Planarization with 100 μm Deep Gaps Using AlN Powder Spray plus Sputter Hybrid Deposition 使用AlN粉末喷涂与溅射混合沉积技术实现含100 μm深间隙的芯粒封装与平坦化

Advanced Engineering Materials

IF3.3

2026-02-01

PREAI

Go, Dohyun; Victor, Ashita; Wang, Alex; Choi, Mingeun; Song, Hyun Seok; Yun, Seong Uk; Pal, Dipayan; Lee, Ping-Che; Dutta, Jit; Ryu, Jungho; Kumar, Satish; Thompson, Carl V.; Bakir, Muhannad S.; Kummel, Andrew C.

A 32-Channel 85.4 dB SNDR Time-Multiplexed Neural Recording Front-End Achieving Within-Conversion Artifact Recovery 32通道85.4 dB SNDR时分复用神经记录前端，实现转换内伪影恢复

IEEE Journal of Solid-State Circuits

IF5.6

2025-12-17

PREAI

Arindam Mandal; Chi-Hsiang Huang; Julian Arenas; Wei-En Lee; Kevin D. Patino-Sosa; Philip Anschutz; Amanda Jacob; Keshav Ramachandra; Samuel Sober; Muhannad S. Bakir; Shaolan Li; Visvesh S. Sathe

Integrated Microfluidic Cooling of Heterogeneous HBM-GPU Package With Die Height Difference

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

IF3

2025-11-01

PREAI

Chung, Euichul; Bakir, Muhannad S.

Myomatrix arrays for high-definition muscle recording

ELIFE

IF0

2023-12-19

OAAI

Chung, Bryce; Zia, Muneeb; Thomas, Kyle A.; Michaels, Jonathan A.; Jacob, Amanda; Pack, Andrea; Williams, Matthew J.; Nagapudi, Kailash; Teng, Lay Heng; Arrambide, Eduardo; Ouellette, Logan; Oey, Nicole; Gibbs, Rhuna; Anschutz, Philip; Lu, Jiaao; Wu, Yu; Kashefi, Mehrdad; Oya, Tomomichi; Kersten, Rhonda; Mosberger, Alice C.; O'Connell, Sean; Wang, Runming; Marques, Hugo; Mendes, Ana Rita; Lenschow, Constanze; Kondakath, Gayathri; Kim, Jeong Jun; Olson, William; Quinn, Kiara N.; Perkins, Pierce; Gatto, Graziana; Thanawalla, Ayesha; Coltman, Susan; Kim, Taegyo; Smith, Trevor; Binder-Markey, Ben; Zaback, Martin; Thompson, Christopher K.; Giszter, Simon; Person, Abigail; Goulding, Martyn; Azim, Eiman; Thakor, Nitish; O'Connor, Daniel; Trimmer, Barry; Lima, Susana Q.; Carey, Megan R.; Pandarinath, Chethan; Costa, Rui M.; Pruszynski, J. Andrew; Bakir, Muhannad; Sober, Samuel J.

A Compute-in-Memory Hardware Accelerator Design With Back-End-of-Line (BEOL) Transistor Based Reconfigurable Interconnect

IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS

IF3.8

2022-06-01

PREAI

Luo, Yandong; Dutta, Sourav; Kaul, Ankit; Lim, Sung Kyu; Bakir, Muhannad; Datta, Suman; Yu, Shimeng

Integrated Silicon Microfluidic Cooling of a High-Power Overlocked CPU for Efficient Thermal Management

IEEE ACCESS

IF3.6

2022-01-01

OAAI

Rajan, Sreejith Kochupurackal; Ramakrishnan, Bharath; Alissa, Husam; Kim, Washington; Belady, Christian; Bakir, Muhannad S.

Microfabrication, Coil Characterization, and Hermetic Packaging of Millimeter-Sized Free-Floating Neural Probes

IEEE SENSORS JOURNAL

IF4.5

2021-06-15

OAAI

Yeon, Pyungwoo; Rajan, Sreejith Kochupurackal; Falcone, Jessica; Gonzalez, Joe L.; May, Gary S.; Bellamkonda, Ravi V.; Brand, Oliver; Bakir, Muhannad S.; Ghovanloo, Maysam

Designing Surface Chemistry of Silver Nanocrystals for Radio Frequency Circuit Applications

ACS APPLIED MATERIALS & INTERFACES

IF8.2

2018-10-05

PREAI

Oh, Hanju; Lee, Seung-Wook; Kim, Minsoo; Lee, Woo Seok; Seong, Mingi; Joh, Hyungmok; Allen, Mark G.; May, Gary S.; Bakir, Muhannad S.; Oh, Soong Ju

Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2018-06-01

PREAI

Asrar, Pouya; Zhang, Xuchen; Green, Craig E.; Bakir, Muhannad; Joshi, Yogendra K.

Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2017-05-01

OAAI

Nasr, Mohamed H.; Green, Craig E.; Kottke, Peter A.; Zhang, Xuchen; Sarvey, Thomas E.; Joshi, Yogendra K.; Bakir, Muhannad S.; Fedorov, Andrei G.

Probing blood cell mechanics of hematologic processes at the single micron level

LAB ON A CHIP

IF5.4

2017-01-01

PREAI

Ciciliano, Jordan C.; Abbaspour, Reza; Woodall, Julia; Wu, Caroline; Bakir, Muhannad S.; Lam, Wilbur A.

Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2016-12-01

PREAI

Lorenzini, Daniel; Green, Craig; Sarvey, Thomas E.; Zhang, Xuchen; Hu, Yuanchen; Fedorov, Andrei G.; Bakir, Muhannad S.; Joshi, Yogendra

In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation

APPLIED PHYSICS LETTERS

IF3.6

2014-09-19

PREAI

Liu, Xi; Thadesar, Paragkumar A.; Taylor, Christine L.; Oh, Hanju; Kunz, Martin; Tamura, Nobumichi; Bakir, Muhannad S.; Sitaraman, Suresh K.

Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias

APPLIED PHYSICS LETTERS

IF3.6

2013-07-10

OAAI

Liu, X.; Thadesar, P. A.; Taylor, C. L.; Kunz, M.; Tamura, N.; Bakir, M. S.; Sitaraman, S. K.

Introduction to the Issue on Photonic Packaging and Integration Technologies

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

IF5.1

2011-05-01

PREAI

Garcia-Blanco, Sonia M.; Bakir, Muhannad S.; Matthews, Karen I.; Ohashi, Keishi; Horst, Folkert

研究方向