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Mehdi Asheghi

stanford university

51H指数
368论文数
1.1W被引数
收录论文 70
发表时间
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures利用微孔镍反蛋白石结构缓解沸腾诱导的热降解
err2025-12-01
err0
PREAI
errJiang, Kaiying; Kong, Daeyoung; Narumanchi, Sreekant; Palko, James W.; Dede, Ercan M.; Ahn, Chulmin; Lee, Hyoungsoon; Asheghi, Mehdi; Goodson, Kenneth E.
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Development of a Capillary-driven Two-Phase Microcooler using Copper Wiremesh 3D Manifold and Silicon Micropin Fin Wicks基于铜丝网3D manifolds和硅微针肋wicks的毛细驱动两相微冷器开发
err2025-09-01
err0
PREAI
errDaeyoung Kong; Roman Giglio; Muhammad R. Shattique; Qianying Wu; Heungdong Kwon; James W. Palko; Hyoungsoon Lee; Ercan M. Dede; Mehdi Asheghi; Kenneth E. Goodson
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Porous mesh manifold for enhanced boiling performance
err2025-02-01
err0
PREAI
errGiglio, Roman; Shattique, Muhammad R.; Dede, Ercan M.; Narumanchi, Sreekant; Asheghi, Mehdi; Goodson, Kenneth E.; Palko, James W.
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Triply periodic minimal surfaces for thermo-mechanical protection用于热机械保护的三重周期性最小表面
err2025-01-11
err1
errOAAI
errCheung, Samantha; Kang, Jiyun; Lin, Yujui; Goodson, Kenneth E.; Asheghi, Mehdi; Gu, X. Wendy
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Thermal Characterization of Ultrathin MgO Tunnel Barriers
err2024-11-06
err0
PREAI
errSu, Haotian; Kwon, Heungdong; Xue, Fen; Sato, Noriyuki; Bhat, Usha; Tsai, Wilman; Bosman, Michel; Asheghi, Mehdi; Goodson, Kenneth E.; Pop, Eric; Wang, Shan X.
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Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels
err2024-09-01
err1
PREAI
errKong, Daeyoung; Kwon, Heungdong; Jang, Bongho; Kwon, Hyuk-Jun; Asheghi, Mehdi; Goodson, Kenneth E.; Lee, Hyoungsoon
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Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application
err2024-08-01
err5
PREAI
errKwon, Heungdong; Wu, Qianying; Kong, Daeyoung; Hazra, Sougata; Jiang, Kaiying; Narumanchi, Sreekant; Lee, Hyoungsoon; Palko, James W.; Dede, Ercan M.; Asheghi, Mehdi; Goodson, Kenneth E.
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AlN: An Engineered Thermal Material for 3D Integrated CircuitsAlN: 一种用于3D集成电路的工程导热材料
err2024-06-18
err0
PREAI
errVaziri, Sam; Perez, Christopher; Datye, Isha M.; Kwon, Heungdong; Hsu, Chen-Feng; Chen, Michelle E.; Noshin, Maliha; Lee, Tung-Ying; Asheghi, Mehdi; Woon, Wei-Yen; Pop, Eric; Goodson, Kenneth E.; Liao, Szuya S.; Bao, Xinyu
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Probing the Thermal and Electrical Properties of Ultrawide Bandgap Nitrogen-Polar AlGaN Heterostructures探测超宽禁带氮极性AlGaN异质结构的热和电性能
err2024-05-28
err0
PREAI
errNoshin, Maliha; Kwon, Heungdong; Khan, Asir Intisar; Alaei, Sauviz P.; Meng, Chuanzhe; Asheghi, Mehdi; Suzuki, Yuri; Salahuddin, Sayeef; Goodson, Kenneth; Chowdhury, Srabanti
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Boiling-induced thermal degradation of copper inverse opals and its mitigation
err2024-02-01
err6
PREAI
errKong, Daeyoung; Kim, Kiwan; Jung, Euibeen; Jiang, Katherine; Wu, Qianying; Jang, Bongho; Kwon, Hyuk-Jun; Asheghi, Mehdi; Goodson, Kenneth E.; Lee, Hyoungsoon
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Cooling future system-on-chips with diamond inter-tiers
err2023-12-01
err5
errOAAI
errMalakoutian, Mohamadali; Kasperovich, Anna; Rich, Dennis; Woo, Kelly; Perez, Christopher; Soman, Rohith; Saraswat, Devansh; Kim, Jeong-kyu; Noshin, Maliha; Chen, Michelle; Vaziri, Sam; Bao, Xinyu; Shih, Che Chi; Woon, Wei-Yen; Asheghi, Mehdi; Goodson, Kenneth E.; Liao, Szuya Sandy; Mitra, Subhasish; Chowdhury, Srabanti
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High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature
err2023-10-05
err15
PREAI
errPerez, Christopher; Mcleod, Aaron J.; Chen, Michelle E.; Yi, Su-In; Vaziri, Sam; Hood, Ryan; Ueda, Scott T.; Bao, Xinyu; Asheghi, Mehdi; Park, Woosung; Talin, A. Alec; Kumar, Suhas; Pop, Eric; Kummel, Andrew C.; Goodson, Kenneth E.
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Permeability of Single-Layer-Free-Standing Meshes at Varying Capillary Pressure via a Novel Method通过新颖的方法在不同的毛细管压力下单层独立式网格的渗透率
err2023-07-24
err5
errOAAI
errShattique, Muhammad R.; Giglio, Roman; Dede, Ercan M.; Narumanchi, Sreekant; Asheghi, Mehdi; Goodson, Kenneth E.; Palko, James W.
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Energy Efficient Neuro-Inspired Phase-Change Memory Based on Ge4Sb6Te7 as a Novel Epitaxial Nanocomposite
err2023-06-15
err14
PREAI
errKhan, Asir Intisar; Yu, Heshan; Zhang, Huairuo; Goggin, John R.; Kwon, Heungdong; Wu, Xiangjin; Perez, Christopher; Neilson, Kathryn M.; Asheghi, Mehdi; Goodson, Kenneth E.; Vora, Patrick M.; Davydov, Albert; Takeuchi, Ichiro; Pop, Eric
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Parametric design analysis of a multi-level 3D manifolded microchannel cooler via re duce d order numerical modeling
err2022-11-01
err14
PREAI
errHazra, Sougata; Wei, Tiwei; Lin, Yujui; Asheghi, Mehdi; Goodson, Kenneth; Gupta, Man Prakash; Degner, Michael
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A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks一种预测微针鳍散热器传热特性的机器学习方法
err2022-09-01
err59
PREAI
errKim, Kiwan; Lee, Haeun; Kang, Minsoo; Lee, Geonhee; Jung, Kiwook; Kharangate, Chirag R.; Asheghi, Mehdi; Goodson, Kenneth E.; Lee, Hyoungsoon
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Dominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films
err2022-08-28
err7
errOAAI
errPerez, Christopher; Jog, Atharv; Kwon, Heungdong; Gall, Daniel; Asheghi, Mehdi; Kumar, Suhas; Park, Woosung; Goodson, Kenneth E.
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Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance揭示超晶格界面和混合对相变存储器性能的影响
err2022-07-25
err26
PREAI
errKhan, Asir Intisar; Wu, Xiangjin; Perez, Christopher; Won, Byoungjun; Kim, Kangsik; Ramesh, Pranav; Kwon, Heungdong; Tung, Maryann C.; Lee, Zonghoon; Oh, Il-Kwon; Saraswat, Krishna; Asheghi, Mehdi; Goodson, Kenneth E.; Wong, H. -S. Philip; Pop, Eric
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