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Chuantong Chen

University of Osaka

39H指数
355论文数
4.5K被引数
收录论文 63
发表时间
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Real-time detection of fracture mode at the direct bonded Chevron-notch Si chip via acoustic emission通过声发射对直接键合的V形缺口Si芯片的断裂模式进行实时检测
errMicroelectronics Reliability
IF1.9
err2026-02-01
err0
PREAI
errLee, Sangmin; Chen, Chuantong; Nishijima, Masahiko; Katsura, Akihiro; Nakagiri, Takuya; Kim, Juno; Lee, Jung Shin; Rhee, Minwoo Daniel; Suganuma, Katsuaki
err分享
err收藏
Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering在200 °C以下通过多溶剂协同工程实现铜浆料的无压烧结连接
errSurfaces and Interfaces
IF6.3
err2025-10-15
err0
PREAI
errDou Xu; Su Ding; Haidong Yan; Chuantong Chen; Lei Su; Ke Li; Wanli Li
err分享
err收藏
TOPSIS optimization of solvent modulated pressureless submicron sintered silver for power electronics溶剂调制无压亚微米烧结银的TOPSIS优化用于电力电子领域
errMaterials Today Communications
IF4.5
err2025-09-01
err0
PREAI
errXinyue Wang; Haixue Chen; Zhoudong Yang; Wenting Liu; Guoqi Zhang; Jing Zhang; Chuangtong Chen; Pan Liu
err分享
err收藏
Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging表面驱动应力辅助的快速大面积银多孔片键合用于功率电子封装
errJournal of Materials Science & Technology
IF14.3
err2025-08-21
err0
errOAAI
errChuantong Chen; Luobin Zhang; Fupeng Huo; Minoru Ueshima; Yutai Su; Xu Long; Koji S Nakayama; Masahiko Nishijima; Hiroaki Miyake; Mingyu Li; Katsuaki Suganuma
err分享
err收藏
Copper-based composite sintering materials and reliability analysis for power electronics packaging铜基复合烧结材料及其在电力电子封装中的可靠性分析
errscience advanced materials and devices
IF0
err2025-08-05
err0
errOAAI
errXinyue Wang; Zhoudong Yang; Letao Bian; Wenting Liu; Guoqi Zhang; Jing Zhang; Chuantong Chen; Pan Liu
err分享
err收藏
Study on sintering parameters and bonding mechanism of Cu@Ag preform via electromagnetic compaction for power electronics电磁压实法制备Cu@Ag预制件烧结参数与结合机制研究——用于电力电子领域
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-05-01
err0
PREAI
errLiu, Li; Wang, Qian; Robertson, Stuart; Chen, Chuantong; Liu, Changqing; Zhou, Zhaoxia; Tuo, Chengjiong; Ma, Haojie; Nong, Liting; Cao, Xueqiang; Chen, Zhiwen
err分享
err收藏
Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability180 °C下采用Ag烧结膏制备的低温Al/AlN接头：界面形成与接头可靠性
errCERAMICS INTERNATIONAL
IF5.6
err2025-01-01
err0
errOAAI
errChen, Chuantong; Liu, Li; Huo, Fupeng; Kim, Dongjin; Lee, Sangmin; Li, Wanli; Suganuma, Katsuaki
err分享
err收藏
Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-12-01
err0
errOAAI
errZhang, Zheng; Hsieh, Ming-Chun; Nishijima, Masahiko; Suetake, Aiji; Yoshida, Hiroshi; Okumuara, Rieko; Chen, Chuantong; Seto, Hiroki; Hashizume, Kei; Kitahara, Yuhei; Nagamura, Haruki; Suganuma, Katsuaki
err分享
err收藏
Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2024-11-01
err0
PREAI
errLee, Sangmin; Baek, Seungyeop; Lee, Seung-Joon; Chen, Chuantong; Nishijima, Masahiko; Suganuma, Katsuaki; Utsunomiya, Hiroshi; Ma, Ninshu; Yu, Ha-Young; Kim, Dongjin
err分享
err收藏
Microstructure characteristics for improved thermal shock reliability of sintered Ag-Al - Al paste in SiC power module
errMATERIALS CHARACTERIZATION
IF5.5
err2024-11-01
err0
errOAAI
errHuo, Fupeng; Chen, Chuantong; Zhang, Zheng; Suetake, Aiji; Zhang, Yicheng; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki
err分享
err收藏
Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition通过添加ag-si雾化颗粒调节热膨胀系数提高Ag膏烧结接头的休克可靠性
errMATERIALS & DESIGN
IF7.9
err2024-10-01
err0
errOAAI
errLi, Wangyun; Chen, Chuantong; Nishijima, Masahiko; Ueshima, Minoru; Nishikawa, Hiroshi; Suganuma, Katsuaki
err分享
err收藏
Metastable phases of Ag-Si: amorphous Si and Ag-nodule mediated bonding
errSCIENTIFIC REPORTS
IF3.9
err2024-09-03
err0
errOAAI
errNakayama, Koji S.; Nishijima, Masahiko; Zhang, Yicheng; Chen, Chuantong; Ueshima, Minoru; Suganuma, Katsuaki
err分享
err收藏
Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability通过在管芯和散热器上进行微米尺寸的Ag膏烧结连接来开发SiC功率模块结构，以实现低热阻和出色的功率循环可靠性
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2024-09-01
err4
errOAAI
errChen, Chuantong; Suetake, Aiji; Huo, Fupeng; Kim, Dongjin; Zhang, Zheng; Hsieh, Ming-Chun; Li, Wanli; Wakasugi, Naoki; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki
err分享
err收藏
Temperature and thickness-dependent silver hillock generation mechanism and surface morphology nature of direct plated silver layers onto copper substrates铜基板上直接镀银层的温度和厚度相关的银丘产生机理和表面形态性质
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2024-08-01
err1
PREAI
errKim, YehRi; Kim, Seoah; Zhang, Zheng; Chen, Chuantong; Suganuma, Katsuaki; Ju, Byeong Kwon; Kim, Dongjin
err分享
err收藏
Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulationSiC功率器件超高耐热休克试验Ag @ Si复合烧结接头的研制: 实验验证与数值模拟
errCOMPOSITES PART B-ENGINEERING
IF14.2
err2024-07-01
err2
errOAAI
errLiu, Yang; Chen, Chuantong; Wang, Ye; Zhang, Zheng; Liu, Ran; Ueshima, Minoru; Ota, Ichiro; Nishikawa, Hiroshi; Nishijima, Masahiko; Nakayama, Koji S.; Suganuma, Katsuaki
err分享
err收藏
Effects of high temperature and high humidity on the reliability of copper/ epoxy bond高温高湿对铜/环氧树脂粘接可靠性的影响
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-07-01
err2
PREAI
errZhao, Shuaijie; Chen, Chuantong; Nishijima, Masahiko; Okumura, Rieko; Haga, Motoharu; Ueshima, Minoru; Suzuki, Hirose; Takenaka, Hiroto; Suganuma, Katsuaki
err分享
err收藏
Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-07-01
err0
errOAAI
errHuo, Fupeng; Chen, Chuantong; Zhang, Zheng; Zhang, Yicheng; Suetake, Aiji; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Zhang, Keke; Suganuma, Katsuaki
err分享
err收藏
Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-05-01
err3
errOAAI
errZhao, Shuaijie; Chen, Chuantong; Liang, Hang; Wang, Shuohan; Kimura, Fuminobu; Kajihara, Yusuke
err分享
err收藏
Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
errMATERIALS & DESIGN
IF7.9
err2024-04-01
err3
errOAAI
errHuo, Fupeng; Chen, Chuantong; Zhang, Zheng; Wang, Ye; Suetake, Aiji; Takeshita, Kazutaka; Yamaguchi, Yoshiji; Momose, Yashima; Suganuma, Katsuaki
err分享
err收藏
Effect of thermal-mechanical conditions on strength of silanized Al alloy/ CFRTP hybrid joint made by thinning-controlled hot pressing
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2024-03-01
err2
PREAI
errLi, Weihao; Geng, Peihao; Ma, Ninshu; Chen, Chuantong
err分享
err收藏

研究方向

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