arrow
返回
M

M. Honoré

interuniversity microelectronics centre

10H指数
40论文数
322被引数
收录论文 5
发表时间
TSV Cu Plating and Implications for CMP
err2011-04-25
err1
PREAI
errRadisic, A.; Philipsen, H. G. G.; Honore, M.; Wang, Y. S.; Heylen, N.; El-Mekki, Z.; Armini, S.; Vandersmissen, K.; Rodet, S.; Van Ammel, A.; Bender, H.; Drijbooms, C.; Vanstreels, K.; Ruythooren, W.
err分享
err收藏
Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed
err2011-01-01
err41
PREAI
errArmini, S.; El-Mekki, Z.; Vandersmissen, K.; Philipsen, H.; Rodet, S.; Honore, M.; Radisic, A.; Civale, Y.; Beyne, E.; Leunissen, L.
err分享
err收藏
An optimized process for the production of advanced planar wire grid plates as detectors for high energy physics experiments
err2001-08-01
err0
PREAI
errIacopi, F; Devroede, O; Pins, R; Van Hoof, R; Honoré, M; Zhukov, V; Van Lancker, L; Van Doninck, W; Beyne, E
err分享
err收藏
Development of a disposable probe for the evaluation of acid-induced damage of the oesophageal mucosa
err1999-10-01
err4
PREAI
errHuyberechts, G; Honoré, M; Van Overstraeten, R; Vantrappen, G; Janssens, J; Sifrim, D; Mebis, J; Geboes, K
err分享
err收藏