Eric Beyne - Publications, H-index & Citations

Eric Beyne

interuniversity microelectronics centre

50H指数

859论文数

1.2W被引数

收录论文 21

发表时间

Challenges and Mitigations of Microbumps Pitch Scaling for Chiplet Applications 微凸点间距缩放应用于芯片级封装的挑战与缓解措施

IEEE Transactions on Components Packaging and Manufacturing Technology

IF3

2026-01-01

PREAI

Derakhshandeh, Jaber; Beyne, Eric; Cochet, Tom; Cherman, Vladimir; Dangol, Anish; Cuypers, Dieter H.; Vaquilar, Aldrin; Rip, Jens; Slabbekoorn, John; Hiro, Akito; Dhakras, Prathamesh; Ceulemans, Karl; Hussain, Tassawar; Suhard, Samuel; Beyer, Gerald

Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density 混合粘接界面中不同金属接触密度下粘附强度的定量评估

Microelectronic Engineering

IF3.1

2025-07-23

PREAI

Kris Vanstreels; Oguzhan Orkut Okudur; Mario Gonzalez; Eric Beyne

Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2022-01-01

PREAI

Wei, Tiwei; Oprins, Herman; Fang, Liang; Cherman, Vladimir; Beyne, Eric; Baelmans, M.

Characterization of through-silicon vias using laser terahertz emission microscopy 使用激光太赫兹发射显微镜表征硅通孔

NATURE ELECTRONICS

IF40.9

2021-03-24

PREAI

Jacobs, Kristof J. P.; Murakami, Hironaru; Murakami, Fumikazu; Serita, Kazunori; Beyne, Eric; Tonouchi, Masayoshi

Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy

IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT

IF5.9

2021-01-01

OAAI

Jacobs, Kristof J. P.; Stucchi, Michele; Beyne, Eric

Nozzle scaling effects for the thermohydraulic performance of microjet impingement cooling with distributed returns

APPLIED THERMAL ENGINEERING

IF6.9

2020-11-01

PREAI

Wei, T. -W.; Oprins, H.; Fang, Liang; Cherman, V.; De Wolf, I.; Beyne, E.; Baelmans, M.

Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

JOURNAL OF MANUFACTURING PROCESSES

IF6.8

2020-10-01

PREAI

Inoue, Fumihiro; Podpod, Arnita; Peng, Lan; Phommahaxay, Alain; Rebibis, Kenneth June; Uedono, Akira; Beyne, Eric

Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering

SCIENTIFIC REPORTS

IF3.9

2019-10-16

OAAI

Hou, Lin; Moelans, Nele; Derakhshandeh, Jaber; De Wolf, Ingrid; Beyne, Eric

High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2019-07-01

OAAI

Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Qian, Jun; De Wolf, Ingrid; Beyne, Eric; Baelmans, Martine

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

APPLIED THERMAL ENGINEERING

IF6.9

2019-04-01

OAAI

Wei, T-W; Oprins, H.; Cherman, V; Van der Plas, G.; De Wolf, I; Beyne, E.; Baelmans, M.

Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy

APPLIED PHYSICS LETTERS

IF3.6

2018-02-14

PREAI

Jacobs, K. J. P.; Stucchi, M.; Afanas'ev, V. V.; Gonzalez, M.; Croes, K.; De Wolf, I.; Beyne, E.

Physics of self-aligned assembly at room temperature

PHYSICS OF FLUIDS

IF4.3

2018-01-17

PREAI

Dubey, V.; Beyne, E.; Derakhshandeh, J.; De Wolf, I.

Influence of Si wafer thinning processes on (sub)surface defects

APPLIED SURFACE SCIENCE

IF6.9

2017-05-01

PREAI

Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric; Uedono, Akira

Hydrogen outgassing induced liner/barrier reliability degradation in through silicon via's

APPLIED PHYSICS LETTERS

IF3.6

2014-04-07

OAAI

Li, Yunlong; Oba, Yoshiyuki; Wu, Chen; Van Huylenbroeck, Stefaan; Van Besien, Els; Vereecke, Guy; Stucchi, Michele; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric; Croes, Kristof

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

JOURNAL OF MATERIALS SCIENCE

IF3.9

2011-02-01

PREAI

Okoro, Chukwudi; Labie, Riet; Vanstreels, Kris; Franquet, Alexis; Gonzalez, Mario; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert

Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2011-01-01

PREAI

Armini, S.; El-Mekki, Z.; Vandersmissen, K.; Philipsen, H.; Rodet, S.; Honore, M.; Radisic, A.; Civale, Y.; Beyne, E.; Leunissen, L.

3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot

PROCEEDINGS OF THE IEEE

IF25.9

2009-01-01

217

PREAI

Marchal, Paul; Bougard, Bruno; Katti, Guruprasad; Stucchi, Michele; Dehaene, Wim; Papanikolaou, Antonis; Verkest, Diederik; Swinnen, Bart; Beyne, Eric

An optimized process for the production of advanced planar wire grid plates as detectors for high energy physics experiments

SENSORS AND ACTUATORS A-PHYSICAL

IF4.9

2001-08-01

PREAI

Iacopi, F; Devroede, O; Pins, R; Van Hoof, R; Honoré, M; Zhukov, V; Van Lancker, L; Van Doninck, W; Beyne, E

Chip-package codesign of a low-power 5-GHz RF front end

PROCEEDINGS OF THE IEEE

IF25.9

2000-10-01

PREAI

Donnay, S; Pieters, P; Vaesen, K; Diels, W; Wambacq, P; De Raedt, W; Beyne, E; Engels, M; Bolsens, I

Electrical field induced ageing of polymer light-emitting diodes in an oxygen-rich atmosphere studied by emission microscopy, scanning electron microscopy and secondary ion mass spectroscopy

SYNTHETIC METALS

IF4.6

1998-07-01

PREAI

Bijnens, W; De Wolf, I; Manca, J; D'Haen, J; Wu, TD; D'Olieslaeger, M; Beyne, E; Kiebooms, R; Vanderzande, D; Gelan, J; De Ceuninck, W; De Schepper, L; Stals, LM

研究方向