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Y

Y.C. Chan

City University of Hong Kong

43H指数
253论文数
5.6K被引数
收录论文 40
发表时间
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Embedding Antiperovskite Nanophases into Polymer Hosts Boosts Ionic Conductivity and Interfacial Compliance for All-Solid-State Lithium Metal Batteries将反钙钛矿纳米相嵌入聚合物基质中，可提升全固态锂金属电池的离子电导率和界面柔韧性。
errJ. Mater. Chem. A
IF9.5
err2025-11-18
err0
PREAI
errBingni Gu; Luc-Phuong-Nhu Tran; Zih-Siyuan Lin; Yo-Shun Chen; Shih-Ming Lin; Yu-Ting Chen; Yang-Hsin Shih; Yun-Shuo Chan; Shu-Chi Wu; Kai-Siang Jhang; Hsing-Yu Tuan; Yu-Lun Chueh
err分享
err收藏
Electromigration-induced microstructure evolution and failure mechanism of sintered nano-Ag joint
errMATERIALS CHARACTERIZATION
IF5.5
err2023-11-01
err3
PREAI
errJin, Zhi; Huo, Fupeng; Wang, Jianhao; Liu, Xunda; Chan, Y. C.; Nishikawa, Hiroshi
err分享
err收藏
Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods
errSCIENTIFIC REPORTS
IF3.9
err2021-04-21
err2
errOAAI
errJin, Zhi; Shen, Yu-An; Zuo, Yang; Chan, Y. C.; Mannan, S. H.; Nishikawa, Hiroshi
err分享
err收藏
Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition
errJOURNAL OF MATERIALS SCIENCE
IF3.9
err2021-02-19
err9
PREAI
errJin, Zhi; Shen, Yu-An; Huo, Fupeng; Chan, Y. C.; Nishikawa, Hiroshi
err分享
err收藏
Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing电流应力下Cu/In-48Sn/Cu焊料互连中的相偏析，界面金属间生长和电迁移引起的失效
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2016-07-01
err41
PREAI
errLi, Yi; Lim, Adeline B. Y.; Luo, Kaiming; Chen, Zhong; Wu, Fengshun; Chan, Y. C.
err分享
err收藏
Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2016-02-01
err33
PREAI
errSun, Huayu; Chan, Y. C.; Wu, Fengshun
err分享
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Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2016-01-01
err117
errOAAI
errChen, Guang; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y. C.
err分享
err收藏
Effect of TiO2 nanoparticle addition on electroless Ni-P under bump metallization for lead-free solder interconnection
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2014-04-01
err31
errOAAI
errHu, Xiao; Xu, Sha; Yang, Ying; Chen, Zhong; Chan, Y. C.
err分享
err收藏
Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2013-12-01
err80
PREAI
errHu, Xiao; Chan, Y. C.; Zhang, Kaili; Yung, K. C.
err分享
err收藏
The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness Of Sn-Ag-Cu solder on OSP-Cu pads
errINTERMETALLICS
IF4.8
err2012-10-01
err57
PREAI
errGain, Asit Kumar; Chan, Y. C.
err分享
err收藏
Frequency-tunable soft composite antennas for wireless sensing
errSENSORS AND ACTUATORS A-PHYSICAL
IF4.9
err2012-06-01
err29
PREAI
errTang, Qing-Yuan; Pan, Yong-Mei; Chan, Y. C.; Leung, K. W.
err分享
err收藏
Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films
errSENSORS AND ACTUATORS B-CHEMICAL
IF7.7
err2011-02-01
err129
PREAI
errTang, Qing-Yuan; Chan, Y. C.; Zhang, Kaili
err分享
err收藏
Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2011-02-01
err69
PREAI
errFouzder, Tama; Shafiq, Ismathullakhan; Chan, Y. C.; Sharif, A.; Yung, Winco K. C.
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err收藏
Effect of carbon nanotubes and their dispersion on thermal curing of polyimide precursors碳纳米管及其分散性对聚酰亚胺前驱体热固化的影响
errPOLYMER DEGRADATION AND STABILITY
IF7.4
err2010-09-01
err20
PREAI
errTang, Qing-Yuan; Chen, Jie; Chan, Y. C.; Chung, C. Y.
err分享
err收藏
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages
errPROGRESS IN MATERIALS SCIENCE
IF40
err2010-07-01
err246
PREAI
errChan, Y. C.; Yang, D.
err分享
err收藏
Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and properties of Sn-8Zn-3Bi solder on Au/Ni/Cu pads
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2010-01-01
err29
PREAI
errGain, Asit Kumar; Fouzder, Tama; Chan, Y. C.; Sharif, Ahmed; Yung, Winco K. C.
err分享
err收藏
Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy少量Al和Cu对Sn-9Zn二元共晶钎料组织、显微硬度和拉伸性能的影响
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2009-07-01
err62
PREAI
errDas, S. K.; Sharif, A.; Chan, Y. C.; Wong, N. B.; Yung, W. K. C.
err分享
err收藏
Effects of ZrO2 nanoparticles on the mechanical properties of Sn-Zn solder joints on Au/Ni/Cu pads
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2009-05-01
err73
PREAI
errShen, J.; Chan, Y. C.
err分享
err收藏
Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn-Ag-Cu solder and a Cu layer
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2009-05-01
err58
PREAI
errShen, J.; Chan, Y. C.
err分享
err收藏
Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages
errMATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
IF4.6
err2009-05-01
err59
PREAI
errGain, Asit Kumar; Chan, Y. C.; Yung, Winco K. C.
err分享
err收藏

研究方向

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合作学者
合作期刊
陈钟 封面图
陈钟 (Zhong Chen)
H 指数: 104 · 论文数: 1.2K
K
K. N. Tu
H 指数: 81 · 论文数: 651
K
Kaili Zhang
H 指数: 78 · 论文数: 585
Y
Yu‐Lun Chueh
H 指数: 75 · 论文数: 575
K
K. N. Tu
H 指数: 61 · 论文数: 206
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