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J

J.K. Kivilahti

Aalto University

42H指数
224论文数
6.1K被引数
收录论文 8
发表时间
Simulation of dynamic recrystallization in solder interconnections during thermal cycling
err2010-12-01
err27
PREAI
errLi, J.; Xu, H.; Mattila, T. T.; Kivilahti, J. K.; Laurila, T.; Paulasto-Krockel, M.
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Amorphous layer formation at the TaC/Cu interface in the Si/TaC/Cu metallization system
err2002-02-11
err28
PREAI
errLaurila, T; Zeng, KJ; Kivilahti, JK; Molarius, J; Suni, I
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