arrow
返回
K

Kimmo Henttinen

机构信息待补充

13H指数
64论文数
710被引数
收录论文 5
发表时间
Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging用于先进芯片级封装的硅基贯穿晶片互连的制造
err2008-03-01
err16
PREAI
errJi, Fan; Leppaedvuori, Eppo; Luusua, Ismo; Hentfinen, Kimmo; Eraenen, Simo; Hietanen, Hro; Juntunen, Mikko
err分享
err收藏
Microwave-cut silicon layer transfer
err2005-11-22
err14
PREAI
errThompson, DC; Alford, TL; Mayer, JW; Hochbauer, T; Nastasi, M; Lau, SS; Theodore, ND; Henttinen, K; Suni, I; Chu, PK
err分享
err收藏
Silicon layer transfer using plasma hydrogenation
err2005-09-08
err10
PREAI
errChen, P; Lau, SS; Chu, PK; Henttinen, K; Suni, T; Suni, I; Theodore, ND; Alford, TL; Mayer, JW; Shao, L; Nastasi, M
err分享
err收藏
Photocurrent method for characterizing the interface of hydrophobically bonded Si wafers
err2003-02-10
err7
PREAI
errYu, LS; Mages, P; Qiao, D; Jia, L; Yu, PKL; Lau, SS; Suni, T; Henttinen, K; Suni, I
err分享
err收藏