logo
科言猫学术研究的AI总结
language
手机端手机端
  • Phone Feature微信小程序
简体中文简体中文
notice消息通知
博客博客
delete
arrow
返回
H

Hyunseop Lee

department of mechanical engineering

23H指数
158论文数
2.0K被引数
收录论文 6
发表时间
logo
Precision Engineering and Intelligent Technologies for Predictable CMP精密工程与智能技术用于可预测的化学机械抛光
errInternational Journal of Precision Engineering and Manufacturing
IF3.6
err2025-10-01
err0
PREAI
errSomin Shin; Hyun Jun Ryu; Sanha Kim; Haedo Jeong; Hyunseop Lee
err分享
err收藏
Prediction of Normalized Material Removal Rate Profile Based on Deep Neural Network in Five-Zone Carrier Head CMP System基于深度神经网络在五区承载头化学机械抛光(CMP)系统中对归一化材料去除率剖面的预测
errINTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY
IF5.6
err2025-02-18
err0
PREAI
errCho, Yonsang; Kim, Myeongjun; Hong, Munyoung; Han, Joocheol; Kim, Hong Jin; Kim, Hyunki; Lee, Hyunseop
err分享
err收藏
An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation
errLUBRICANTS
IF2.9
err2023-07-16
err0
errOAAI
errHwang, Haeseong; Han, Seungho; Lee, Hyunseop
err分享
err收藏
Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction
errMICROMACHINES
IF3
err2020-09-08
err13
errOAAI
errSon, Jungyu; Lee, Hyunseop
err分享
err收藏
Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)不锈钢304 (SS304) 流化床化学机械抛光 (fb-cmp) 工艺的初步研究
errMICROMACHINES
IF3
err2020-07-21
err9
errOAAI
errKim, Taekyoung; Lee, Hyunseop
err分享
err收藏
Study on Coagulation Kinetics of Disk-like Particles under Simple Shear Flow
errLANGMUIR
IF3.9
err2019-12-10
err3
PREAI
errLee, Hyunseop; Kim, Chongyoup
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
H
Hyunki Kim
H 指数: 50 · 论文数: 568
H
Haedo Jeong
H 指数: 30 · 论文数: 223
S
Sanha Kim
H 指数: 22 · 论文数: 109
T
Taekyoung Kim
H 指数: 12 · 论文数: 50
S
Seung Ho Han
H 指数: 10 · 论文数: 70
查看更多