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Firas Alshatnawi

state university of new york

7H指数
16论文数
146被引数
收录论文 5
发表时间
Multichip SiC Power Module Packaging Using Direct Ink Writing使用直接墨水书写技术的多芯片SiC功率模块封装
err2025-01-01
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errOAAI
errRiadh Al-Haidari; Dylan Richmond; Mohammed Alhendi; El Mehdi Abbara; Abdullah Obeidat; Firas Alshatnawi; Mark Schadt; Mark Poliks; Arun V. Gowda; Jeff Erlbaum; Han Xiong; Collin Hitchcock
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High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications
err2024-06-01
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PREAI
errAlshatnawi, Firas; Enakerakpo, Emuobosan; Alhendi, Mohammed; Abdelatty, Mohamed; Umar, Ashraf; Al-Haidari, Riadh; Shaddock, David; Hoel, Cathleen; Boyd, Linda; Poliks, Mark; Borgesen, Peter
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Additive Manufacturing of High-Temperature Hybrid Electronics via Molecular-Decomposed Metals
err2023-10-20
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errOAAI
errKhuje, Saurabh; Alshatnawi, Firas; Smilgies, Detlef; Alhendi, Mohammed; Islam, Abdullah; Armstrong, Jason; Yu, Jian; Poliks, Mark; Ren, Shenqiang
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Electrical and Mechanical Behavior of Aerosol Jet-Printed Gold on Alumina Substrate for High-Temperature Applications用于高温应用的气溶胶喷射印刷在氧化铝基材上的金的电气和机械性能
err2023-07-28
err5
errOAAI
errAlshatnawi, Firas; Alhendi, Mohammed; Abbara, El Mehdi; Sivasubramony, Rajesh; Garakani, Behnam; Enakerakpo, Emuobosan; Shaddock, David; Stoffel, Nancy; Hoel, Cathleen; Poliks, Mark D.; Borgesen, Peter
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Printed electronics for extreme high temperature environments
err2022-06-01
err37
errOAAI
errAlhendi, Mohammed; Alshatnawi, Firas; Abbara, El Mehdi; Sivasubramony, Rajesh; Khinda, Gurvinder; Umar, Ashraf I.; Borgesen, Peter; Poliks, Mark D.; Shaddock, David; Hoel, Cathleen; Stoffel, Nancy; Lam, Tommyhing-K. H.
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